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Patent
D929534
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Priority
Apr 25 2019
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Filed
Oct 23 2019
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Issued
Aug 31 2021
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Expiry
Aug 31 2036
TERM.DISCL.
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Assg.orig
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Entity
unknown
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1
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8
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n/a
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The ornamental design for a liquid discharge nozzle for semiconductor substrate processing apparatus, as shown and described herein.
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FIG. 1 a front, top perspective view of a liquid discharge nozzle for semiconductor substrate processing apparatus;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left-side elevational view thereof;
FIG. 5 is a right-side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Amano, Yoshifumi, Aiura, Kazuhiro
Patent |
Priority |
Assignee |
Title |
D341418, |
Feb 22 1991 |
Tokyo Electron Limited; Tokyo Electron Kyushu Limited |
Supply nozzle for applying liquid resist to a semiconductor wafer |
D636845, |
Jan 27 2010 |
Sintokogio, Ltd |
Nozzle for an air blast process |
D637267, |
Jan 27 2010 |
Sintokogio, Ltd |
Nozzle for an air blast process |
D823906, |
Apr 13 2017 |
OERLIKON METCO US INC |
Powder injector |
D824966, |
Oct 14 2016 |
OERLIKON METCO (US) INC.; OERLIKON METCO US INC |
Powder injector |
D903836, |
May 29 2019 |
CAREFUSION 303, INC |
Y-spigot body |
D906485, |
Sep 27 2017 |
Natural Gas Solutions North America, LLC |
Shaft seal |
D907744, |
Aug 01 2018 |
Lutz Pumpen GmbH |
Dispenser nozzle |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a