Patent
   D625704
Priority
Oct 23 2009
Filed
Oct 23 2009
Issued
Oct 19 2010
Expiry
Oct 19 2024
Assg.orig
Entity
unknown
5
9
n/a
The ornamental design for an earphone assembly, as shown and described.

FIG. 1 is a perspective view of an earphone assembly showing my new design, the cord is drawn broken away to show indeterminate length;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is another perspective view of the earphone assembly showing my new design.

Cheng, Jung-Ching

Patent Priority Assignee Title
D682256, Feb 02 2012 BlackBerry Limited Clip for a headset
D789327, Aug 29 2013 Sony Corporation Earphone
D792376, Oct 19 2011 Sony Corporation Headphone
D853985, Aug 29 2013 Sony Corporation Headphone
D966522, May 13 2020 Tech Gear Co., Ltd. Hearing aid
Patent Priority Assignee Title
3343772,
D459342, Sep 07 2000 GN Jabra Corporation Communication device earboom
D554109, Aug 17 2006 Microsoft Corporation Pair of earphones
D576608, Jul 18 2007 Headset article for electronic device
D591264, Mar 31 2008 HTC Corporation Earphone
D599781, Jul 08 2008 NL FINANCE CO, LLC Pair of in ear headphones
D599785, May 29 2007 SMK Corporation Earphone
D600236, May 23 2008 HMD Global Oy Headset
D607880, Nov 19 2008 Sony Ericsson Mobile Communications AB Earpiece
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 19 2009CHENG, JUNG-CHINGCHENG UEI PRECISION INDUSTRY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0234180184 pdf
Oct 23 2009Cheng Uei Precision Industry Co., Ltd.(assignment on the face of the patent)
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