Patent
   D769833
Priority
Aug 29 2014
Filed
Aug 29 2014
Issued
Oct 25 2016
Expiry
Oct 25 2030
Assg.orig
Entity
unknown
1
27
n/a
The ornamental design for a component for electronic device, as shown and described.

FIG. 1 is a front perspective view of a component for electronic device showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

Aoyagi, Shota, Howarth, Richard P., Myers, Scott A., Pakula, David A., Malek, Shayan, Stephens, Gregory Nicolaus

Patent Priority Assignee Title
D795823, Aug 29 2014 Apple Inc. Component for electronic device
Patent Priority Assignee Title
5121297, Dec 31 1990 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Flexible printed circuits
5206792, Nov 04 1991 International Business Machines Corporation Attachment for contacting a heat sink with an integrated circuit chip and use thereof
6104613, May 12 1998 Lockheed Martin Federal Systems, Inc.; Lockheed Martin Corporation VME eurocard double printed wiring card host circuit card circuit (module) assembly
6235995, Apr 02 1998 Hon Hai Precision Ind. Co., Ltd. Flexible printed cable with ground plane and required impedance
6479755, Aug 09 2000 Samsung Electronics Co., Ltd.; SAMSUNG ELECTRONICS CO , LTD Printed circuit board and pad apparatus having a solder deposit
6542358, Oct 31 2000 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Retractable platform with wireless electrical interface
7052296, Aug 29 2002 LG Electronics Inc. Docking station for a portable computer
7492596, Aug 09 2007 CHAMP TECH OPTICAL FOSHAN CORPORATION Heat dissipation device
7583505, May 20 1992 Seiko Epson Corporation Processor apparatus
8243450, Apr 09 2010 TOSHIBA CLIENT SOLUTIONS CO , LTD Electronic apparatus
8477512, Feb 06 2010 Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.; Hon Hai Precision Industry Co., Ltd. Electronic device
20020131253,
20060067054,
20100126760,
D508681, Nov 01 2002 Siemens Aktiengesellschaft Circuit board
D525213, Nov 01 2002 Siemens Aktiengesellschaft Circuit board
D556158, Nov 18 2005 Hon Hai Precision Industry Co., Ltd. Printed circuit board
D637157, Oct 18 2010 Apple Inc Electronic device
D637192, Oct 18 2010 Apple Inc. Electronic device
D637193, Nov 19 2010 Apple Inc Electronic device
D652041, Nov 19 2010 Apple Inc. Electronic device
D673515, Feb 18 2011 Apple Inc Component of an electronic device
D700899, Feb 18 2011 Apple Inc. Component of an electronic device
D716310, Jun 09 2012 Apple Inc Electronic device
D742338, Aug 27 2014 Apple Inc MLB module for electronic device
D742883, Aug 27 2014 Apple Inc Component for an electronic device
D743399, May 30 2014 EMC IP HOLDING COMPANY LLC Flash module
///////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 29 2014Apple Inc.(assignment on the face of the patent)
Jan 19 2015AOYAGI, SHOTAApple IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0351360093 pdf
Jan 20 2015HOWARTH, RICHARD P Apple IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0351360093 pdf
Jan 21 2015MALEK, SHAYANApple IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0351360093 pdf
Jan 21 2015MYERS, SCOTT A Apple IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0351360093 pdf
Jan 21 2015PAKULA, DAVID A Apple IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0351360093 pdf
Jan 21 2015STEPHENS, GREGORY NICOLAUSApple IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0351360093 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule