Patent
   D803283
Priority
May 16 2016
Filed
May 16 2016
Issued
Nov 21 2017
Expiry
Nov 21 2032
Assg.orig
Entity
unknown
3
21
n/a
The ornamental design for a wafer handling assembly, as shown and described.

FIG. 1 is a top perspective view of a first embodiment of a wafer handling assembly.

FIG. 2 is a top view of the wafer handling assembly of FIG. 1.

FIG. 3 is a side view of the wafer handling assembly of FIG. 1.

FIG. 4 is another side view of the wafer handling assembly of FIG. 1.

FIG. 5 is a bottom perspective view of the wafer handling assembly of FIG. 1.

FIG. 6 is a top perspective view of a second embodiment of a wafer handling assembly.

FIG. 7 is a top view of the wafer handling assembly of FIG. 6.

FIG. 8 is a side view of the wafer handling assembly of FIG. 6.

FIG. 9 is another side view of the wafer handling assembly of FIG. 6.

FIG. 10 is a bottom perspective view of the wafer handling assembly of FIG. 6.

FIG. 11 is a top perspective view of a third embodiment of a wafer handling assembly.

FIG. 12 is a top view of the wafer handling assembly of FIG. 11.

FIG. 13 is a side view of the wafer handling assembly of FIG. 11.

FIG. 14 is another side view of the wafer handling assembly of FIG. 11.

FIG. 15 is a bottom perspective view of the wafer handling assembly of FIG. 11.

FIG. 16 is a top perspective view of a fourth embodiment of a wafer handling assembly.

FIG. 17 is a top view of the wafer handling assembly of FIG. 16.

FIG. 18 is a side view of the wafer handling assembly of FIG. 16.

FIG. 19 is another side view of the wafer handling assembly of FIG. 16.

FIG. 20 is a bottom perspective view of the wafer handling assembly of FIG. 16.

FIG. 21 is a top perspective view of a fifth embodiment of a wafer handling assembly.

FIG. 22 is a top view of the wafer handling assembly of FIG. 21.

FIG. 23 is a side view of the wafer handling assembly of FIG. 21.

FIG. 24 is another side view of the wafer handling assembly of FIG. 21.

FIG. 25 is a bottom perspective view of the wafer handling assembly of FIG. 21.

FIG. 26 is a top perspective view of a sixth embodiment of a wafer handling assembly.

FIG. 27 is a top view of the wafer handling assembly of FIG. 26.

FIG. 28 is a side view of the wafer handling assembly of FIG. 26.

FIG. 29 is another side view of the wafer handling assembly of FIG. 26; and,

FIG. 30 is a bottom perspective view of the wafer handling assembly of FIG. 26.

Rashkovsky, Yuliy, Saldana, Miguel Angel, Snowden, Brett Stuart

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Executed onAssignorAssigneeConveyanceFrameReelDoc
May 16 2016Veeco Instruments Inc.(assignment on the face of the patent)
May 24 2016RASHKOVSKY, YULIYVeeco Instruments INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0387720773 pdf
May 24 2016SNOWDEN, BRETT STUARTVeeco Instruments INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0387720773 pdf
Jun 01 2016SALDANA, MIGUEL ANGELVeeco Instruments INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0387720773 pdf
Dec 16 2021Veeco Instruments INCHSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENTPATENT SECURITY AGREEMENT0585330321 pdf
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