Patent
   D671929
Priority
Jun 20 2012
Filed
Jun 20 2012
Issued
Dec 04 2012
Expiry
Dec 04 2026
Assg.orig
Entity
unknown
20
26
n/a
The ornamental design for a cover of an electronic device having surface ornamentation, as shown and described.

The present application is related to copending U.S. patent application Ser. Nos. 29/425,174, 29/425,175, 29/425,441, 29/425,177, 29/425,179, 29/425,180, 29/425,182, and 29/425,183, each entitled “Cover of an Electronic Device Having Surface Ornamentation”, by Bin Li. These applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference.

FIG. 1 is a perspective view of a cover of an electronic device having surface ornamentation showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a side elevational view thereof; and,

FIG. 4 is an enlarged fragmentary view thereof showing circled portion 4 in FIG. 2.

In FIGS. 1-3, the evenly segmented broken lines indicate portions of the cover of an electronic device having surface ornamentation that form no part of the claimed design. In FIGS. 2 and 4, the unevenly segmented broken lines indicate the portion of the design that is shown on an enlarged scale in FIG. 4. The broken lines form no part of the claimed design.

Li, Bin

Patent Priority Assignee Title
D704180, Mar 06 2012 FIH (Hong Kong) Limited Cover of an electronic device having surface ornamentation
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 12 2012LI, BINFIH HONG KONG LIMITEDASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0284120111 pdf
Jun 20 2012FIH (Hong Kong) Limited(assignment on the face of the patent)
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