FIG. 1 is a front view of a heater block for bonding apparatus showing my new design;
FIG. 2 is a back view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right view thereof;
FIG. 6 is a left view thereof;
FIG. 7 is a front perspective view thereof;
FIG. 8 is a back perspective view;
FIG. 9 is a transverse sectional view taken along the line 9-9 in FIG. 1;
FIG. 10 is a transverse sectional view taken along the line 10-10 in FIG. 1;
FIG. 11 is a transverse sectional view taken along the line 11-11 in FIG. 1;
FIG. 12 is a transverse sectional view taken along the line 12-12 in FIG. 1;
FIG. 13 is a transverse sectional view taken along the line 13-13 in FIG. 1;
FIG. 14 is a longitudinal sectional view taken along the line 14-14 in FIG. 1;
FIG. 15 is a longitudinal sectional view taken along the line 15-15 in FIG. 1;
FIG. 16 is a longitudinal sectional view taken along the line 16-16 in of FIG. 1;
FIG. 17 is a transverse sectional view taken along the line 17-17 in FIG. 3; and,
FIG. 18 is a longitudinal sectional perspective view taken along the line 18-18 in FIG. 1.
The dash-dash broken line portions of the night light in FIGS. 1-18 represent unclaimed portions of the claimed design and form no part thereof. The alternating long and short dash broken line shown in FIGS. 1, 3, 4, 7, 8, and 18 represent the boundary of the claimed design and form no part thereof.
Patent |
Priority |
Assignee |
Title |
10087525, |
Aug 04 2015 |
ASM IP Holding B.V. |
Variable gap hard stop design |
4286564, |
Nov 21 1979 |
|
System for preheating fuel |
5281794, |
May 25 1990 |
Kabushiki Kaisha Shinkawa |
Heater block for use in a bonder utilizing vacuum suction attachment means |
5306664, |
May 16 1991 |
Seiko Epson Corporation |
Semiconductor device, method of forming bump electrode of a semiconductor device, method of packaging a semiconductor device, chip carrier tape, display device and electronic printing device incorporating the semiconductor device |
5531835, |
May 18 1994 |
Applied Materials, Inc |
Patterned susceptor to reduce electrostatic force in a CVD chamber |
5653375, |
Oct 29 1994 |
HANWHA TECHWIN CO , LTD |
Wire bonding apparatus |
5810933, |
Feb 16 1996 |
Novellus Systems, Inc |
Wafer cooling device |
6394797, |
Apr 02 1997 |
Hitachi, Ltd. |
Substrate temperature control system and method for controlling temperature of substrate |
6634882, |
Dec 22 2000 |
ASM IP HOLDING B V |
Susceptor pocket profile to improve process performance |
6709267, |
Dec 27 2002 |
ASM IP HOLDING B V |
Substrate holder with deep annular groove to prevent edge heat loss |
7993462, |
Mar 19 2008 |
ASM JAPAN K K |
Substrate-supporting device having continuous concavity |
9022064, |
May 10 2012 |
|
Dual fuel control device with auxiliary backline pressure regulator |
9607822, |
Apr 21 2014 |
Lam Research Corporation |
Pretreatment method for photoresist wafer processing |
20020162630, |
|
|
|
20050274708, |
|
|
|
20060011298, |
|
|
|
20120318853, |
|
|
|
D529057, |
Aug 16 2004 |
MATERION ADVANCED MATERIALS TECHNOLOGIES AND SERVICES INC |
Sputtering target |
D643055, |
Sep 11 2008 |
ASM Japan K.K. |
Heater block for use in a semiconductor processing tool |
D724196, |
Dec 17 2013 |
STINGRAY GROUP, LLC |
Heater block for pressure digestion vessels |
D725168, |
Feb 04 2014 |
ASM IP Holding B.V. |
Heater block |
D726884, |
Feb 04 2014 |
ASM IP Holding B.V.; ASM IP HOLDING B V |
Heater block |
D799646, |
Aug 30 2016 |
ASM IP Holding B.V.; ASM IP HOLDING B V |
Heater block |
D807921, |
Mar 05 2015 |
|
Fuel heater block |
D830981, |
Apr 07 2017 |
ASM IP HOLDING B V ; ASM IP Holding B.V. |
Susceptor for semiconductor substrate processing apparatus |
D859484, |
Jun 12 2017 |
ASM IP Holding B.V.; ASM IP HOLDING B V |
Heater block |
D873782, |
May 17 2016 |
Electro Scientific Industries, Inc |
Component carrier plate |
D927575, |
Jan 18 2019 |
Shinkawa Ltd |
Heater block for bonding apparatus |