|
The ornamental design for a earphone, as shown and described. |
FIG. 1 is a perspective view of a first embodiment of a earphone showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a rear elevational view thereof;
FIG. 8 is a perspective view of a second embodiment of a earphone showing my new design;
FIG. 9 is a top plan view of the embodiment of FIG. 8;
FIG. 10 is a left side elevational view of the embodiment of FIG. 8;
FIG. 11 is a front elevational view of the embodiment of FIG. 8;
FIG. 12 is a bottom plan view of the embodiment of FIG. 8;
FIG. 13 is a right side elevational view of the embodiment of FIG. 8; and,
FIG. 14 is a rear elevational view of the embodiment of FIG. 8.
Patent | Priority | Assignee | Title |
D468301, | Aug 09 2001 | Star Micronics Co., Ltd. | Earphone |
D474171, | Jun 10 2002 | Sony Corporation | Earphone |
D480386, | May 06 2002 | FeONIC plc | Sound bug reproducing device |
D485548, | Jan 28 2003 | Sony Corporation | Earphone |
D487077, | Jan 28 2003 | Sony Corporation | Earphone |
D515069, | Dec 19 2003 | Sony Corporation | Headphone |
D577812, | Jun 14 2007 | 3M Innovative Properties Company | Earplug stem |
D587679, | Sep 28 2007 | Sony Corporation | Headphone |
D590375, | Sep 26 2007 | Sony Corporation | Earphone |
D593546, | Mar 28 2008 | Samsung Electronics Co., Ltd. | Wireless earset |
D601134, | Feb 10 2009 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Earbud for a communications headset |
D632282, | Oct 28 2009 | Sony Corporation | Earphone |
D635558, | Mar 05 2010 | Sony Corporation | Earphone |
D644212, | Dec 23 2009 | SENNHEISER CONSUMER AUDIO GMBH | Headphones |
D644213, | Dec 23 2009 | SENNHEISER CONSUMER AUDIO GMBH | Headphones |
D645455, | Aug 10 2010 | SCION NEUROSTIM, INC | Earpiece |
D656489, | Mar 05 2010 | Sony Corporation | Earphone |
D659125, | Nov 30 2010 | Sony Corporation | Earphone |
D668637, | Oct 28 2009 | Sony Corporation | Earphone |
D669453, | Nov 30 2010 | Sony Corporation | Earphone |
D675599, | Mar 05 2010 | Sony Corporation | Earphone |
D683328, | Oct 28 2009 | Sony Corporation | Earphone |
D712741, | Jan 23 2013 | Threaded pour spout | |
D733865, | Feb 17 2014 | 3M Innovative Properties Company | Earplug switch |
D750600, | Nov 10 2014 | Peag, LLC; PEAG, LLC DBA JLAB AUDIO | Pair of earbuds |
D754323, | Feb 17 2014 | 3M Innovative Properties Company | Hearing device retainer |
D754324, | Feb 17 2014 | 3M Innovative Properties Company | Hearing device retainer |
D813844, | Jul 20 2015 | SKULLCANDY, INC | Headphone |
D820808, | Mar 02 2016 | Zound Industries International AB | Headphone headset |
D872062, | May 21 2018 | SHENZHEN TUOPU GLOBAL TECHNOLOGY CO , LTD | Earphone |
D902183, | Apr 04 2019 | Innate Devices, LLC | Three tiered tip for an earplug, a headphone, or an earphone |
D905665, | May 17 2017 | ACOUS DESIGN CO., LTD. | Earplug |
Patent | Priority | Assignee | Title |
D337118, | Nov 01 1990 | SONY CORPORATION, A CORP OF JAPAN | Earphone |
D353379, | Oct 20 1992 | Sony Corporation | Earphone |
D375959, | Apr 24 1995 | Plantronics, Inc. | Communications headset |
D377796, | Sep 13 1995 | Sony Corporation | Earphone combined with microphone |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Mar 19 1997 | Sony Corporation | (assignment on the face of the patent) | / |
Date | Maintenance Fee Events |
Date | Maintenance Schedule |