Patent
   D670259
Priority
May 02 2008
Filed
Feb 07 2011
Issued
Nov 06 2012
Expiry
Nov 06 2026
Assg.orig
Entity
unknown
12
83
n/a
The ornamental design for a housing for a mobile computing device, as shown and described.

FIG. 1 is a front view of a housing for a mobile computing device;

FIG. 2 is a rear view of a housing for a mobile computing device;

FIG. 3 is a right side view of a housing for a mobile computing device;

FIG. 4 is a left side view of a housing for a mobile computing device;

FIG. 5 is a top end view of a housing for a mobile computing device;

FIG. 6 is a bottom end view of a housing for a mobile computing device;

FIG. 7 is another front view of a housing for a mobile computing device in a closed position;

FIG. 8 is another rear view of a housing for a mobile computing device in a closed position;

FIG. 9 is another right side view of a housing for a mobile computing device in a closed position;

FIG. 10 is another left side view of a housing for a mobile computing device in a closed position;

FIG. 11 is another top end view of a housing for a mobile computing device in a closed position; and,

FIG. 12 is another bottom end view of a housing for a mobile computing device in a closed position.

The broken line showing of the keypad in FIG. 1 is directed to environment and is for illustrative purposes only; the broken lines and the space around the broken lines form no part of the claimed design. The solid line that defines the area in which the broken line keys are shown represent the boundary of the claimed design.

Matsuoka, Yoshimichi, Chamberlain, Jason, Lee, Seungheon, Gioscia, Richard, Bryan, Philip

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Feb 07 2011Hewlett-Packard Development Company, L.P.(assignment on the face of the patent)
Apr 05 2011MATSUOKA, YOSHIMICHIHEWLETT-PACKARD DEVELOPMENT COMPANY, L P ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0263000057 pdf
May 05 2011BRYAN, PHILIPHEWLETT-PACKARD DEVELOPMENT COMPANY, L P ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0263000057 pdf
May 06 2011GIOSCIA, RICHARDHEWLETT-PACKARD DEVELOPMENT COMPANY, L P ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0263000057 pdf
May 06 2011CHAMBERLAIN, JASONHEWLETT-PACKARD DEVELOPMENT COMPANY, L P ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0263000057 pdf
May 08 2011LEE, SEUNGHEONHEWLETT-PACKARD DEVELOPMENT COMPANY, L P ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0263000057 pdf
Apr 30 2013HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Palm, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0303410459 pdf
Dec 18 2013HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Palm, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0318370544 pdf
Dec 18 2013Palm, IncHEWLETT-PACKARD DEVELOPMENT COMPANY, L P ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0318370239 pdf
Jan 23 2014Hewlett-Packard CompanyQualcomm IncorporatedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0321770210 pdf
Jan 23 2014Palm, IncQualcomm IncorporatedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0321770210 pdf
Jan 23 2014HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Qualcomm IncorporatedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0321770210 pdf
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