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The ornamental design for an earphone, as shown and described.
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FIG. 1 is a perspective view of the top, front and right side of an earphone showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a right side elevational view thereof, the left side view being a mirror image thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Oct 30 2001 | FUSHIMI, ISAO | STAR MICRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012574 | /0471 | |
Feb 07 2002 | Star Micronics Co., Ltd. | (assignment on the face of the patent) | / |
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