FIG. 1 is a front, top, right perspective view of a first embodiment of a headphone showing our new design;
FIG. 2 is a front, bottom, right perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a right side elevational view thereof; and
FIG. 6 is a top plan view thereof.
FIG. 7 is a front, top, right perspective view of a second embodiment of a headphone showing our new design;
FIG. 8 is a front, bottom, right perspective view thereof;
FIG. 9 is a front elevational view thereof;
FIG. 10 is a rear elevational view thereof;
FIG. 11 is a right side elevational view thereof; and
FIG. 12 is a top plan view thereof.
FIG. 13 is a front, top, right perspective view of a third embodiment of a headphone showing our new design;
FIG. 14 is a rear, bottom, right perspective view thereof;
FIG. 15 is a front elevational view thereof;
FIG. 16 is a rear elevational view thereof;
FIG. 17 is a right side elevational view thereof; and,
FIG. 18 is a top plan view thereof.
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| May 04 2015 | LIM, KOK KEONG | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 041889 | /0305 |
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