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Patent
D594424
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Priority
Jul 12 2007
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Filed
Jul 12 2007
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Issued
Jun 16 2009
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Expiry
Jun 16 2023
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Assg.orig
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Entity
unknown
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1
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7
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n/a
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The ornamental design for a wafer carrier, as shown and described.
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FIG. 1 is a perspective view of a wafer carrier showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view to that shown.
The broken line showing portion of the wafer carrier is for illustrative purposes only and forms no part of the claimed design.
Lin, Cheng-Feng, Lee, Tsang-Chou
Patent |
Priority |
Assignee |
Title |
5909994, |
Nov 18 1996 |
Applied Materials, Inc. |
Vertical dual loadlock chamber |
6132160, |
Jun 27 1997 |
Tokyo Electron Limited |
Substrate transferring apparatus |
6777964, |
Jan 25 2002 |
Cascade Microtech, INC |
Probe station |
7420381, |
Sep 13 2004 |
Cascade Microtech, INC |
Double sided probing structures |
20040100297, |
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20080236755, |
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D571740, |
Aug 12 2005 |
Tokyo Electron Limited |
Semiconductor wafer delivery apparatus |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a