Patent
   D735683
Priority
May 03 2013
Filed
May 03 2013
Issued
Aug 04 2015
Expiry
Aug 04 2029
Assg.orig
Entity
unknown
7
75
n/a
The ornamental design for an led package, as shown and described herein.

FIG. 1 is a top perspective view of an LED package according to one embodiment of the present invention.

FIG. 2 is a front elevation view of one side of the LED package shown in FIG. 1.

FIG. 3 is a back elevation view of the LED package as shown in FIG. 1.

FIG. 4 is an elevation view of one side of the LED package shown in FIG. 1, with the other side being a mirror image thereof.

FIG. 5 is a top view of the LED package shown in FIG. 1.

FIG. 6 is a bottom view of the LED package shown in FIG. 1.

FIG. 7 is a top perspective view of an LED package according to another embodiment of the present invention.

FIG. 8 is a front elevation view of one side of the LED package shown in FIG. 7.

FIG. 9 is a back elevation view of the LED package as shown in FIG. 7.

FIG. 10 is an elevation view of one side of the LED package shown in FIG. 7, with the other side being a mirror image thereof.

FIG. 11 is a top view of the LED package shown in FIG. 7.

FIG. 12 is a bottom view of the LED package shown in FIG. 7.

FIG. 13 is a top perspective view of an LED package according to another embodiment of the present invention.

FIG. 14 is a front elevation view of one side of the LED package shown in FIG. 13.

FIG. 15 is a back elevation view of the LED package as shown in FIG. 13.

FIG. 16 is an elevation view of one side of the LED package shown in FIG. 13, with the other side being a mirror image thereof.

FIG. 17 is a top view of the LED package shown in FIG. 13; and,

FIG. 18 is a bottom view of the LED package shown in FIG. 13.

Reiherzer, Jesse, Bergmann, Mike, Clark, Joseph Gates

Patent Priority Assignee Title
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Patent Priority Assignee Title
5040868, May 31 1989 SIEMENS AKTIENGESELLSCHAFT, A GERMAN CORP Surface-mountable opto-component
6061160, May 31 1996 POWERWAVE TECHNOLOGIES S A R L Component device for optical communication
6376902, Jul 29 1997 Osram GmbH Optoelectronic structural element
6707069, Dec 24 2001 SAMSUNG ELECTRONICS CO , LTD Light emission diode package
6759733, Jul 29 1997 Osram GmbH Optoelectric surface-mountable structural element
6900511, Jun 28 2002 OSRAM Opto Semiconductors GmbH; OSRAM OLED GmbH Optoelectronic component and method for producing it
6940704, Jan 24 2001 GELcore, LLC Semiconductor light emitting device
7066626, Apr 09 2003 Citizen Electronics Co., Ltd. LED lamp
7102215, Jul 29 1997 Osram GmbH Surface-mountable light-emitting diode structural element
7183632, Jul 29 1997 Osram GmbH Surface-mountable light-emitting diode structural element
7224000, Aug 30 2002 Savant Technologies, LLC Light emitting diode component
7271425, Nov 29 2002 OSRAM Opto Semiconductors GmbH; OSRAM OLED GmbH Optoelectronic component
7282785, Jan 05 2004 STANLEY ELECTRIC CO , LTD Surface mount type semiconductor device and lead frame structure thereof
7317181, Dec 07 2001 Hitachi Cable, Ltd.; Stanley Electric Co. Ltd. Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit
8624289, Sep 28 2007 OSRAM Opto Semiconductors GmbH Optoelectronic component
8779567, May 24 2012 Nichia Corporation Semiconductor device
20020123163,
20020163001,
20040041222,
20040079957,
20040126913,
20040227149,
20040238930,
20060049477,
20060102917,
20070252250,
20090020778,
20090108281,
20090283781,
20110291154,
20120032202,
20130328073,
20130328074,
CN1417868,
CN1977399,
D572210, Nov 01 2006 SUZHOU LEKIN SEMICONDUCTOR CO , LTD Light-emitting diode (LED)
D576574, Jul 17 2007 Rohm Co., Ltd. Light emitting diode module
D591697, Aug 09 2006 CREE LED, INC Lamp package
D615504, Oct 31 2007 CREELED, INC Emitter package
D631020, Apr 29 2010 Edison Opto Corporation LED package
D633631, Dec 14 2007 CREELED, INC Light source of light emitting diode
D634863, Jan 10 2008 CREELED, INC Light source of light emitting diode
D645416, Dec 22 2009 PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD Light-emitting diode
D649943, Jul 07 2010 PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD Light emitting diode
D650343, Jan 31 2011 CREELED, INC Multiple configuration light emitting device package
D656906, Jan 10 2008 CREELED, INC LED package
D660257, Jan 31 2011 CREE LED, INC Emitter package
D662902, Dec 14 2007 CREELED, INC LED package
D667802, Mar 09 2011 CITIZEN WATCH CO , LTD Light-emitting diode
D674758, Oct 31 2011 LITE-ON ELECTRONICS GUANGZHOU LIMITED Light emitting diode
D675169, Dec 13 2011 Lextar Electronics Corp. Multi-chip LED
D691973, Jul 08 2011 CREE LED, INC Lamp packages
D698323, Jul 30 2010 Nichia Corporation Light emitting diode
D698741, May 29 2012 Kabushiki Kaisha Toshiba Light-emitting diode
D703348, Jul 09 2012 CREE LED, INC Lamp package
D704154, Apr 06 2012 CREELED, INC Light emitter package
D709464, May 31 2012 CREELED, INC Light emitting diode (LED) package
D711840, Jun 11 2012 CREELED, INC LED package
D718725, Aug 01 2013 CREELED, INC LED package with encapsulant
EP1187227,
EP1953834,
JP2000188358,
JP2000223752,
JP2003197974,
JP2007287981,
JP2007299905,
KR3003875582,
KR300756220,
TW1110647,
TW112798,
TW123860,
TW128141,
TW158571,
TW158573,
WO2004053933,
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May 07 2013REIHERZER, JESSECree, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0304000875 pdf
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