PTO Wrapper PDF
Dossier Espace Google
Patent
   D958764
Priority
Jan 07 2019
Filed
May 04 2021
Issued
Jul 26 2022
Expiry
Jul 26 2037
Inventors
Kim, Sam
Assg.orig
ASM IP HOL…
Assg.curr
ASM IP Hol…
Entity
unknown
Referenced by
8
References
161
Maint.:
n/a
The ornamental design for a higher temperature vented susceptor, as shown and described.

FIG. 1 is a front perspective view of a higher temperature vented susceptor, showing our new design;

FIG. 2 is a back perspective view thereof;

FIG. 3 is a left side view thereof; and,

FIG. 4 is a right side view thereof.

The dash-dash lines in FIGS. 1-4 form no part of the claimed design.
INVENTORS:

Kim, Sam, Rokkam, Uday Kiran, Rathi, Saket, Bian, Dakai

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
11764101, Oct 24 2019 ASM IP Holding, B.V. Susceptor for semiconductor substrate processing
D980813, May 11 2021 ASM IP HOLDING B V Gas flow control plate for substrate processing apparatus
D980814, May 11 2021 ASM IP HOLDING B V Gas distributor for substrate processing apparatus
D989012, Sep 17 2020 Ebara Corporation Elastic membrane
ER1441,
ER3967,
ER6966,
ER8863,
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
10068791, Mar 08 2013 DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT Wafer susceptor for forming a semiconductor device and method therefor
10376916, Mar 30 2012 Applied Materials, Inc Substrate processing system having susceptorless substrate support with enhanced substrate heating control
11018047, Jan 25 2018 ASM IP Holding B.V. Hybrid lift pin
3407783,
3549847,
3641974,
3796182,
4499354, Oct 06 1982 General Instrument Corporation; GENERAL SEMICONDUCTOR, INC Susceptor for radiant absorption heater system
4522149, Nov 21 1983 General Instrument Corporation; GENERAL SEMICONDUCTOR, INC Reactor and susceptor for chemical vapor deposition process
4560420, Jun 13 1984 AT&T Technologies, Inc. Method for reducing temperature variations across a semiconductor wafer during heating
4710428, Mar 10 1986 Toshiba Ceramics Co., Ltd. Sintered silicon carbide porous body impregnated with metallic silicon
4821674, Mar 31 1987 ASM America, Inc Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment
4958061, Jun 27 1988 Tokyo Electron Limited Method and apparatus for heat-treating a substrate
4978567, Mar 31 1988 SGL Carbon, LLC Wafer holding fixture for chemical reaction processes in rapid thermal processing equipment and method for making same
4986215, Sep 01 1988 Sumitomo Mitsubishi Silicon Corporation Susceptor for vapor-phase growth system
4990374, Nov 28 1989 Rohm and Haas Chemicals LLC Selective area chemical vapor deposition
5033407, Feb 14 1989 Anelva Corporation Low pressure vapor phase growth apparatus
5044943, Aug 16 1990 Applied Materials, Inc. Spoked susceptor support for enhanced thermal uniformity of susceptor in semiconductor wafer processing apparatus
5071670, Jun 11 1990 Method for chemical vapor deposition under a single reactor vessel divided into separate reaction chambers each with its own depositing and exhausting means
5074017, Jan 13 1989 TOSHIBA CERAMICS CO , LTD Susceptor
5098198, Apr 19 1990 Applied Materials, Inc. Wafer heating and monitor module and method of operation
5108792, Mar 09 1990 Applied Materials, Inc Double-dome reactor for semiconductor processing
5119540, Jul 24 1990 Cree, Inc Apparatus for eliminating residual nitrogen contamination in epitaxial layers of silicon carbide and resulting product
5119541, Jan 28 1987 Foundation for Advancement of International Science Wafer succeptor apparatus
5121531, Jul 06 1990 Applied Materials, Inc. Refractory susceptors for epitaxial deposition apparatus
5156820, May 15 1989 STEAG CVD SYSTEMS, LTD Reaction chamber with controlled radiant energy heating and distributed reactant flow
5188501, Apr 27 1990 Shin-Etsu Handotai Co., Ltd. Wafer transfer system
5199483, May 15 1991 Applied Materials, Inc.; APPLIED MATERIALS, INC A CORP OF DELAWARE Method and apparatus for cooling wafers
5200157, Feb 17 1986 Toshiba Ceramics Co., Ltd. Susceptor for vapor-growth deposition
5242501, Sep 10 1982 Lam Research Corporation Susceptor in chemical vapor deposition reactors
5292554, Nov 12 1992 Applied Materials, Inc. Deposition apparatus using a perforated pumping plate
5298465, Aug 16 1990 Applied Materials, Inc. Plasma etching system
5304248, Dec 05 1990 Applied Materials, Inc. Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions
5306699, Aug 31 1988 SUPERCONDUCTOR TECHNOLOGIES, INC , A CORP OF CALIFORNIA Reactor vessel for manufacture of superconducting films
5308645, Aug 07 1992 Delphi Technologies Inc Method and apparatus for through hole substrate printing
5332442, Nov 15 1991 Tokyo Electron Kabushiki Kaisha Surface processing apparatus
5343938, Dec 24 1992 VLSI Technology, Inc Method and apparatus for thermally insulating a wafer support
5354715, Jan 23 1991 Applied Materials, Inc. Thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process
5356486, Mar 04 1991 APPLIED MATERIALS, INC , Combined wafer support and temperature monitoring device
5370739, Jun 15 1992 Tokyo Electron Limited Rotating susceptor semiconductor wafer processing cluster tool module useful for tungsten CVD
5383971, Oct 12 1990 Genus, Inc. Differential pressure CVD chuck
5393349, Aug 16 1991 Tokyo Electron Limited Semiconductor wafer processing apparatus
5403401, Mar 04 1993 XYCARB B V A DUTCH CORPORATION Substrate carrier
5421893, Feb 26 1993 Applied Materials, Inc. Susceptor drive and wafer displacement mechanism
5427620, Mar 31 1987 ASM America, Inc Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment
5444217, Jan 21 1993 MOORE EPITAXIAL INC Rapid thermal processing apparatus for processing semiconductor wafers
5455069, Jun 01 1992 Motorola, Inc. Method of improving layer uniformity in a CVD reactor
5456757, May 27 1993 Applied Materials, Inc Susceptor for vapor deposition
5461214, Jun 15 1992 THERMTEC, INC A CORPORATION OF CA High performance horizontal diffusion furnace system
5467220, Feb 18 1994 Applied Materials, Inc.; Applied Materials, Inc Method and apparatus for improving semiconductor wafer surface temperature uniformity
5492566, Feb 08 1993 LAM RESEARCH AG Support for disk-shaped articles using the Bernoulli principle
5514439, Oct 14 1994 COORSTEK, INC , A DELAWARE CORPORATION Wafer support fixtures for rapid thermal processing
5527393, Mar 19 1990 Kabushiki Kaisha Toshiba Vapor-phase deposition apparatus and vapor-phase deposition method
5549756, Feb 02 1994 Applied Materials, Inc.; Applied Materials, Inc Optical pyrometer for a thin film deposition system
5551985, Aug 18 1995 Applied Materials, Inc Method and apparatus for cold wall chemical vapor deposition
5558717, Nov 30 1994 Applied Materials, Inc CVD Processing chamber
5584936, Dec 14 1995 Rohm and Haas Chemicals LLC Susceptor for semiconductor wafer processing
5588827, Dec 17 1993 Brooks Automation Inc. Passive gas substrate thermal conditioning apparatus and method
5620525, Jul 16 1990 Novellus Systems, Inc Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate
5645646, Feb 25 1994 Applied Materials, Inc. Susceptor for deposition apparatus
5656093, Mar 08 1996 Applied Materials, Inc. Wafer spacing mask for a substrate support chuck and method of fabricating same
5683518, Jan 21 1993 MOORE EPITAXIAL INC Rapid thermal processing apparatus for processing semiconductor wafers
5690742, Feb 26 1996 KOMATSU ELECTRONIC METALS CO , LTD Susceptor for an epitaxial growth apparatus
5700725, Jun 26 1995 Bell Semiconductor, LLC Apparatus and method for making integrated circuits
5738165, May 07 1993 Nikon Corporation Substrate holding apparatus
5761023, Apr 25 1996 Applied Materials, Inc. Substrate support with pressure zones having reduced contact area and temperature feedback
5800622, Jul 21 1995 Mitsubishi Denki Kabushiki Kaisha Vapor-phase growth apparatus and compound semiconductor device fabricated thereby
5803977, Jun 02 1995 Applied Materials, Inc Apparatus for full wafer deposition
5834737, May 12 1995 Tokyo Electron Limited Heat treating apparatus
5895530, Feb 26 1996 Applied Materials, Inc. Method and apparatus for directing fluid through a semiconductor processing chamber
5938850, Aug 04 1995 Tokyo Electron Limited Single wafer heat treatment apparatus
5960159, Oct 14 1997 KOKUSAI ELECTRIC CO , LTD Heat treatment of semiconductor wafers where upper heater directly heats upper wafer in its entirety and lower heater directly heats lower wafer in its entirety
6001183, Jun 10 1996 Veeco Instruments INC Wafer carriers for epitaxial growth processes
6020212, Jun 09 1995 CIS Bio International Phycobiliprotein-linker peptide complex fluorescent tracer and methods of using the same
6077357, May 29 1997 Applied Materials, Inc Orientless wafer processing on an electrostatic chuck
6086680, Aug 22 1995 ASM America, Inc Low-mass susceptor
6090212, Aug 15 1997 Kokusai Semiconductor Equipment Corporation Substrate platform for a semiconductor substrate during rapid high temperature processing and method of supporting a substrate
6093252, Aug 03 1995 ASM America, Inc Process chamber with inner support
6167834, Jun 13 1990 Applied Materials, Inc. Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process
6293749, Nov 21 1997 ASM America, Inc Substrate transfer system for semiconductor processing equipment
6325858, Nov 03 1997 ADVANCED SEMICONDUCTOR MATERIALS AMERICA, INC Long life high temperature process chamber
6331023, Jan 14 2000 ASM America, Inc. Gridded substrate transport spatula
6343183, Sep 01 1995 ASM America, Inc. Wafer support system
6394797, Apr 02 1997 Hitachi, Ltd. Substrate temperature control system and method for controlling temperature of substrate
6402850, Jan 13 1993 Applied Materials, Inc. Depositing polysilicon films having improved uniformity and apparatus therefor
6464790, Jul 11 1997 Applied Materials, Inc Substrate support member
6608287, Aug 03 1995 ASM America, Inc. Process chamber with rectangular temperature compensation ring
6634882, Dec 22 2000 ASM IP HOLDING B V Susceptor pocket profile to improve process performance
6709267, Dec 27 2002 ASM IP HOLDING B V Substrate holder with deep annular groove to prevent edge heat loss
6893507, Nov 03 1997 ASM America, Inc. Self-centering wafer support system
7033445, Dec 27 2001 ASM IP HOLDING B V Gridded susceptor
7601224, Mar 08 2002 ASM IP HOLDING B V Method of supporting a substrate in a gas cushion susceptor system
7602224, May 16 2007 Hynix Semiconductor, Inc. Semiconductor device having delay locked loop and method for driving the same
7648579, Feb 13 2004 ASM IP HOLDING B V Substrate support system for reduced autodoping and backside deposition
7722441, Oct 07 2005 TOKAI CARBON CO , LTD Semiconductor processing
7740703, Mar 18 2003 Sumitomo Chemical Company, Limited Semiconductor film formation device
8088225, Feb 13 2004 ASM IP HOLDING B V Substrate support system for reduced autodoping and backside deposition
8366830, Mar 04 2003 Cree, Inc Susceptor apparatus for inverted type MOCVD reactor
8394229, Aug 07 2008 ASM IP HOLDING B V Susceptor ring
8801857, Oct 31 2008 ASM IP HOLDING B V Self-centering susceptor ring assembly
9558985, Mar 28 2012 ACM RESEARCH SHANGHAI INC Vacuum chuck
9633889, Mar 06 2013 Applied Materials, Inc Substrate support with integrated vacuum and edge purge conduits
20020011211,
20020043337,
20030000472,
20030049580,
20040060512,
20040229002,
20050092439,
20050284372,
20060057826,
20090280248,
20100031884,
20100107974,
20130109192,
20160133504,
20180094350,
20190355612,
20200234996,
20200373187,
20210125853,
D404370, Aug 20 1997 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
D496008, Dec 12 2002 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
D525127, Mar 01 2004 Societe des Produits Nestle S A Susceptor ring
D600223, Aug 07 2008 ASM IP HOLDING B V Susceptor ring
D743357, Mar 01 2013 ASM IP Holding B.V.; ASM IP HOLDING B V Susceptor
D784276, Aug 06 2013 Applied Materials, Inc Susceptor assembly
D830981, Apr 07 2017 ASM IP HOLDING B V ; ASM IP Holding B.V. Susceptor for semiconductor substrate processing apparatus
D864134, Oct 24 2018 ASM IP Holding B.V. Susceptor
D914620, Jan 17 2019 ASM IP Holding B.V. Vented susceptor
D920936, Jan 17 2019 ASM IP Holding B.V. Higher temperature vented susceptor
EP339279,
EP445596,
EP448346,
EP634785,
EP669640,
EP766289,
EP840358,
GB2181458,
JP1422195,
JP1547357,
JP1570747,
JP1570748,
JP2000269310,
JP2002184843,
JP2002526915,
JP2003124167,
JP2006228802,
JP2007502022,
JP758039,
KR100460338,
KR1019990069084,
KR1020070098025,
KR19990069091,
TW111900,
TW136587,
TW184695,
TW191199,
WO2010016964,
WO9630713,
WO9708743,
ASSIGNMENT RECORDS    Assignment records on the USPTO
/////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 10 2019BIAN, DAKAIASM IP HOLDING B V ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0573820895 pdf
Jan 11 2019ROKKAM, UDAY KIRANASM IP HOLDING B V ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0573820895 pdf
Jan 16 2019KIM, SAMASM IP HOLDING B V ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0573820895 pdf
Jul 01 2019RATHI, SAKETASM IP HOLDING B V ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0573820895 pdf
May 04 2021ASM IP Holding B.V.(assignment on the face of the patent)
MAINTENANCE FEES AND DATES:    Maintenance records on the USPTO
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule