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The ornamental design for a cover of an electronic device having surface ornamentation, as shown and described.
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The present application is related to copending U.S. patent applications Ser. Nos. 29/423,548, 29/423,549, 29/423,551, 29/423,552, 29/423,555, 29/423,557, 29/423,559, and 29/423,560, each entitled “Cover of an Electronic Device Having Surface Ornamentation”, by Bin Li. These applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference.
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Patent | Priority | Assignee | Title |
D671926, | Jun 20 2012 | FIH (Hong Kong) Limited | Cover of an electronic device having surface ornamentation |
D671927, | Jun 20 2012 | FIH (Hong Kong) Limited | Cover of an electronic device having surface ornamentation |
D671928, | Jun 20 2012 | FIH (Hong Kong) Limited | Cover of an electronic device having surface ornamentation |
D671929, | Jun 20 2012 | FIH (Hong Kong) Limited | Cover of an electronic device having surface ornamentation |
D672764, | Aug 28 2012 | FIH (Hong Kong) Limited | Cover of an electronic device having surface ornamentation |
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
May 30 2012 | LI, BIN | FIH HONG KONG LIMITED | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 028305 | /0037 | |
Jun 01 2012 | FIH (Hong Kong) Limited | (assignment on the face of the patent) | / |
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