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Patent
D619548
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Priority
Jul 21 2009
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Filed
Oct 26 2009
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Issued
Jul 13 2010
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Expiry
Jul 13 2024
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Assg.orig
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Entity
unknown
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4
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11
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n/a
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The ornamental design for a heat dissipation device, as shown.
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FIG. 1 is a perspective view of a heat dissipation device showing my new design.
FIG. 2 is a front elevational view thereof.
FIG. 3 is a rear elevational view thereof.
FIG. 4 is a left-side, elevational view thereof.
FIG. 5 is a right-side, elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Liu, Yu-Pin
Patent |
Priority |
Assignee |
Title |
3239003, |
|
|
|
5661638, |
Nov 03 1995 |
Hewlett Packard Enterprise Development LP |
High performance spiral heat sink |
5794685, |
Dec 17 1996 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Heat sink device having radial heat and airflow paths |
6479895, |
May 18 2001 |
Intel Corporation |
High performance air cooled heat sinks used in high density packaging applications |
6525939, |
Aug 08 2000 |
Wistron Corporation; Acer Incorporated |
Heat sink apparatus |
6657862, |
Sep 10 2001 |
Intel Corporation |
Radial folded fin heat sinks and methods of making and using same |
6712128, |
Nov 20 2002 |
Thermal Corp. |
Cylindrical fin tower heat sink and heat exchanger |
7193849, |
Aug 27 2003 |
FU ZHUN PRECISION NDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD |
Heat dissipating device |
194787, |
|
|
|
D576964, |
Nov 08 2007 |
ABL IP Holding LLC |
Heat sink |
D608876, |
Mar 21 2009 |
Foxsemicon Integrated Technology, Inc. |
Heat dissipation apparatus |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a