FIG. 1 is a top or bottom perspective view of a first embodiment of an electrical module in accordance with the present invention;
FIG. 2 is a top or bottom view of the first embodiment of the electrical module shown in FIG. 1;
FIG. 3 is a left or right side view of the first embodiment of the electrical module shown in FIG. 1;
FIG. 4 is a front or back view of the first embodiment of the electrical module shown in FIG. 1;
FIG. 5 is a top or bottom perspective view of a second embodiment of an electrical module in accordance with the present invention;
FIG. 6 is a top or bottom view of the second embodiment of the electrical module shown in FIG. 5;
FIG. 7 is a left or right side view of the second embodiment of the electrical module shown in FIG. 5;
FIG. 8 is a front or back view of the second embodiment of the electrical module shown in FIG. 5;
FIG. 9 is a top or bottom perspective view of a third embodiment of an electrical module in accordance with the present invention;
FIG. 10 is a top or bottom view of the third embodiment of the electrical module shown in FIG. 9;
FIG. 11 is a left or right side view of the third embodiment of the electrical module shown in FIG. 9;
FIG. 12 is a front or back view of the third embodiment of the electrical module shown in FIG. 9;
FIG. 13 is a top or bottom perspective view of a fourth embodiment of an electrical module in accordance with the present invention;
FIG. 14 is a top or bottom view of the fourth embodiment of the electrical module shown in FIG. 13;
FIG. 15 is a left or right side view of the fourth embodiment of the electrical module shown in FIG. 13; and,
FIG. 16 is a front or back view of the fourth embodiment of the electrical module shown in FIG. 13.
The broken lines in the drawings illustrate portions of the electrical module that form no part of the claimed design.
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Apr 01 2016 | FENG, BIN | MEIKE TECHNOLOGY BEIJING LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 038228 | /0379 |
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Apr 01 2016 | LI, XI | MEIKE TECHNOLOGY BEIJING LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 038228 | /0379 |
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Apr 01 2016 | WANG, ZHENSHAN | MEIKE TECHNOLOGY BEIJING LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 038228 | /0379 |
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Apr 01 2016 | PAN, KEJIA | MEIKE TECHNOLOGY BEIJING LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 038228 | /0379 |
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Apr 01 2016 | HU, JIAN | MEIKE TECHNOLOGY BEIJING LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 038228 | /0379 |
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Apr 01 2016 | FENG, BIN | MICRODUINO INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 038228 | /0379 |
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Apr 01 2016 | LI, XI | MICRODUINO INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 038228 | /0379 |
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Apr 01 2016 | WANG, ZHENSHAN | MICRODUINO INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 038228 | /0379 |
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Apr 01 2016 | PAN, KEJIA | MICRODUINO INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 038228 | /0379 |
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Apr 01 2016 | HU, JIAN | MICRODUINO INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 038228 | /0379 |
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Apr 08 2016 | | MEIKE TECHNOLOGY (BEIJING) LTD. | (assignment on the face of the patent) | | / |
Apr 08 2016 | | MICRODUINO INC. | (assignment on the face of the patent) | | / |