|
The ornamental design for an earphone, as shown. |
FIG. 1 is a top, rear and right-side perspective view of an earphone, showing our new design;
FIG. 2 is a rear, bottom and left-side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left-side elevational view thereof;
FIG. 6 is a right-side elevational view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.
Nakamura, Mitsuhiro, Gotoh, Hidefumi
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Mar 23 1993 | NAKAMURA, MITSUHIRO | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007031 | /0367 | |
Mar 23 1993 | GOTOH, MIDEFUMI | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007031 | /0367 | |
Apr 05 1993 | Sony Corporation | (assignment on the face of the patent) | / |
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