Patent
   D930796
Priority
Jun 08 2020
Filed
Aug 03 2020
Issued
Sep 14 2021
Expiry
Sep 14 2036

TERM.DISCL.
Assg.orig
Entity
unknown
0
8
n/a
The ornamental design for a liquid discharge nozzle for semiconductor substrate processing apparatus, as shown and described.

FIG. 1 is a front, top perspective view of a liquid discharge nozzle for semiconductor substrate processing apparatus showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left-side elevational view thereof;

FIG. 5 is a right-side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Amano, Yoshifumi, Aiura, Kazuhiro

Patent Priority Assignee Title
Patent Priority Assignee Title
D341418, Feb 22 1991 Tokyo Electron Limited; Tokyo Electron Kyushu Limited Supply nozzle for applying liquid resist to a semiconductor wafer
D636845, Jan 27 2010 Sintokogio, Ltd Nozzle for an air blast process
D637267, Jan 27 2010 Sintokogio, Ltd Nozzle for an air blast process
D823906, Apr 13 2017 OERLIKON METCO US INC Powder injector
D824966, Oct 14 2016 OERLIKON METCO (US) INC.; OERLIKON METCO US INC Powder injector
D903836, May 29 2019 CAREFUSION 303, INC Y-spigot body
D906485, Sep 27 2017 Natural Gas Solutions North America, LLC Shaft seal
D907744, Aug 01 2018 Lutz Pumpen GmbH Dispenser nozzle
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 03 2020Tokyo Electron Limited(assignment on the face of the patent)
Aug 11 2020AMANO, YOSHIFUMITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0535910502 pdf
Aug 11 2020AIURA, KAZUHIROTokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0535910502 pdf
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