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Patent
D673127
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Priority
Apr 29 2011
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Filed
Oct 25 2011
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Issued
Dec 25 2012
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Expiry
Dec 25 2026
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Assg.orig
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Entity
unknown
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7
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11
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n/a
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The ornamental design for a led package, as shown and described.
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FIG. 1 is a perspective view of a LED package showing my/our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof, the right side being a mirror image;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a bottom plan view thereof.
Cho, Hyun Seok, Park, Ji Min
Patent |
Priority |
Assignee |
Title |
20090135581, |
|
|
|
D524260, |
Aug 20 2004 |
CITIZEN ELECTRONICS CO , LTD |
Light emitting diode |
D573553, |
Feb 09 2007 |
MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD |
Light source of light-emitting diode |
D592162, |
Feb 25 2008 |
Nichia Corporation |
Light emitting diode |
D592615, |
Dec 05 2007 |
CITIZEN ELECTRONICS CO , LTD |
Light-emitting diode for illuminating an object |
D615933, |
Mar 30 2006 |
Nichia Corporation |
Light emitting diode |
D623607, |
Sep 17 2007 |
CREE LED, INC |
Lamp packages |
D624887, |
Oct 09 2009 |
Toshiba Lighting & Technology Corporation |
Light emitting diode module |
D629368, |
Apr 07 2010 |
Everlight Electronics Co., Ltd. |
Light emitting diode |
D649521, |
Feb 12 2010 |
Everlight Electronics Co., Ltd. |
Light emitting diode |
D650760, |
Nov 22 2010 |
CREELED, INC |
Light emitting device package |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a