Patent
   D619548
Priority
Jul 21 2009
Filed
Oct 26 2009
Issued
Jul 13 2010
Expiry
Jul 13 2024
Assg.orig
Entity
unknown
4
11
n/a
The ornamental design for a heat dissipation device, as shown.

FIG. 1 is a perspective view of a heat dissipation device showing my new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Liu, Yu-Pin

Patent Priority Assignee Title
8453715, Oct 30 2008 General Electric Company Synthetic jet embedded heat sink
9134078, Oct 30 2008 General Electric Company Synthetic jet embedded heat sink
9651318, Oct 30 2008 General Electric Company Synthetic jet embedded heat sink
D894357, Jan 22 2019 Refrigerant coil segment
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Oct 19 2009LIU, YU-PIN Foxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0234210544 pdf
Oct 26 2009Foxsemicon Intergrated Technology, Inc.(assignment on the face of the patent)
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