|
The ornamental design for a light emitting diode (LED) package, as shown and described.
|
The broken lines are for illustrative purposes only and form no part of the claimed design. The gray or stippled trench portions of the embodiment illustrated in
Rosado, Raymond, Clark, Joseph G, Abare, Amber C, Emerson, David T, Nevins, Jeremy S
Patent | Priority | Assignee | Title |
10439112, | May 31 2012 | CREELED, INC | Light emitter packages, systems, and methods having improved performance |
D772181, | Apr 02 2015 | Nichia Corporation | Light emitting diode package substrate |
D777122, | Feb 27 2015 | CREELED, INC | LED package |
D783547, | Jun 04 2015 | CREELED, INC | LED package |
D790487, | Apr 02 2015 | Nichia Corporation | Light emitting diode package substrate |
D825499, | Sep 29 2016 | Nichia Corporation | Light emitting diode package |
D843957, | Sep 29 2016 | Nichia Corporation | Light emitting diode package |
D844183, | Aug 19 2016 | Citizen Electronics Co., Ltd.; Citizen Watch Co., Ltd. | Light emitting diode |
D844576, | Jul 25 2017 | Citizen Electronics Co., Ltd.; Citizen Watch Co., Ltd. | Light emitting diode |
D854195, | Sep 29 2016 | Nichia Corporation | Light emitting diode package |
D886751, | Sep 29 2016 | Nichia Corporation | Light emitting diode module |
D926714, | Oct 30 2019 | CREELED, INC | Light emitting diode package |
ER1086, | |||
ER4805, | |||
ER9504, |
Patent | Priority | Assignee | Title |
4946547, | Oct 13 1989 | Cree, Inc | Method of preparing silicon carbide surfaces for crystal growth |
5200022, | Oct 03 1990 | Cree, Inc | Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product |
7213940, | Dec 21 2005 | IDEAL Industries Lighting LLC | Lighting device and lighting method |
7791061, | May 18 2004 | CREELED, INC | External extraction light emitting diode based upon crystallographic faceted surfaces |
8058088, | Jan 15 2008 | CREE LED, INC | Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating |
8575734, | Jul 15 2010 | SUZHOU LEKIN SEMICONDUCTOR CO , LTD | Lead frame |
8610145, | Sep 30 2003 | Kabushiki Kaisha Toshiba; TOSHIBA MATERIALS CO , LTD | Light emitting device |
20040262738, | |||
20070158668, | |||
20080001160, | |||
20080026498, | |||
20080035947, | |||
20080054286, | |||
20080074029, | |||
20080173884, | |||
20080179611, | |||
20080258130, | |||
20090050907, | |||
20090108281, | |||
20090146159, | |||
20100140634, | |||
20100155748, | |||
20100155763, | |||
20100207534, | |||
20100237377, | |||
20100237775, | |||
20100252851, | |||
20100277919, | |||
20110012143, | |||
20110062482, | |||
20110127912, | |||
20110220920, | |||
20110220926, | |||
20120069564, | |||
20120086024, | |||
20120199852, | |||
20120286304, | |||
20120305949, | |||
20120326159, | |||
20130092960, | |||
20130105835, | |||
20130322068, | |||
20130322070, | |||
CN302758425, | |||
CNL2012305863396, | |||
CNL2013305252109, | |||
CNL2013305252310, | |||
CNL2013305253578, | |||
D615504, | Oct 31 2007 | CREELED, INC | Emitter package |
D628966, | Dec 22 2009 | PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD | Light-emitting diode |
D631020, | Apr 29 2010 | Edison Opto Corporation | LED package |
D650343, | Jan 31 2011 | CREELED, INC | Multiple configuration light emitting device package |
D658139, | Jan 31 2011 | CREE LED, INC | High-density emitter package |
D660257, | Jan 31 2011 | CREE LED, INC | Emitter package |
D674758, | Oct 31 2011 | LITE-ON ELECTRONICS GUANGZHOU LIMITED | Light emitting diode |
D675169, | Dec 13 2011 | Lextar Electronics Corp. | Multi-chip LED |
D709464, | May 31 2012 | CREELED, INC | Light emitting diode (LED) package |
D711841, | Aug 23 2012 | CREELED, INC | Light emitting diode (LED) package |
D713804, | May 14 2012 | CREELED, INC | Light emitting diode (LED) package with multiple anodes and cathodes |
DE102007029369, | |||
EP2856524, | |||
EP2856525, | |||
JP2002057374, | |||
JP2003258310, | |||
JP2008034513, | |||
RE34861, | Oct 09 1990 | North Carolina State University | Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide |
WO2013181537, | |||
WO2013181538, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 13 2012 | Cree, Inc. | (assignment on the face of the patent) | / | |||
May 15 2014 | BERGMANN, MICHAEL | Cree, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 037259 | /0653 | |
May 15 2014 | ROSADO, RAYMOND | Cree, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 037259 | /0653 | |
May 15 2014 | ABARE, AMBER C | Cree, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 037259 | /0653 | |
May 15 2014 | CLARK, JOSEPH G | Cree, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 037259 | /0653 | |
May 15 2014 | NEVINS, JEREMY S | Cree, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 037259 | /0653 | |
Oct 30 2015 | EMERSON, DAVID T | Cree, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 037259 | /0653 | |
Mar 01 2021 | Cree, Inc | CREELED, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 055780 | /0121 | |
Feb 07 2022 | SMART MODULAR TECHNOLOGIES, INC | CITIZENS BANK, N A | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 058983 | /0001 | |
Feb 07 2022 | SMART High Reliability Solutions, LLC | CITIZENS BANK, N A | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 058983 | /0001 | |
Feb 07 2022 | SMART EMBEDDED COMPUTING, INC | CITIZENS BANK, N A | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 058983 | /0001 | |
Feb 07 2022 | CREELED, INC | CITIZENS BANK, N A | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 058983 | /0001 |
Date | Maintenance Fee Events |
Date | Maintenance Schedule |