Patent
   D881133
Priority
Dec 20 2018
Filed
Dec 20 2018
Issued
Apr 14 2020
Expiry
Apr 14 2035
Assg.orig
Entity
unknown
9
36
n/a
The ornamental design for contact wafer, as shown and described.

FIG. 1 is a top, front, and right side perspective view of a contact wafer showing our new design;

FIG. 2 is a bottom, back, and left side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a back view thereof;

FIG. 5 is a left thereof;

FIG. 6 is a right view thereof;

FIG. 7 is a top view thereof; and,

FIG. 8 is a bottom view thereof.

Buck, Jonathan E., Mongold, John A.

Patent Priority Assignee Title
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D909312, Nov 08 2018 FUDING PRECISION COMPONENTS (SHENZHEN) CO., LTD.; FOXCONN INTERCONNECT TECHNOLOGY LIMITED Electrical contact
D926701, May 31 2019 STARCONN ELECTRONIC SU ZHOU CO , LTD Electrical connector
D941780, Dec 20 2018 SAMTEC, INC. Contact wafer
D967031, Jan 08 2018 SAMTEC, INC. Electrical cable connector
D973599, Dec 20 2018 SAMTEC, INC. Contact wafer
ER1397,
ER8273,
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Dec 18 2018BUCK, JONATHAN E SAMTEC, INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0478260584 pdf
Dec 18 2018MONGOLD, JOHN A SAMTEC, INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0478260584 pdf
Dec 20 2018SAMTEC, INC.(assignment on the face of the patent)
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