PTO
Wrapper
PDF
|
Dossier
Espace
Google
|
|
Patent
D651990
|
Priority
Jun 01 2010
|
Filed
Nov 29 2010
|
Issued
Jan 10 2012
|
Expiry
Jan 10 2026
|
|
Assg.orig
|
|
Entity
unknown
|
0
|
13
|
n/a
|
|
|
We claim the ornamental design for a semiconductor manufacturing equipment, as shown and described.
|
FIG. 1 is a front, top and right side perspective view of an semiconductor manufacturing equipment showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevational view thereof; and,
FIG. 7 is a right side elevational view thereof.
Nagata, Mitsuhiro, Aburatani, Yukinori, Shimada, Masakazu, Nogami, Takashi, Aizawa, Satoshi, Nakashima, Seiyo, Yamada, Tomoyuki, Sugiura, Shinobu
Patent |
Priority |
Assignee |
Title |
Patent |
Priority |
Assignee |
Title |
5810538, |
May 12 1994 |
Kokusai Electric Co., Ltd. |
Semiconductor manufacturing equipment and method for carrying wafers in said equipment |
6547660, |
Jul 02 1999 |
Tokyo Electron Limited; Tadahiro, Ohmi; Taisei Corporation |
Semiconductor manufacturing facility, semiconductor manufacturing apparatus and semiconductor manufacturing method |
6580087, |
Oct 15 1999 |
Sony Corporation |
Inspection apparatus |
6945746, |
Feb 21 2002 |
ASM Japan K.K. |
Semiconductor manufacturing equipment and maintenance method |
7039499, |
Aug 02 2002 |
SEMINET INC |
Robotic storage buffer system for substrate carrier pods |
7607879, |
Jun 15 2004 |
BROOKS AUTOMATION HOLDING, LLC; Brooks Automation US, LLC |
Substrate processing apparatus with removable component module |
20060120833, |
|
|
|
20070098527, |
|
|
|
20080166208, |
|
|
|
20080317581, |
|
|
|
20110123300, |
|
|
|
20110236159, |
|
|
|
D607424, |
Mar 30 2006 |
Tokyo Electron Limited |
Wafer carrying-in/out apparatus |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a