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Patent
D982537
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Priority
Mar 15 2021
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Filed
Sep 14 2021
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Issued
Apr 04 2023
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Expiry
Apr 04 2038
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Assg.orig
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Entity
unknown
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0
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13
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n/a
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The ornamental design for a separator of substrate processing apparatus, as shown and described.
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FIG. 1 is a front, top and right side perspective view of a separator of substrate processing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a cross sectional view taken along line 8-8 in FIG. 2.
Morita, Shinya, Murata, Satoru, Nakashima, Seiyo
Patent |
Priority |
Assignee |
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Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
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Maintenance Fee Events |
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