Patent
   D823814
Priority
Jul 24 2017
Filed
Jul 24 2017
Issued
Jul 24 2018
Expiry
Jul 24 2033
Assg.orig
Entity
unknown
19
5
n/a
The ornamental design for contact wafer, as shown and described.

FIG. 1 is a top, front, and right side perspective view of a contact wafer showing our new design;

FIG. 2 is a top, back, and left side perspective view thereof;

FIG. 3 is a left side elevation view thereof;

FIG. 4 is a right side elevation view thereof;

FIG. 5 is a front elevation view thereof;

FIG. 6 is a back elevation view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

Buck, Jonathan E., Mongold, John A.

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 21 2017BUCK, JONATHAN E SAMTEC, INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0430900024 pdf
Jul 24 2017SAMTEC, INC.(assignment on the face of the patent)
Jul 24 2017MONGOLD, JOHN A SAMTEC, INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0430900024 pdf
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