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The ornamental design for a housing for a mobile computing device, as shown and described.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Mar 31 2009 | Hewlett-Packard Development Company, L.P. | (assignment on the face of the patent) | ||||
Oct 02 2009 | Palm, Inc | JPMORGAN CHASE BANK, N A | SECURITY AGREEMENT | 023406 | 0671 | |
Jul 01 2010 | JPMORGAN CHASE BANK, N A , AS ADMINISTRATIVE AGENT | Palm, Inc | RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS | 024630 | 0474 | |
Oct 27 2010 | Palm, Inc | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 025204 | 0809 | |
Apr 30 2013 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Palm, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 030341 | 0459 | |
Dec 18 2013 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Palm, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031837 | 0544 | |
Dec 18 2013 | Palm, Inc | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031837 | 0239 | |
Jan 23 2014 | Hewlett-Packard Company | Qualcomm Incorporated | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 032132 | 0001 | |
Jan 23 2014 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Qualcomm Incorporated | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 032132 | 0001 | |
Jan 23 2014 | Palm, Inc | Qualcomm Incorporated | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 032132 | 0001 |
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