Heat dissipation apparatus

We claim, the ornamental design for a heat dissipation apparatus, as shown.

FIG. 1 is a perspective view of a heat dissipation apparatus showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Patent	Priority	Assignee	Title
D619548,	Jul 21 2009	Foxsemicon Intergrated Technology, Inc.	Heat dissipation device
D619549,	Jul 21 2009	Foxsemicon Integrated Technology, Inc.	Heat dissipation device
D622675,	Jul 21 2009	Foxsemicon Integrated Technology, Inc.	Heat dissipation device
D894357,	Jan 22 2019		Refrigerant coil segment
D962879,	Apr 09 2020	Acer Incorporated	Heat-dissipation unit

Patent	Priority	Assignee	Title
3239003,
6479895,	May 18 2001	Intel Corporation	High performance air cooled heat sinks used in high density packaging applications
194787,
239118,
D592613,	Jun 18 2008	4187318 CANADA INC	Heat sink

//////

Executed on	Assignor	Assignee	Conveyance	Frame	Reel	Doc
Jun 04 2009	HUANG, HSIN-FEI	Foxsemicon Integrated Technology, Inc	ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS	022805	0836	pdf
Jun 04 2009	HUANG, ZHENG-JAY	Foxsemicon Integrated Technology, Inc	ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS	022805	0836	pdf
Jun 04 2009	LU, CHIEN-TING	Foxsemicon Integrated Technology, Inc	ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS	022805	0836	pdf
Jun 04 2009	CHEN, YING-CHING	Foxsemicon Integrated Technology, Inc	ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS	022805	0836	pdf
Jun 04 2009	LIU, YU-PIN	Foxsemicon Integrated Technology, Inc	ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS	022805	0836	pdf
Jun 10 2009		Foxsemicon Integrated Technology, Inc.	(assignment on the face of the patent)

n/a

Date	Maintenance Fee Events

n/a

Date	Maintenance Schedule