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The ornamental design for supply nozzle for applying liquid resist to a semiconductor wafer, as shown and described. |
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FIG. 1 is a top, front and left side perspective view of supply nozzle for applying liquid resist to a semiconductor wafer showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a front elevational view thereof, the rear being a mirror image;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a cross-sectional view thereof taken on line 7--7 in FIG. 3; and,
FIG. 8 is a cross-sectional view thereof taken on line 8--8 in FIG. 2.
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| Aug 21 1991 | Tokyo Electron Limited | (assignment on the face of the patent) | / | |||
| Aug 21 1991 | Tokyo Electron Kyushu Limited | (assignment on the face of the patent) | / | |||
| Aug 29 1991 | AKIMOTO, MASAMI | Tokyo Electron Limited | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006653 | /0821 | |
| Aug 29 1991 | AKIMOTO, MASAMI | Tokyo Electron Kyushu Limited | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006653 | /0821 |
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