Patent
   D607424
Priority
Mar 30 2006
Filed
Oct 02 2006
Issued
Jan 05 2010
Expiry
Jan 05 2024
Assg.orig
Entity
unknown
2
13
n/a
The ornamental design for a wafer carrying-in/out apparatus or the like, as shown and described.

FIG. 1 is a top plan view of a wafer carrying-in/out apparatus or the like, showing our new design;

FIG. 2 is a left side elevational view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a top, front and right side perspective view thereof;

FIG. 8 is a top, front and right side perspective view thereof shown when the doors thereof have been opened;

FIG. 9 is a front elevational view thereof shown with the windows thereof installed;

FIG. 10 is a left side elevational view thereof; and,

FIG. 11 is a rear elevational view thereof.

The features shown in broken lines in the drawings form no part of the claimed design.

Akiyama, Shuji, Hosaka, Hiroki, Obikane, Tadashi

Patent Priority Assignee Title
D651990, Jun 01 2010 KOKUSAI ELECTRIC CORPORATION Semiconductor manufacturing equipment
D652395, Jun 01 2010 KOKUSAI ELECTRIC CORPORATION Semiconductor manufacturing equipment
Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 02 2006Tokyo Electron Limited(assignment on the face of the patent)
Nov 06 2006HOSAKA, HIROKITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0186630705 pdf
Nov 06 2006AKIYAMA, SHUJITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0186630705 pdf
Nov 06 2006OBIKANE, TADASHITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0186630705 pdf
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