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Patent
D674758
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Priority
Oct 31 2011
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Filed
Jan 03 2012
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Issued
Jan 22 2013
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Expiry
Jan 22 2027
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Assg.orig
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Entity
unknown
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21
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34
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n/a
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The ornamental design for light emitting diode, as shown and described.
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FIG. 1 is a perspective view of light emitting diode showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The portions shown in dashed lines are for illustrative purposes only and form no part of the claimed design.
Lin, Chen-Hsiu, Wu, Chia-Hao, Chang, Yi-Chien, Weng, Ming-Kun
| Patent |
Priority |
Assignee |
Title |
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May 31 2012 |
CREELED, INC |
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May 31 2012 |
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May 14 2012 |
CREELED, INC |
Light emitting devices including multiple anodes and cathodes |
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May 31 2012 |
CREELED, INC |
Light emitting diode (LED) package |
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Aug 23 2012 |
CREELED, INC |
Light emitting diode (LED) package |
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CREELED, INC |
Light emitting diode (LED) package with multiple anodes and cathodes |
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May 14 2012 |
CREELED, INC |
Light emitting diode (LED) package with multiple anodes and cathodes |
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Aug 01 2013 |
CREELED, INC |
LED package with encapsulant |
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May 03 2013 |
CREELED, INC |
LED package |
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Apr 10 2014 |
KINGBRIGHT ELECTRONICS CO., LTD. |
LED component |
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Dec 30 2013 |
CREELED, INC |
LED package |
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May 31 2012 |
CREELED, INC |
Light emitting diode (LED) package |
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Aug 08 2013 |
CREELED, INC |
LED package |
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Sep 30 2014 |
CREELED, INC |
LED package with truncated encapsulant |
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Dec 11 2014 |
CREELED, INC |
LED package |
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Oct 30 2019 |
CREELED, INC |
Light emitting diode package |
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Oct 01 2002 |
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Jun 10 2003 |
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Multi-chip light emitting diode package |
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High intensity LED |
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Jan 10 2005 |
CREELED, INC |
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Oct 31 2007 |
CREELED, INC |
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Apr 08 2009 |
Nichia Corporation |
Light emitting diode module |
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Nichia Corporation |
Light emitting diode module |
| D631019, |
Apr 21 2010 |
EPISTAR CORPORATION |
Light emitting diode packaging array |
| D631020, |
Apr 29 2010 |
Edison Opto Corporation |
LED package |
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Sep 29 2010 |
Kabushiki Kaisha Toshiba |
Light-emitting diode |
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Dec 22 2009 |
PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD |
Light-emitting diode |
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Jul 07 2010 |
PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD |
Light emitting diode |
| D649944, |
Jul 07 2010 |
PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD |
Light emitting diode |
| D650343, |
Jan 31 2011 |
CREELED, INC |
Multiple configuration light emitting device package |
| D656906, |
Jan 10 2008 |
CREELED, INC |
LED package |
| D658139, |
Jan 31 2011 |
CREE LED, INC |
High-density emitter package |
| D660257, |
Jan 31 2011 |
CREE LED, INC |
Emitter package |
| D660258, |
May 04 2011 |
EPISTAR CORPORATION |
Light emitting diode |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Dec 26 2011 | CHANG, YI-CHIEN | LITE-ON TECHNOLOGY CORP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 027520 | /0527 |
pdf |
| Dec 26 2011 | WENG, MING-KUN | LITE-ON TECHNOLOGY CORP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 027520 | /0527 |
pdf |
| Dec 26 2011 | LIN, CHEN-HSIU | LITE-ON TECHNOLOGY CORP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 027520 | /0527 |
pdf |
| Dec 26 2011 | WU, CHIA-HAO | LITE-ON TECHNOLOGY CORP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 027520 | /0527 |
pdf |
| Dec 26 2011 | CHANG, YI-CHIEN | SILITEK ELECTRONIC GUANGZHOU CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 027520 | /0527 |
pdf |
| Dec 26 2011 | WENG, MING-KUN | SILITEK ELECTRONIC GUANGZHOU CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 027520 | /0527 |
pdf |
| Dec 26 2011 | LIN, CHEN-HSIU | SILITEK ELECTRONIC GUANGZHOU CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 027520 | /0527 |
pdf |
| Dec 26 2011 | WU, CHIA-HAO | SILITEK ELECTRONIC GUANGZHOU CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 027520 | /0527 |
pdf |
| Jan 03 2012 | | Lite-On Technology Corp. | (assignment on the face of the patent) | | / |
| Jan 03 2012 | | Silitek Electronic (Guangzhou) Co., Ltd. | (assignment on the face of the patent) | | / |
| Jul 31 2012 | SILITEK ELECTRONIC GUANGZHOU CO , LTD | LITE-ON ELECTRONICS GUANGZHOU LIMITED | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 030416 | /0787 |
pdf |
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