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Patent
D625704
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Priority
Oct 23 2009
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Filed
Oct 23 2009
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Issued
Oct 19 2010
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Expiry
Oct 19 2024
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Assg.orig
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Entity
unknown
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5
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9
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n/a
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The ornamental design for an earphone assembly, as shown and described.
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FIG. 1 is a perspective view of an earphone assembly showing my new design, the cord is drawn broken away to show indeterminate length;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is another perspective view of the earphone assembly showing my new design.
Cheng, Jung-Ching
Patent |
Priority |
Assignee |
Title |
3343772, |
|
|
|
D459342, |
Sep 07 2000 |
GN Jabra Corporation |
Communication device earboom |
D554109, |
Aug 17 2006 |
Microsoft Corporation |
Pair of earphones |
D576608, |
Jul 18 2007 |
|
Headset article for electronic device |
D591264, |
Mar 31 2008 |
HTC Corporation |
Earphone |
D599781, |
Jul 08 2008 |
NL FINANCE CO, LLC |
Pair of in ear headphones |
D599785, |
May 29 2007 |
SMK Corporation |
Earphone |
D600236, |
May 23 2008 |
HMD Global Oy |
Headset |
D607880, |
Nov 19 2008 |
Sony Ericsson Mobile Communications AB |
Earpiece |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a