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Patent
D940669
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Priority
Nov 19 2018
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Filed
May 17 2019
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Issued
Jan 11 2022
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Expiry
Jan 11 2037
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Assg.orig
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Entity
unknown
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1
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15
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n/a
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We claim the ornamental design for a boat for substrate processing apparatus, as shown and described.
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FIG. 1 is a front, top and right side perspective view of a boat for substrate processing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof.
FIG. 8 is an enlarged cross-sectional view take along line 8-8 in FIG. 2 thereof;
FIG. 9 is an enlarged cross-sectional view take along line 9-9 in FIG. 2 thereof;
FIG. 10 is an enlarged portion view taken along line 10-10 in FIG. 2. thereof;
FIG. 11 is an enlarged cross-sectional view take along line 11-11 in FIG. 8 thereof; and,
FIG. 12 is an enlarged perspective view, which looked at the part shown by the solid line from the upper part.
The dashed-dot-dashed lines represent the boundary lines of the claimed design.
The broken lines are included for the purpose of illustrating portions of the article that form no part of the claimed design.
Fujii, Satoshi, Sambu, Makoto, Tsuri, Makoto
Patent |
Priority |
Assignee |
Title |
D853979, |
Dec 27 2017 |
KOKUSAI ELECTRIC CORPORATION |
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D857021, |
May 25 2016 |
TDK Corporation |
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D858467, |
Jan 05 2017 |
Rohm Co., Ltd. |
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Feb 20 2015 |
MICRODUINO INC. |
Electrical module |
D866469, |
Nov 23 2015 |
MICRODUINO INC.; MEIKE TECHNOLOGY (BEIJING) LTD. |
Electrical module |
D872038, |
Jul 18 2018 |
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LED chips on a printed circuit board |
D873782, |
May 17 2016 |
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Component carrier plate |
D873783, |
Oct 19 2018 |
|
LED chip |
D892754, |
Jun 04 2018 |
Semikron Elektronik GmbH & Co. KG |
Power module |
D893438, |
Aug 21 2017 |
Tokyo Electron Limited |
Wafer boat |
D906273, |
Nov 07 2018 |
ROHM CO , LTD |
Semiconductor device |
D911298, |
Feb 17 2017 |
STAT PEEL AG |
Chip |
D911986, |
May 03 2019 |
Raytheon Company |
Handheld semiconductor wafer handling tool |
JP1052358, |
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|
|
JP1302035, |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a