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Patent
D879724
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Priority
Jul 24 2017
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Filed
May 11 2018
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Issued
Mar 31 2020
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Expiry
Mar 31 2035
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Assg.orig
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Entity
unknown
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7
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34
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n/a
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The ornamental design for a contact wafer, as shown and described.
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FIG. 1 is a top, front, and right side perspective view of a contact wafer showing our new design;
FIG. 2 is a top, back, and left side perspective view thereof;
FIG. 3 is a left side elevation view thereof;
FIG. 4 is a right side elevation view thereof;
FIG. 5 is a front elevation view thereof;
FIG. 6 is a back elevation view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.
Buck, Jonathan E., Mongold, John A.
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SAMTEC, INC. |
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SAMTEC, INC. |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a