FIG. 1 is a front perspective view of an earphone, showing my design.
FIG. 2 is a rear perspective view thereof.
FIG. 3 is a front elevation view thereof.
FIG. 4 is a rear elevation view thereof.
FIG. 5 is a left side elevation view thereof.
FIG. 6 is a right side elevation view thereof.
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.
The broken lines depict environment that forms no part of the claimed design.
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Jan 19 2016 |
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Jan 05 2016 |
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Jun 24 2016 |
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Jan 04 2018 |
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Jun 18 2018 |
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May 07 2018 |
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Dec 27 2018 |
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Oct 23 2018 |
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May 17 2019 |
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Apr 13 2018 |
SEOUL SEMICONDUCTOR CO , LTD |
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Aug 15 2018 |
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Dec 03 2018 |
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