A lock in pinned photodiode photodetector includes a plurality of output ports which are sequentially enabled. Each time when the output port is enabled is considered to be a different bin of time. A specified pattern is sent, and the output bins are investigated to look for that pattern. The time when the pattern is received indicates the time of flight. A cmos active pixel image sensor includes a plurality of pinned photodiode photodetectors that use a common output transistor. In one configuration, the charge from two or more pinned photodiodes may be binned together and applied to the gate of an output transistor.
|
0. 58. A method comprising:
exposing a cmos active pixel imager to light;
generating signals responsive to the light in an array of pixels of the imager using photodiodes and in-pixel buffer transistors, comprising the steps of:
activating a first transfer transistor to transfer charge from a first photodiode in a first row of the array to a gate of an in-pixel buffer transistor of the image sensor;
activating a second transfer transistor to transfer charge from a second photodiode in a second row of the array to the gate;
activating a third transfer transistor to transfer charge from a third photodiode in a third row of the array to the gate; and
activating a fourth transfer transistor to transfer charge from a fourth photodiode in a fourth row of the array to the gate.
0. 40. A method comprising:
enabling a cmos active pixel image sensor to be exposed to light, wherein first, second, third, and fourth pinned photodiodes disposed in first, second, third, and fourth adjacent rows of photodiodes, respectively, of the cmos active pixel image sensor are configured to generate first, second, third, and fourth charges upon exposure to the light, respectively;
enabling the first charge to be transferred to a gate of an output transistor via a first transfer transistor between the first pinned photodiode and the gate;
enabling the second charge to be transferred to the gate via a second transfer transistor between the second pinned photodiode and the gate;
enabling the third charge to be transferred to the gate via a third transfer transistor between the third pinned photodiode and the gate; and
enabling the fourth charge to be transferred to the gate via a fourth transfer transistor between the fourth pinned photodiode and the gate.
0. 33. A method comprising:
accumulating charge in a first pinned photodiode of a first pixel that occupies a first row of an array of pixels of a cmos active pixel imager comprising in-pixel buffer transistors;
transferring charge from the first pinned photodiode directly to a first diffusion region via a first transistor;
accumulating charge in a second pinned photodiode of a second pixel that occupies a second row, below the first row, of the array;
transferring charge from the second pinned photodiode directly to the first diffusion region via a second transistor;
accumulating charge in a third pinned photodiode of a third pixel that occupies a third row, below the second row, of the array;
transferring charge from the third pinned photodiode directly to a second diffusion region, separate from the first diffusion region, via a third transistor;
accumulating charge in a fourth pinned photodiode of a fourth pixel that occupies a fourth row, below the third row, of the array;
transferring charge from the fourth pinned photodiode directly to the second diffusion region via a fourth transistor;
applying charge from the first diffusion region to a gate of a fifth transistor coupled between a supply voltage and an output; and
applying charge from the second diffusion region to the gate of the fifth transistor, wherein the fifth transistor is common to the first, second, third, and fourth pixels.
0. 26. A method comprising:
providing an array of pixels of a cmos active pixel image sensor, the array comprising a plurality of rows of pinned photodiodes and a plurality of columns of pinned photodiodes, and including first, second, third, and fourth pinned photodiodes in first, second, third, and fourth different rows, respectively, of the plurality of rows;
providing an in-pixel buffer transistor comprising a gate and coupled between a supply voltage and an output node, wherein the buffer transistor is configured to control a transfer of charge between the supply voltage and the output node in accordance with a voltage applied to the gate;
providing a first transfer transistor coupled between the first pinned photodiode and the gate, wherein the first transfer transistor is configured to control a transfer of charge between the first pinned photodiode and the gate;
providing a second transfer transistor coupled between the second pinned photodiode and the gate, wherein the second transfer transistor is configured to control a transfer of charge between the second pinned photodiode and the gate;
providing a third transfer transistor coupled between a third pinned photodiode and the gate, wherein the third transfer transistor is configured to control a transfer of charge between the third pinned photodiode and the gate;
providing a fourth transfer transistor coupled between a fourth pinned photodiode and the gate, wherein the fourth transfer transistor is configured to control a transfer of charge between the fourth pinned photodiode and the gate; and
providing a reset transistor coupled to the gate, wherein when the reset transistor is enabled, charge is transferred to the gate.
0. 48. A method comprising:
providing a device containing a cmos active pixel image sensor, the sensor comprising an array of pixels and a plurality of pinned photodiodes arranged in rows including at least first, second, third, and fourth separate rows of photodiodes, each pixel including at least one pinned photodiode, the device configured to expose the cmos active pixel image sensor to light, in response to which each pinned photodiode of the plurality of pinned photodiodes is to generate charge;
providing a first circuit configured to operate a gate of a first n-channel transfer transistor coupled between a first pinned photodiode of the first row of the plurality of pinned photodiodes and a gate of an n-channel in-pixel buffer transistor, wherein the buffer transistor is coupled between a supply voltage and an output;
providing a second circuit configured to operate a gate of a second n-channel transfer transistor coupled between a second pinned photodiode of the second row of the plurality of pinned photodiodes and the gate of the buffer transistor;
providing a third circuit configured to operate a gate of a third n-channel transfer transistor coupled between a third pinned photodiode of the third row of the plurality of pinned photodiodes and the gate of the buffer transistor;
providing a fourth circuit configured to operate a gate of a fourth n-channel transfer transistor coupled between a fourth pinned photodiode of the fourth row of the plurality of pinned photodiodes and the gate of the buffer transistor; and
providing a fifth circuit configured to operate a gate of an n-channel reset transistor coupled to the gate of the buffer transistor to reset a voltage on the gate of the buffer transistor.
0. 1. A method, comprising:
accumulating photocarriers in each of a plurality of photocarrier integrators and successively enabling each of said plurality of photocarrier integrators to connect to a common photodiode, each of said photocarrier integrators connecting to said common photodiode through a respective photodiode output port, said plurality of photocarrier integrators accumulating photocarriers generated by said photodiode during different time periods from one another.
0. 2. A method as in
0. 3. A method as in
0. 4. A method as an
0. 5. A method as in
0. 6. A method as in
0. 7. A method, comprising:
generating photocarriers in a photodiode within a pixel during a plurality of time periods;
accumulating photocarriers in each of a plurality of photocarrier integrators within said pixel such that each photocarrier integrator accumulates photocarriers generated during a time period different from a time period in which other photocarrier integrators accumulate photocarriers; and
sampling said photocarriers from said photocarrier integrators;
determining a range of an object using said sampled photocarriers.
0. 8. A method as in
0. 9. A method as in
0. 10. A method as in
0. 11. A method as in
0. 12. A method, comprising:
sampling a plurality of different samples of light in a photodiode, each of said plurality of different samples being 90 degrees out of phase with one another; and
successively gating photocarriers representing each of said different samples from said photodiode through a respective output port, each output port associated with a respective photocarrier integrator, such that each photocarrier integrator accumulates a different sample than other of said photocarrier integrators.
0. 13. A method as in
0. 14. A method as in
0. 15. A method as in
0. 16. A method of operating a range finding sensor, the method comprising;
providing a plurality of photodiodes, each photodiode having a first output port for switchably coupling each respective photodiode to a first photocarrier integrator in a same pixel as said photodiode and a second output port for switchably coupling each photodiode to a second photocarrier integrator in a same pixel as said photodiode;
generating first photocarriers in said photodiodes in response to light received during a first time period;
transferring said first photocarriers to respective first photocarrier integrators via said first output ports;
generating second photocarriers in said photodiodes in response to light received during a second time period; and
transferring said second photocarriers to respective second photocarrier integrators via said second output ports.
0. 17. The method of
0. 18. The method of
0. 19. The method of
0. 20. The method of
0. 21. The method of
0. 22. The method of
0. 23. The method of
generating third photocarriers in said photodiodes in response to light received during a third time period;
transferring said third photocarriers to respective third photocarrier integrators via said third output ports;
generating fourth photocarriers in said photodiodes in response to light received during a fourth time period; and
transferring said fourth photocarriers to respective fourth photocarrier integrators via said fourth output ports.
0. 24. The method of
0. 25. The method of
0. 27. The method of
0. 28. The method of
0. 29. The method of
0. 30. The method of
0. 31. The method of
providing a first charge collection region in a semiconductor material adjacent to the first and second pinned photodiodes, wherein the first transfer transistor is configured to control a transfer of charge between the first pinned photodiode and the first charge collection region and the second transfer transistor is configured to control a transfer of charge between the second pinned photodiode and the first charge collection region;
providing a second charge collection region in the semiconductor material adjacent to the third and fourth pinned photodiodes, wherein the third transfer transistor is configured to control a transfer of charge between the third pinned photodiode and the second charge collection region and the fourth transfer transistor is configured to control a transfer of charge between the fourth pinned photodiode and the second charge collection region; and
providing an electrical interconnect above the semiconductor material to couple the first region and the second region to the gate.
0. 32. The method of
0. 34. The method of
0. 35. The method of
0. 36. The method of
0. 37. The method of
0. 38. The method of
0. 39. The method of
0. 41. The method of
0. 42. The method of
0. 43. The method of
0. 44. The method of
0. 45. The method of
0. 46. The method of
0. 47. The method of
0. 49. The method of
0. 50. The method of
0. 51. The method of
0. 52. The method of
0. 53. The method of
0. 54. The method of
providing a first charge collection region in a semiconductor material adjacent to the first and second pinned photodiodes, wherein the first transfer transistor is configured to control a transfer of charge between the first pinned photodiode and the first charge collection region and the second transfer transistor is configured to control a transfer of charge between the second pinned photodiode and the first charge collection region; and
providing a second charge collection region, separate from the first region, in the semiconductor material adjacent to the third and fourth pinned photodiodes, wherein the third transfer transistor is configured to control a transfer of charge between the third pinned photodiode and the second charge collection region and the fourth transfer transistor is configured to control a transfer of charge between the fourth pinned photodiode and the second charge collection region.
0. 55. The method of
0. 56. The method of
0. 57. The method of
0. 59. The method of
0. 60. The method of
0. 61. The method of
0. 62. The method of
0. 63. The method of
0. 64. The method of
0. 65. The method of
|
where L1, L2, L3 and L4 are the amplititudes of the samples from the respective first, second, third and fourth integrators. These four phases are obtained from the four outputs of the photodiode.
The first pinned photodiode 100 is connected to an output drain 102 via gate 1, element 104. This receives the charge for the first bin. Similarly, gates 2, 3 and 4 are turned on to integrate/bin from the second, third and fourth periods.
It is important to obtain as much signal as possible from the photodiode. This can be done by using a large photodiode. However, it can take the electrons a relatively long time to escape from a large photodetector.
The present system divides the one larger photodiode into a number of smaller diodes, each with multiple output ports.
A number of subpixels are formed. Each includes a number of pinned photodiodes 200, each with four ports. Each of the corresponding ports are connected together in a way that allows summing the outputs of the photodiodes. For example, all the gate 1 control lines are connected together as shown. The outputs from all the port 1s are also summed, and output as a simple composite output. Similarly, ports 2, 3 and 4's are all summed.
Assuming the operation frequency of modulated light is 10 megahertz with a 25 nanosecond integration slot, the generator carrier has a time of flight within this limit. This resolution time constrains the size of the detector. In addition, the characteristic diffusion time in a semiconductor device is L2/D, where D is the diffusion coefficient. This time originates from the continuity equation and the diffusion equation, and defines how soon the steady state will be established in the area of size L. Hence, for a 10 cm square per second electron diffusion coefficient, the characteristic size of the pinned photodiode could be less than 5 microns.
Other embodiments are also contemplated to exist within this disclosure. For example, other numbers of output ports, e.g. 2-8, are possible. While this application describes using a pinned photodiode, similar operations could be carried out with other CMOS photodetectors, e.g., photodiodes and photogates.
Such modifications are intended to be encompassed within the following claims.
Fossum, Eric R., Berezin, Vladimir, Krymski, Alexander I.
Patent | Priority | Assignee | Title |
8829393, | Apr 18 2002 | Applied Materials, Inc. | Scanned laser light source |
8908063, | Mar 11 2013 | Texas Instruments Incorporated | Method and apparatus for a time-of-flight sensor with charge storage |
RE44482, | Aug 19 1998 | Round Rock Research, LLC | CMOS active image sensor with common pixel transistors and binning capability |
Patent | Priority | Assignee | Title |
4809075, | Oct 17 1986 | HITACHI, LTD , A CORP OF JAPAN | Solid-state imaging device having an amplifying means in the matrix arrangement of picture elements |
4827345, | Jul 17 1984 | Canon Kabushiki Kaisha | Image readout apparatus |
5043568, | Apr 11 1989 | Hamamatsu Photonics K. K. | Optical signal detector incorporating means for eluminating background light |
5099694, | May 19 1987 | Canon Kabushiki Kaisha | Vibration detecting apparatus |
5148268, | Apr 26 1991 | Xerox Corporation | Multiplexing arrangement for controlling data produced by a color images sensor array |
5172249, | May 31 1989 | Canon Kabushiki Kaisha | Photoelectric converting apparatus with improved switching to reduce sensor noises |
5179565, | Jun 07 1990 | HAMAMATSU PHOTONICS K K | Low noise pulsed light source utilizing laser diode and voltage detector device utilizing same low noise pulsed light source |
5262871, | Nov 13 1989 | Innolux Corporation | Multiple resolution image sensor |
5497390, | Jan 31 1992 | Nippon Telegraph and Telephone Corporation | Polarization mode switching semiconductor laser apparatus |
5635705, | Sep 11 1995 | NYTELL SOFTWARE LLC | Sensing and selecting observed events for signal processing |
5691486, | Jul 30 1996 | Siemens Healthcare Diagnostics Inc | Apparatus and methods for selecting a variable number of test sample aliquots to mix with respective reagents |
5717199, | Jan 26 1996 | CID TECHNOLOGIES, INC | Collective charge reading and injection in random access charge transfer devices |
5739562, | Aug 01 1995 | Bell Semiconductor, LLC | Combined photogate and photodiode active pixel image sensor |
5790191, | Mar 07 1996 | OmniVision Technologies, Inc | Method and apparatus for preamplification in a MOS imaging array |
5880495, | Jan 08 1998 | OmniVision Technologies, Inc | Active pixel with a pinned photodiode |
5898168, | Jun 12 1997 | GLOBALFOUNDRIES Inc | Image sensor pixel circuit |
5904493, | Apr 13 1995 | OmniVision Technologies, Inc | Active pixel sensor integrated with a pinned photodiode |
5936986, | Jul 30 1996 | Siemens Healthcare Diagnostics Inc | Methods and apparatus for driving a laser diode |
5949483, | Nov 16 1995 | California Institute of Technology | Active pixel sensor array with multiresolution readout |
5955753, | Aug 02 1995 | Canon Kabushiki Kaisha | Solid-state image pickup apparatus and image pickup apparatus |
5970115, | Nov 25 1997 | VAREX IMAGING CORPORATION | Multiple mode digital X-ray imaging system |
5973311, | Feb 12 1997 | Imation Corp | Pixel array with high and low resolution mode |
5986510, | Jan 09 1998 | PERKINELMER HOLDINGS, INC | Method and apparatus for amplifying input signals in one of multiple modes of resolution |
6043478, | Jun 25 1998 | Industrial Technology Research Institute | Active pixel sensor with shared readout structure |
6084229, | Mar 16 1998 | DYNAMAX IMAGING, LLC | Complimentary metal oxide semiconductor imaging device |
6100551, | Apr 13 1995 | OmniVision Technologies, Inc | Active pixel sensor integrated with a pinned photodiode |
6107655, | Aug 15 1997 | OmniVision Technologies, Inc | Active pixel image sensor with shared amplifier read-out |
6127697, | Nov 14 1997 | OmniVision Technologies, Inc | CMOS image sensor |
6160281, | Feb 28 1997 | OmniVision Technologies, Inc | Active pixel sensor with inter-pixel function sharing |
6233013, | Oct 23 1997 | Xerox Corporation | Color readout system for an active pixel image sensor |
6249618, | Dec 18 1998 | AMBIR TECHNOLOGY, INC | Circuit architecture and method for switching sensor resolution |
6252217, | Dec 18 1997 | Siemens Aktiengesellschaft | Device for imaging radiation |
6297070, | Dec 20 1996 | OmniVision Technologies, Inc | Active pixel sensor integrated with a pinned photodiode |
6377304, | Feb 05 1998 | Nikon Corporation | Solid-state image-pickup devices exhibiting faster video-frame processing rates, and associated methods |
6388243, | Mar 01 1999 | U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT | Active pixel sensor with fully-depleted buried photoreceptor |
6512546, | Jul 17 1998 | Analog Devices, Inc | Image sensor using multiple array readout lines |
6519371, | Sep 30 1999 | California Institute of Technology | High-speed on-chip windowed centroiding using photodiode-based CMOS imager |
6614479, | Sep 29 1997 | Sony Corporation | Solid-state image pickup device in-layer lens with antireflection film with intermediate index of refraction |
6657665, | Dec 31 1998 | OmniVision Technologies, Inc | Active Pixel Sensor with wired floating diffusions and shared amplifier |
6693670, | Jul 29 1999 | Vision - Sciences Inc | Multi-photodetector unit cell |
6731335, | May 08 1998 | Carl Zeiss AG | CMOS image sensor having common outputting transistors and method for driving the same |
6831690, | Dec 07 1999 | M-RED INC | Electrical sensing apparatus and method utilizing an array of transducer elements |
6977684, | Apr 30 1998 | Canon Kabushiki Kaisha | Arrangement of circuits in pixels, each circuit shared by a plurality of pixels, in image sensing apparatus |
20020180875, | |||
20050012836, | |||
EP616464, | |||
EP707417, | |||
JP2000152086, | |||
JP2001298177, | |||
JP4004681, | |||
JP4004682, | |||
JP5207376, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Mar 30 2009 | Round Rock Research, LLC | (assignment on the face of the patent) | / | |||
Dec 23 2009 | Micron Technology, Inc | Round Rock Research, LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 023786 | /0416 |
Date | Maintenance Fee Events |
Feb 22 2012 | M1552: Payment of Maintenance Fee, 8th Year, Large Entity. |
Date | Maintenance Schedule |
Apr 12 2014 | 4 years fee payment window open |
Oct 12 2014 | 6 months grace period start (w surcharge) |
Apr 12 2015 | patent expiry (for year 4) |
Apr 12 2017 | 2 years to revive unintentionally abandoned end. (for year 4) |
Apr 12 2018 | 8 years fee payment window open |
Oct 12 2018 | 6 months grace period start (w surcharge) |
Apr 12 2019 | patent expiry (for year 8) |
Apr 12 2021 | 2 years to revive unintentionally abandoned end. (for year 8) |
Apr 12 2022 | 12 years fee payment window open |
Oct 12 2022 | 6 months grace period start (w surcharge) |
Apr 12 2023 | patent expiry (for year 12) |
Apr 12 2025 | 2 years to revive unintentionally abandoned end. (for year 12) |