Patent
   D594424
Priority
Jul 12 2007
Filed
Jul 12 2007
Issued
Jun 16 2009
Expiry
Jun 16 2023
Assg.orig
Entity
unknown
1
7
n/a
The ornamental design for a wafer carrier, as shown and described.

FIG. 1 is a perspective view of a wafer carrier showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view to that shown.

The broken line showing portion of the wafer carrier is for illustrative purposes only and forms no part of the claimed design.

Lin, Cheng-Feng, Lee, Tsang-Chou

Patent Priority Assignee Title
D749531, Jun 09 2014 GUDENG PRECISION INDUSTRIAL CO., LTD. Diffusion assembly for front opening unified pod
Patent Priority Assignee Title
5909994, Nov 18 1996 Applied Materials, Inc. Vertical dual loadlock chamber
6132160, Jun 27 1997 Tokyo Electron Limited Substrate transferring apparatus
6777964, Jan 25 2002 Cascade Microtech, INC Probe station
7420381, Sep 13 2004 Cascade Microtech, INC Double sided probing structures
20040100297,
20080236755,
D571740, Aug 12 2005 Tokyo Electron Limited Semiconductor wafer delivery apparatus
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Jul 09 2007LIN, CHENG-FENGHIWIN MIKROSYSTEM CORP ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0195450117 pdf
Jul 09 2007LEE, TSANG-CHOUHIWIN MIKROSYSTEM CORP ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0195450117 pdf
Jul 12 2007HIWIN MIKROSYSTEM CORP.(assignment on the face of the patent)
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