Patent
   D853359
Priority
Jan 25 2018
Filed
Jan 25 2018
Issued
Jul 09 2019
Expiry
Jul 09 2034
Assg.orig
Entity
unknown
10
85
n/a
The ornamental design for housing for high-fidelity earbud, as shown and described.

FIG. 1 is a front, right side, top perspective view of the housing for high-fidelity earbud showing my new design;

FIG. 2 is a rear, left side bottom perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof with the ear bud oriented rearwardly;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a front, left side, bottom perspective view of the housing for high-fidelity earbud showing my new design;

FIG. 10 is a rear, left side, bottom perspective view thereof;

FIG. 11 is an inverted rear elevational view thereof;

FIG. 12 is a rear, inverted, elevational view thereof; and

FIG. 13 is a left side elevational view thereof;

FIG. 14 is a right side elevational view thereof;

FIG. 15 is a top plan view thereof;

FIG. 16 is a bottom plan view thereof; and,

FIG. 17 is a usage perspective view thereof.

The broken lines depict environment that forms no part of the claimed design.

Guo, Yong

Patent Priority Assignee Title
D863263, Jun 18 2018 Earphone
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D918873, Aug 19 2019 DONGGUAN PIKEZ ELECTRONIC TECHNOLOGY CO., LTD. Wireless headset
D941807, May 15 2020 Yibai Science & Technology (Shenzhen) Co., Ltd. Earphone
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