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Patent
D607424
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Priority
Mar 30 2006
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Filed
Oct 02 2006
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Issued
Jan 05 2010
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Expiry
Jan 05 2024
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Assg.orig
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Entity
unknown
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2
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13
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n/a
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The ornamental design for a wafer carrying-in/out apparatus or the like, as shown and described.
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FIG. 1 is a top plan view of a wafer carrying-in/out apparatus or the like, showing our new design;
FIG. 2 is a left side elevational view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a top, front and right side perspective view thereof;
FIG. 8 is a top, front and right side perspective view thereof shown when the doors thereof have been opened;
FIG. 9 is a front elevational view thereof shown with the windows thereof installed;
FIG. 10 is a left side elevational view thereof; and,
FIG. 11 is a rear elevational view thereof.
The features shown in broken lines in the drawings form no part of the claimed design.
Akiyama, Shuji, Hosaka, Hiroki, Obikane, Tadashi
Patent |
Priority |
Assignee |
Title |
5364222, |
Feb 05 1992 |
Tokyo Electron Limited |
Apparatus for processing wafer-shaped substrates |
5628828, |
Mar 04 1994 |
Hitachi , Ltd. |
Processing method and equipment for processing a semiconductor device having holder/carrier with flattened surface |
6033521, |
Jun 04 1997 |
SpeedFam-IPEC Corporation |
Tilt mechanism for wafer cassette |
6405610, |
Nov 14 1995 |
Nikon Corporation |
Wafer inspection apparatus |
6580087, |
Oct 15 1999 |
Sony Corporation |
Inspection apparatus |
7109483, |
Nov 17 2000 |
Ebara Corporation |
Method for inspecting substrate, substrate inspecting system and electron beam apparatus |
20020028399, |
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20030169916, |
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20040095575, |
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20040141831, |
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20040146378, |
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20070031236, |
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20070098527, |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a