Patent
   D929534
Priority
Apr 25 2019
Filed
Oct 23 2019
Issued
Aug 31 2021
Expiry
Aug 31 2036

TERM.DISCL.
Assg.orig
Entity
unknown
1
8
n/a
The ornamental design for a liquid discharge nozzle for semiconductor substrate processing apparatus, as shown and described herein.

FIG. 1 a front, top perspective view of a liquid discharge nozzle for semiconductor substrate processing apparatus;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left-side elevational view thereof;

FIG. 5 is a right-side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Amano, Yoshifumi, Aiura, Kazuhiro

Patent Priority Assignee Title
D960300, Sep 18 2019 P BEKKERS HOLDING B V Nozzle for fluid distribution
Patent Priority Assignee Title
D341418, Feb 22 1991 Tokyo Electron Limited; Tokyo Electron Kyushu Limited Supply nozzle for applying liquid resist to a semiconductor wafer
D636845, Jan 27 2010 Sintokogio, Ltd Nozzle for an air blast process
D637267, Jan 27 2010 Sintokogio, Ltd Nozzle for an air blast process
D823906, Apr 13 2017 OERLIKON METCO US INC Powder injector
D824966, Oct 14 2016 OERLIKON METCO (US) INC.; OERLIKON METCO US INC Powder injector
D903836, May 29 2019 CAREFUSION 303, INC Y-spigot body
D906485, Sep 27 2017 Natural Gas Solutions North America, LLC Shaft seal
D907744, Aug 01 2018 Lutz Pumpen GmbH Dispenser nozzle
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 23 2019Tokyo Electron Limited(assignment on the face of the patent)
Oct 28 2019AMANO, YOSHIFUMITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0513690052 pdf
Oct 28 2019AIURA, KAZUHIROTokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0513690052 pdf
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