Provided is a substrate holder where an effect of a pressure of a plating solution can be suppressed. A substrate holder includes first and second holding members for sandwiching a substrate. The first holding member includes: a support base; a movable base for supporting the substrate; and a biasing mechanism disposed between the support base and the movable base, and biasing the movable base in a direction along which the movable base is separated from the support base. The second holding member includes a protruding portion brought into contact with the substrate so as to seal the substrate. A biasing force of the biasing mechanism which is applied to a region or a position of the movable base differs from a biasing force of the biasing mechanism which is applied to another region or at another position of the movable base.
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14. A method for manufacturing a substrate holder for sandwiching a substrate which is used in a plating tank in a substantially vertical posture, the method comprising the steps of:
preparing a support base, a movable base and a biasing mechanism; and
assembling the support base, the movable base and the biasing mechanism with each other such that a region or a position of the movable base is biased with a biasing force which differs from a biasing force applied to another region or another position of the movable base,
wherein the biasing force of the biasing mechanism is larger in a region or at a position disposed on a lower side in the plating tank than in a region or at a position disposed on an upper side in the plating tank.
1. A substrate holder comprising a first holding member and a second holding member which are configured to sandwich a substrate, wherein
the first holding member includes: a support base; a movable base configured to support the substrate; and a biasing mechanism disposed between the support base and the movable base, and configured to bias the movable base in a direction along which the movable base is separated from the support base,
the second holding member includes a protruding portion brought into contact with the substrate so as to seal the substrate, and
a biasing force of the biasing mechanism which is applied to a region or a position of the movable base differs from a biasing force of the biasing mechanism which is applied to another region or another position of the movable base,
wherein the substrate holder is used in a plating tank in a substantially vertical posture, and
wherein the biasing force of the biasing mechanism is larger in a region or at a position disposed on a lower side in the plating tank than in a region or at a position disposed on an upper side in the plating tank.
2. The substrate holder according to
the movable base has a first end portion and a second end portion, and
the biasing force of the biasing mechanism increases corresponding to a distance in a direction from the first end portion of the movable base toward the second end portion of the movable base.
3. The substrate holder according to
the biasing mechanism includes a plurality of springs, and spring constants of the plurality of springs are adjusted so as to vary the biasing force of the biasing mechanism.
4. The substrate holder according to
the biasing mechanism includes a plurality of springs, and an arrangement density of the springs is adjusted so as to vary the biasing force of the biasing mechanism.
5. The substrate holder according to any one of
the biasing mechanism includes a plurality of springs, and spring constants of the plurality of springs and an arrangement density of the springs are adjusted so as to vary the biasing force of the biasing mechanism.
6. The substrate holder according to
the biasing mechanism includes one or a plurality of rod-shaped elastic bodies, at least one of a groove or a protrusion is formed on at least one of a portion of the movable base where the elastic body is disposed and a portion of the support base where the elastic body is disposed, and a size of at least one of the groove or the protrusion is adjusted corresponding to a position on the movable base so as to vary the biasing force of the biasing mechanism.
7. The substrate holder according to
at least one of the groove or the protrusion is formed on at least one of the movable base and the support base, and an inclination is formed on at least one of the groove or the protrusion.
8. The substrate holder according to
at least one of the groove or the protrusion is formed on at least one of the movable base and the support base, and a size adjustment member is disposed on at least one of a bottom surface of the groove or an end surface of the protrusion.
9. The substrate holder according to
the biasing mechanism includes one or a plurality of rod-shaped elastic bodies, and at least one of a diameter of the elastic body, hardness of the elastic body and the number of elastic bodies is adjusted corresponding to a position on the movable base so as to vary the biasing force of the biasing mechanism.
10. The substrate holder according to
the biasing mechanism includes one or a plurality of rod-shaped elastic bodies, at least one of a groove or a protrusion is formed on at least one of a portion of the movable base where the elastic body is disposed and a portion of the support base where the elastic body is disposed, a size of at least one of the groove or the protrusion is adjusted corresponding to a position on the movable base, and at least one of a diameter of the elastic body, hardness of the elastic body and the number of elastic bodies is adjusted corresponding to a position on the movable base so as to vary the biasing force of the biasing mechanism.
11. The substrate holder according to
the substrate holder is configured to sandwich a substrate having a quadrangular shape.
12. The substrate holder according to
the substrate holder is configured to sandwich a substrate having a circular shape.
13. A substrate treatment apparatus comprising a plating tank in which the substrate holder described in
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This application is based upon and claims benefit of priority from Japanese Patent Application No. 2016-234169 filed Dec. 1, 2016, the entire contents of which are incorporated herein by reference.
The present invention relates to a substrate holder, a plating apparatus, and a method for manufacturing a substrate holder.
Conventionally, wirings, bumps (protruding electrodes) and the like are formed on a surface of a substrate such as a semiconductor wafer or a printed circuit board. An electrolytic plating method is used as a method for forming the wirings, the bumps and the like.
A plating apparatus, which is used in the electrolytic plating method, includes a substrate holder which seals an end surface of a substrate having a circular shape or a polygonal shape, and holds the substrate with a surface (surface to be plated) of the substrate exposed. In performing plating treatment on the surface of the substrate in such a plating apparatus, the substrate holder holding the substrate is immersed into a plating solution.
Japanese Patent No. 5643239 specification (PTL 1) describes a configuration where a movable base 82 is supported on a support base 80 of a substrate holder 18 by compression springs 86, a substrate is placed on the movable base 82, and an outer peripheral portion of the substrate W is sandwiched by the movable base 82 and a seal holder 62. In this configuration, a change in thickness of the substrate W is absorbed by the movement of the movable base 82 so that the substrate W having a different thickness is held by the substrate holder 18 in a state where a size of a compressed substrate sealing member 66 is maintained within a predetermined range.
In Japanese Patent Laid-Open No. 2015-145537 (PTL 2), a plating apparatus is described where an anode holder 28, a regulation plate 134 and a substrate holder 24 are mounted on a positioning holder 182 which is a member used in common so that the center of the anode 26, the center of an opening of the regulation plate 134, and the center of the substrate W are made to agree with each other with certainty.
Japanese Patent Laid-Open No. 2016-3376 (PTL 3) describes a substrate holder 8 where a substrate W is sandwiched between a first holding member 22 and a second holding member 24. In this substrate holder 8, an outer peripheral portion of the substrate W is pressed by a substrate sealing member 28. PTL 3 describes a configuration where a conductive block 60 biased by a spring 63 is disposed in a holder hanger 34 of the substrate holder 8, and the conductive block 60 is brought into contact with and separated from a plurality of external contacts 42. By energizing the respective external contacts 42 in a state where the substrate W is held by the substrate holder 8 and the conductive block 60 is separated from the external contacts 42, it is possible to detect whether or not there is an abnormality in internal contacts 45 and/or a conductive film of the substrate W. By bringing the conductive block 60 into contact with the external contacts 42, a uniform electric current can be supplied to the plurality of internal contacts 45.
Recently, a size of a substrate treated in a substrate treatment apparatus such as a plating apparatus has increased. When a size of the substrate increases, a size of the substrate holder also increases. Accordingly, in a dip-type plating apparatus where a substrate holder is vertically immersed, a large pressure difference is generated between an upper portion and a lower portion of the substrate holder due to an effect of a pressure of a plating solution (hereinafter also referred to as “fluid pressure”). Due to such a pressure difference, there may be a variation in size of the compressed substrate sealing member between the upper portion and the lower portion of the substrate holder so that leakage of a plating solution may be caused. Variation in size of the compressed substrate sealing member between the upper portion and the lower portion of the substrate holder may cause a substrate to incline so that a quality of plating may be affected. However, the above-mentioned configurations described in PTL 1 to PTL 3 do not take into account an effect caused by a pressure difference of a plating solution on the substrate holder.
It is an object of the present invention to solve at least a portion of the above-mentioned problems.
According to an aspect of the present invention, there is provided a substrate holder. The substrate holder includes a first holding member and a second holding member which are configured to sandwich a substrate. The first holding member includes: a support base; a movable base configured to support the substrate; and a biasing mechanism disposed between the support base and the movable base, and configured to bias the movable base in a direction along which the movable base is separated from the support base. The second holding member includes a protruding portion brought into contact with the substrate so as to seal the substrate. A biasing force of the biasing mechanism which is applied to a region or a position of the movable base differs from a biasing force of the biasing mechanism which is applied to another region or another position of the movable base. A position may be one position or a plurality of positions.
According to an aspect of the present invention, there is provided a method for manufacturing a substrate holder for sandwiching a substrate, the method including the steps of: preparing a support base, a movable base and a biasing mechanism; and assembling the support base, the movable base and the biasing mechanism with each other such that a region or a position of the movable base is biased with a biasing force which differs from a biasing force applied to another region or another position of the movable base.
Hereinafter, embodiments of the present invention are described with reference to drawings. In the respective embodiments described hereinafter, identical or corresponding members are given the same symbols, and the repeated description is omitted. In this specification, the descriptions such as “front surface”, “back surface”, “front”, “back”, “up”, “down”, “left” and “right” are used. These descriptions merely describe positions and directions on a paper on which a drawing is illustrated for the sake of convenience of the description, and may differ from positions and directions of an apparatus in an actual arrangement such as an arrangement when the apparatus is in use.
The loading/unloading part 110 includes two cassette tables 25 and a substrate attaching and detaching mechanism 29. Each cassette table 25 mounts cassettes 25a storing substrates such as semiconductor wafers, glass substrates, liquid crystal substrates or printed circuit boards thereon. The substrate attaching and detaching mechanism 29 is configured to attach and detach a substrate to and from the substrate holder 1 (described later with reference to
The cleaning part 50a includes a cleaning device 50 for cleaning and drying a substrate on which plating treatment is performed. The substrate transferring device 27 is configured to transfer the substrate on which plating treatment is performed to the cleaning device 50, and to extract the cleaned substrate from the cleaning device 50.
The pretreatment and post-treatment part 120A includes: a pre-wetting tank 32; a presoaking tank 33; a pre-rinse tank 34; a blow tank 35; and a rinse tank 36. A substrate is immersed into pure water in the pre-wetting tank 32. An oxide film on a surface of a conductive layer such as a seed layer formed on a surface of the substrate is removed by etching in the presoaking tank 33. The substrate, on which pre-soaking treatment is performed, is cleaned with a cleaning solution (pure water or the like) together with the substrate holder in the pre-rinse tank 34. The cleaned substrate is drained in the blow tank 35. The substrate, to which plating is applied, is cleaned with a cleaning solution together with the substrate holder in the rinse tank 36. The pre-wetting tank 32, the presoaking tank 33, the pre-rinse tank 34, the blow tank 35, and the rinse tank 36 are disposed in this order. The above-mentioned configuration of the pretreatment and post-treatment part 120A of the plating apparatus 100 is merely one example. The pretreatment and post-treatment part 120A of the plating apparatus 100 is not particularly limited to such a configuration, and may adopt other configurations.
The plating treatment part 120B includes a plurality of plating tanks 39 including an overflow tank 38. Each plating tank 39 stores one substrate therein. The substrate is immersed into a plating solution held in the inside of each plating tank 39 so as to apply plating such as copper plating to a surface of the substrate. A kind of plating solution is not particularly limited, and any of various plating solutions may be used corresponding to the application.
The plating apparatus 100 includes a substrate holder transporting device 37 of a linear motor type, for example. The substrate holder transporting device 37 is positioned on a side facing the respective equipment, and transports a substrate holder together with a substrate between the respective equipment. The substrate holder transporting device 37 is configured to transport a substrate holder between the substrate attaching and detaching mechanism 29, the pre-wetting tank 32, the presoaking tank 33, the pre-rinse tank 34, the blow tank 35, the rinse tank 36, and the plating tank 39.
A plating treatment system which includes the plating apparatus 100 having the above-mentioned configuration includes a controller 175 configured to control the above-mentioned respective parts. The controller 175 includes: a memory 175B storing a predetermined program; a CPU (Central Processing Unit) 175A which executes the program in the memory 175B; and a control part 175C which is realized when the program is executed by the CPU 175A. For example, the control part 175C can perform controls such as a transfer control of the substrate transferring device 27, a control of attaching and detaching a substrate to and from a substrate holder performed by the substrate attaching and detaching mechanism 29, a transport control of the substrate holder transporting device 37, a control of a plating current and a plating time in the respective plating tanks 39, and a control of an opening diameter of an anode mask (not shown in the drawing) disposed in the respective plating tanks 39 and an opening diameter of a regulation plate (not shown in the drawing) disposed in the respective plating tanks 39. The controller 175 is configured to be communicable with a host controller not shown in the drawing which performs a centralized control of the plating apparatus 100 and other related devices. Accordingly, the controller 175 can transmit and receive data to and from a database which the host controller includes. In this embodiment, a storage medium which forms the memory 175B stores various kinds of programs such as various kinds of setting data and a plating treatment program described later. As a storage medium, a known storage medium may be used, which includes a computer readable memory such as a ROM and a RAM, and a disk-shaped storage medium such as a hard disk, a CD-ROM, a DVD-ROM or a flexible disk.
[Substrate Holder]
The substrate holder 1 includes a front plate 300 and a back plate 400. A substrate S is held between the front plate 300 and the back plate 400. In this embodiment, the substrate holder 1 holds the substrate S with one surface of the substrate S exposed. The substrate S may be a semiconductor wafer, a glass substrate, a liquid crystal substrate, a printed circuit board or any other object to be plated. The substrate S may have any shape such as a circular shape or a quadrangular shape. In the description made hereinafter, the description is made by taking a substrate having a quadrangular shape as an example. However, a change in shape of an opening portion of the substrate holder 1 allows the substrate holder 1 to hold a substrate having a circular shape or another shape.
The front plate 300 includes a front plate body 310 and an arm portion 330. The arm portion 330 is a grip portion gripped by the substrate holder transporting device 37, and is also a portion to be supported when the front plate 300 is disposed in the plating tank 39. The substrate holder 1 is transported in a vertically standing state with respect to an installation surface of the plating apparatus 100, and the substrate holder 1 is disposed in the plating tank 39 in a vertically standing state.
The front plate body 310 has a substantially rectangular shape. The front plate body 310 includes a wiring buffer portion 311 and a face portion 312, and has a front surface 301 and a back surface 302. The front plate body 310 is mounted on the arm portion 330 by way of two mounting portions 320. An opening portion 303 is formed on the front plate body 310 so that a surface to be plated of the substrate S is exposed through the opening portion 303. In this embodiment, the opening portion 303 is formed into a rectangular shape corresponding to the substrate S having a rectangular shape. When the substrate S is a semiconductor wafer or the like having a circular shape, the opening portion 303 is also formed into a circular shape.
The wiring buffer portion 311 is disposed at a portion of the front plate body 310 on a side close to the arm portion 330. The wiring buffer portion 311 is a region where cables are distributed which reach the front plate body 310 through the arm portion 330. The wiring buffer portion 311 is also a region where cables of extra length are accommodated. The wiring buffer portion 311 is formed with a thickness slightly larger than a thickness of other portions of the front plate body 310 (face portion 312) (see
(Structure for Mounting Back Plate on Front Plate)
The back plate 400 includes a back plate body 410. The back plate body 410 has a substantially rectangular shape, and has a size smaller than the front plate body 310 of the front plate 300 (
The front surface 401 of the back plate body 410 forms a surface on which a substrate S is placed, and the front surface 401 is mounted on the back surface 302 of the front plate body 310. Eight clip portions 420 in total are mounted on the front surface 401 of the back plate body 410 corresponding to respective sides of the substrate S so as to hold (fix) the substrate S. In this embodiment, one clip portion 420 is provided for an upper side and a lower side of the substrate S respectively, and three clip portions 420 are provided for a left side and a right side of the substrate S respectively. The number and the arrangement of the clip portions 420 may be suitably selected corresponding to a size and a shape of the substrate S, and are not limited to the number and the arrangement of the clip portions 420 shown in the drawings.
Positioning pieces 490 are formed on three corners out of four corners of the back plate body 410. A through hole 490a is formed in each positioning piece 490. The positioning pieces 490 may be integrally formed with the back plate body 410. Alternatively, the positioning pieces 490 may be formed as separate bodies from the back plate body 410, and may be mounted on the back plate body 410. Positioning pins 390 are formed on the back surface 302 of the front plate body 310 at positions corresponding to respective positioning pieces 490 (
As shown in
A rotary shaft 341 is mounted over two fixing members 350 provided for each side of the back plate 400. The rotary shaft 341 is mounted on the fixing members 350 in a rotatable manner (
Each clamp 340 includes an engaging portion 340a, which is bent in a hook shape, at a distal end portion thereof. Each clamp 340 has a through hole on a proximal end side thereof. The rotary shaft 341 is inserted into the through hole of the clamp 340, and the clamp 340 is fixed in a non-rotatable manner by the key and the key groove (see
Engagement receiving portions 430 are formed on the back surface 402 of the back plate 400 at positions corresponding to the clamps 340. As described in this embodiment, the engagement receiving portions 430 may be formed as separate bodies from the back plate body 410 of the back plate 400, and may be mounted on the back plate body 410. Alternatively, the engagement receiving portions 430 may be integrally formed with the back plate body 410. A projecting portion 430a is formed on each engagement receiving portion 430. The projecting portion 430a has a shape which allows the hook-shaped engaging portion 340a of the clamp 340 to be caught by and to be engaged with the projecting portion 430a. To enable reliable engagement of the engaging portion 340a of the clamp 340 with the projecting portion 430a, the projecting portion 430a has a larger size than the engaging portion 340a.
Hereinafter, a structure for mounting the back plate 400 on the front plate 300 is described with reference to drawings.
As described above, the clamp 340 is of a normally-closed type. Accordingly, when a pressing force is not applied to the lever 342, as shown in
Next, the pressing force of the actuator AR1 is removed from the lever 342 of the front plate 300. With such an operation, the lever 342 rotates toward the original position with a biasing force of the compression spring 343 so that the respective clamps 340 rotate in the closing direction. As a result, the engaging portions 340a of the clamps 340 are engaged with the engagement receiving portions 430 of the back plate 400 so that the back plate 400 is fixed to the front plate 300 (
To remove the back plate 400 from the front plate 300, as described above, a pressing force is applied to each lever 342 of the front plate 300 by the actuator (not shown in the drawing) so as to rotate each clamp 340 in the opening direction against a biasing force of the compression spring 343 (
(Structure for Mounting Substrate on Back Plate)
Eight clip portions 420 in total are mounted on the front surface 401 of the back plate 400 corresponding to the respective sides of the substrate S (see
As shown in
Each clip 421 includes a pawl portion 421a at a distal end portion thereof, and an elongated hole 421b and two circular holes 421c are formed in a portion of the clip 421 on the proximal end side. The clips 421 are mounted on the clip portion 420 in such a manner that the fixed shaft 424 is inserted into each elongated hole 421b. As shown in
With such a configuration, each clip 421 can rotate toward the outer side of the back plate body 410 while moving in the direction along which the clip 421 is separated from the back plate body 410 (from
To place the substrate S on the back plate 400, an external pressing force is applied to eight buttons 470 (force receiving portions 471) of the back plate 400 by actuators AR2 (
In a state where the clips 421 are in an open state, the substrate S is placed at a predetermined position on the front surface 401 of the back plate 400. Thereafter, a pressing force applied to the buttons 470 by the actuators AR2 is released. As a result, each clip 421 is rotated toward the inner side of the back plate body 410 while being moved in the direction along which the clip 421 approaches the back plate body 410 with a biasing force of the coil spring 422 so that the clip 421 is brought into a closed state (from
The back plate 400 on which the substrate S is mounted as described above is mounted on the front plate 300 as described with reference to
In this embodiment, the configuration is adopted where the clips 421 rotate about the fixed shaft 424 extending parallel to the surfaces 401, 402 of the back plate body 410. However, the clips 421 may be configured to reciprocate in the direction perpendicular to the surfaces 401, 402 of the back plate body 410 so as to clamp the substrate S.
(Configuration of Seal Portion)
An inner seal 361 is mounted on the back surface 302 of the front plate 300 such that the inner seal 361 is disposed adjacently to the opening portion 303. The inner seal 361 is mounted on the back surface 302 of the front plate 300 by a seal holder 363. The inner seal 361 provides sealing between the substrate S and the front plate 300 thus preventing a plating solution from intruding into an end portion of the substrate S. A contact 370 for supplying a potential to the substrate S is mounted on the seal holder 363.
As shown in
In this embodiment, the seal holder 363 for mounting the inner seal 361 and the seal holder 364 for mounting the outer seal 362 are formed of separate members and hence, the inner seal 361 and the outer seal 362 can be individually replaced.
(Electrical Wiring)
The back surface 302 of the front plate body 310 has eighteen contact regions C1 to C18. The contact regions C1 to C7, C17, C18 are disposed in a half region (a first region, a right half region in
Each contact region C1 to C18 includes a contact (contact member) 370 shown in
First end portions of the cables L1 to L18 are connected to the connector 331 disposed at one end of the arm portion 330. To be more specific, the first end portions of the cables L1 to L18 are electrically connected to individual contacts in the connector 331 or each plurality of cables is electrically connected to a common contact (not shown in the drawing). The cables L1 to L18 can be electrically connected to an external power source (power source circuit, power source device or the like) through the respective contacts of the connector 331.
The cables L1 to L18 are connected to external connection contacts 331a1, 331a2 in the connector 331 (
The cables L17, L18, L1 are connected to the common external connection contact 331a1 on the first side, and the cables L8, L9, L10 are connected to the common external connection contact 331a2 on the second side. The external connection contact 331a1 on the first side and the external connection contact 331a2 on the second side are assumed as a pair (referred to as “first pair” or “first pair of external connection contacts 331a”).
The cables L2, L3, L4 are connected to another external connection contact 331a1 on the first side, and the cables L11, L12, L13 are connected to another external connection contact 331a2 on the second side. The external connection contact 331a1 on the first side and the external connection contact 331a2 on the second side are assumed as a pair (referred to as “second pair” or “second pair of external connection contacts 331a”).
The cables L5, L6, L7 are connected to another external connection contact 331a1 on the first side, and the cables L4, L15, L16 are connected to another external connection contact 331a2 on the second side. The external connection contact 331a1 on the first side and the external connection contact 331a2 on the second side are assumed as a pair (referred to as “third pair” or “third pair of external connection contacts 331a”).
In the connector 331, the external connection contact 331a1 on the first side and the external connection contact 331a2 on the second side of each pair 331a of the external connection contacts are arranged so as to opposedly face each other. The external connection contact 331a1 on the first side and the external connection contact 331a2 on the second side of the first pair of the external connection contacts 331a are arranged so as to opposedly face each other. The external connection contact 331a1 on the first side and the external connection contact 331a2 on the second side of the second pair of the external connection contacts 331a are arranged so as to opposedly face each other. The external connection contact 331a1 on the first side and the external connection contact 331a2 on the second side of the third pair of the external connection contacts 331a are arranged so as to opposedly face each other.
Conduction confirmation processing is performed in the substrate attaching and detaching mechanism 29. To be more specific, after the substrate S is held by the substrate holder 1 (after the back plate 400 is fixed by the clamps 340 of the front plate 300), a resistance measuring instrument (not shown in the drawing) is connected to the first to fifth pairs of the connector 331, and a predetermined inspection voltage is applied between the first external connection contact and the second external connection contact of each pair. With such operations, an electrical resistance between the first external connection contact and the second external connection contact of each pair is measured. When an electrical resistance of each pair is equal to or less than a predetermined value and falls within a predetermined range (there is no variation in the electrical resistance between the respective pairs so that there is no abnormality such as disconnection), it is determined that the substrate holder 1 has favorable conduction (conduction confirmation processing). The conduction confirmation processing is performed by the control part 175C of the controller 175. The conduction confirmation processing may be included in “control of attaching and detaching a substrate to and from the substrate holder performed by the substrate attaching and detaching mechanism 29” described previously.
As described later, second end portions forming the other ends of the cables L1 to L18 are electrically connected to the contacts 370 in the contact regions C1 to C18 respectively. The respective cables L1 to L18 extend from the connector 331 along the arm portion 330, and pass through one mounting portion 320 and, then, enter the wiring buffer portion 311 (
A thick wall portion 313 is formed on a face portion 312 side of the wiring buffer portion 311 (
In this embodiment, as shown in
As shown in
As shown in
For example, the contact region C1 has the wiring groove 363a (
An electrical connection between the cable L and the contact 370 in each contact region is performed as follows. The description is made by taking the cable L as an example. The cover 602 is removed from the distal end portion (second end portion) of the cable L1 so that the core wire (conductive wire) 601 is exposed (
The cables L2 to L7 are not pulled in the contact region C1 so that the cables L2 to L7 are arranged in parallel within a range corresponding to the contact region C1 and the contact region C2. In the contact region C2, in the same manner as the contact region C1, the cable L2 is pulled in the wiring groove 363a of the seal holder 363, and is pressed together with the contact 370 by four screws 511 so that the cable L2 is electrically connected with the contact 370. As a result, the cables L3 to L7 are arranged in parallel within a range corresponding to the contact region C2 and the contact region C3. In the same manner, the cables L3 to L7 are electrically connected with the contacts 370 in the contact regions C3 to C7 respectively. As a result, the cables L4 to L7 are arranged in parallel within a range corresponding to the contact region C3 and the contact region C4. The cables L5 to L7 are arranged in parallel within a range corresponding to the contact region C4 and the contact region C5. The cables L6 and L7 are arranged in parallel within a range corresponding to the contact region C5 and the contact region C6. The cable L7 is arranged in parallel within a range corresponding to the contact region C6 and the contact region C7.
In the same manner, the cables L17, L18 are electrically connected with the contacts 370 in the contact regions C17, C18 respectively. Also in the region (second region) on the side away from the connector, in the same manner as the cables in the first region, the cables L8 to L16 are electrically connected with the contacts 370 in the contact regions C8 to C16 respectively.
In this embodiment, the case has been described where the cable L is sandwiched together with the contact 370, and the cable L and the contact 370 are directly and electrically connected with each other. However, another conductive member (second conductive member) may be interposed between the cable L and the contact 370.
(Functions and Effects of Embodiment)
According to the substrate holder 1 of this embodiment, the front plate 300 and the back plate 400, which sandwich a substrate therebetween, are fixed with each other by the clamps 340 which are rotatable about shafts extending parallel to the surface of the front plate body 310 or by the clamps 340 which are reciprocable in the direction intersecting with the surface of the front plate body 310. Accordingly, it is possible to suppress or prevent that a force in the rotational direction is applied to the substrate. In the case where a substrate has a large size and a small thickness, when a force in the rotational direction is applied to the substrate, the substrate may be deflected. However, according to the substrate holder 1 of this embodiment, even when the substrate holder 1 holds a substrate having a large size and a small thickness, deflection of the substrate can be suppressed or prevented.
The clamps 340 are of a normally-closed type. Accordingly, the clamps are only opened in bringing the back plate body 410 into contact with the front plate body 310, and it is unnecessary to apply an external force to the clamps by actuators or the like when the clamps are in a clamping state. For this reason, energy consumption can be suppressed.
The back plate 400 can be sandwiched by the clamps 340 at a plurality of places, and the operations of the respective clamps 340 are synchronized by the connecting member (rotary shaft 341). Accordingly, the clamps can be effectively operated. Further, the configuration of the actuators AR1, which apply an external force to the clamps, can be simplified. The levers 342 can operate the respective clamps 340 by way of the rotary shafts 341 upon reception of an external force from the first actuators AR1 and hence, fixing of the substrate by the clamps 340 can be easily automated.
The engagement receiving portions 430, each having a shape which receives the engaging portion 340a of the clamp 340, are formed on the back plate 400 and hence, the engagement of the clamps with the back plate 400 can be enhanced. By adopting the configuration where the engagement receiving portions 430, which are formed as separate bodies from the back plate body 410, are mounted on the back plate body 410, a size, a shape, the number or the like of the engagement receiving portion 430 can be suitably and easily selected.
A substrate is fixed to the back plate 400 by the clips 421, which are rotatable about the shafts 424 extending parallel to the surface of the back plate body 410, or by the clips 421, which are reciprocable in the direction intersecting with the surface of the back plate body 410. Accordingly, it is possible to suppress or prevent that a force in the rotational direction is applied to the substrate. In the case where a substrate has a large size and a small thickness, when a force in the rotational direction is applied to the substrate, the substrate may be deflected. However, according to the substrate holder of this embodiment, even when the substrate holder holds a substrate having a large size and a small thickness, deflection of the substrate can be suppressed or prevented.
The clips 421 are of a normally-closed type. Accordingly, the clips 421 are only opened in bringing a substrate into contact with the back plate body 410, and it is unnecessary to apply an external force to the clips 421 by actuators or the like when the clips 421 are in a clipping state. For this reason, energy consumption can be suppressed.
The back plate 400 includes the buttons 470 which receive a force from a surface on a side opposite to a surface brought into contact with a substrate. Accordingly, the actuators AR2 can be disposed on a side opposite to the surface which is brought into contact with the substrate and hence, the movement and a change in posture of the back plate 400 can be easily performed after the substrate is fixed.
The buttons 470 can operate the clips 421 upon reception of an external force from the second actuators AR2. With such a configuration, fixing of the substrate by the clips 421 can be easily automated.
The seal holder 363 for holding the inner seal 361 and the seal holder 364 for holding the outer seal 362 are formed as separate bodies and hence, the respective seals can be replaced individually.
In the substrate holder of this embodiment, the cover 602 is removed from one end portion of the cable L, and the core wire 601 of the cable L is sandwiched together with the contact 370. With such a simple configuration, an electrical connection between the cable L and the contact 370 can be established. That is, the cable L and the contact 370 can be connected with each other without providing a connector or the like to an end portion of the cable. When power is supplied to the substrate S in a state where the contacts 370 are brought into contact with the substrate S at a plurality of places, it is necessary to draw a plurality of cables L in the substrate holder so as to establish an electrical connection. However, according to the substrate holder of this embodiment, an electrical connection between the cables L and the contacts 370 can be established with a simple configuration and hence, an increase in size of the substrate holder can be suppressed. When power is supplied to a substrate having a large size or when a value of electric current supplied to a substrate is large, the number of cables is increased and a diameter of the cables is also increased. In such a case, for example, the substrate holder of this embodiment can be effectively used where the cables can be connected in a simple manner.
In the substrate holder of this embodiment, an electrical connection between the cable L and the contact 370 can be established with a simple configuration and a simple operation using the fastening members 511 such as bolts or screws.
In the substrate holder of this embodiment, the cable L and the contact 370 can be sandwiched using the seal holder 363. Accordingly, the existing configuration can be used and hence, an increase in size of the substrate holder and an increase in cost can be suppressed.
In the substrate holder of this embodiment, the seal holder 363 for the seal 361 and the seal holder 364 for the seal 362 are formed of separate bodies and hence, the seal can be replaced individually. The seal holder 363 and the seal holder 364 can be also easily replaced individually.
In the substrate holder of this embodiment, the cables L are arranged so as not to overlap with each other in the thickness direction of the substrate holder and hence, an increase in thickness of the substrate holder can be suppressed. Particularly, when a substrate has a large size or when an amount of electric current is large, there is a possibility that the number of cables and a diameter of the cables increase. However, according to the configuration of this embodiment, an increase in size of the substrate holder in the thickness direction can be suppressed.
In the substrate holder of this embodiment, the respective cables L, where the cover 602 is removed from the distal end of each cable L, are sequentially pulled into positions of the respective contacts 370, and are connected to the respective contacts 370. Accordingly, insulation can be established between the cables up to the connection positions and, at the same time, the cables can be connected to the conductive members with a simple configuration.
When the substrate holder of this embodiment is used in a plating apparatus, an increase in size of the substrate holder can be suppressed so that an increase in size of the plating apparatus can be also suppressed.
In a method for manufacturing the substrate holder of this embodiment, the cover 602 is removed from one end portion of the cable L, and the core wire 601 of the cable L is sandwiched together with the contact 370. Accordingly, an electrical connection between the cable L and the contact 370 can be established with a simple configuration. That is, the cable L and the contact 370 can be connected with each other without providing a connector or the like to an end portion of the cable. When power is supplied to the substrate S in a state where the contacts 370 are brought into contact with the substrate S at a plurality of places, it is necessary to draw a plurality of cables L in the substrate holder so as to establish an electrical connection. However, according to the substrate holder of this embodiment, an electrical connection between the cables L and the contacts 370 can be established with a simple configuration and hence, an increase in size of the substrate holder can be suppressed. When power is supplied to a substrate having a large size or when a value of electric current supplied to a substrate is large, the number of cables is increased and a diameter of the cables is also increased. In such a case, for example, the substrate holder of this embodiment can be effectively used where the cables can be connected in a simple manner.
In performing plating treatment on a substrate using the above-mentioned substrate holder 1, even when power is supplied to a substrate having a large size or even when a value of electric current supplied to a substrate is large, an electrical connection between the cables and the conductive members in the substrate holder is established with a simple configuration. Accordingly, plating treatment can be performing using the substrate holder where an increase in size of the substrate holder is suppressed or prevented.
In the above-mentioned embodiment, before plating treatment is performed, conduction confirmation processing is performed, where electrical resistance between the contact(s) on the first side and the contact(s) on the second side of each pair of the external connection contacts is measured so as to confirm whether or not there is a variation in electrical resistance between the plurality of pairs of the external connection contacts. Accordingly, it is possible to perform plating treatment after it is confirmed in advance that there is no problem in uniformity in plating film thickness caused by variation in electrical resistance between the plurality of pairs of the external connection contacts. As a result, reliability of plating treatment can be enhanced.
(Substrate Support Structure)
As shown in
As shown in
The elastic body 413 forms a biasing mechanism which biases the movable base 412. To be more specific, the elastic body 413 and portions of the movable base 412 and the support base 411 which are brought into contact with the elastic body 413 form the biasing mechanism. As shown in
The number of individual elastic bodies forming the elastic body 413 is not limited to three, and the elastic body 413 may be formed of two or less individual elastic bodies or may be formed of four or more individual elastic bodies. A gap g (
The elastic body 413 may be formed using an O ring or a packing made of fluororubber or urethane rubber, for example. When the elastic body 413 is formed of a plurality of elastic bodies, for example, a plurality of O rings or packings may be cut and disposed in the groove portion 412b. The elastic body 413 may be formed of one annular elastic body. For example, an O ring or a packing having substantially the same length as the entire circumference of the groove portion 412b may be disposed in the groove portion 412b. The elastic body 413 may have a desired shape such as a circular shape, an elliptical shape or a polygonal shape in cross section. It is sufficient for the elastic body 413 to be suitable for biasing the movable base 412. Accordingly, it is not always necessary for the elastic body 413 to possess sealability.
A biasing force of the elastic body 413 with respect to the movable base 412 can be adjusted by changing a diameter and hardness (elasticity) of the elastic body 413. When the plurality of elastic bodies 413 are disposed in the groove portion 412b in an overlapping manner, a biasing force can be adjusted by changing the number of elastic bodies 413. Accordingly, by adjusting at least one of a diameter of the elastic body 413, hardness (elasticity) of the elastic body 413 and the number of elastic bodies 413, a biasing force of the elastic body 413 with respect to the movable base 412 can be adjusted.
As shown in
In this embodiment, a case has been described where a depth of the groove portion 412b continuously varies in a linear manner corresponding to a depth in a plating solution. However, a depth of the groove portion 412b may vary in a curved manner corresponding to a depth in a plating solution. A depth of the groove portion 412b may vary in a stepwise manner corresponding to a depth in a plating solution such that a depth of the groove portion 412b in a region (or at a position) of the movable base 412, which is largely affected by a depth in a plating solution, may be set smaller than a depth of the groove portion 412b in another region (or at another position) of the movable base 412. The region (or the position) of the movable base 412 which is largely affected by a depth in a plating solution can be acquired in advance by an experiment or the like. For example, a substrate holder 1 on which a substrate S is mounted is immersed into a plating solution, and a depth in a plating solution and an amount of compression of the seal 361 are measured so as to examine a relationship between the depth of the plating solution and the amount of compression of the seal 361. Accordingly, a depth of the groove portion 412b at a depth in a plating solution where an amount of compression is large can be set smaller than a depth of the groove portion 412b in another region (or at another position).
As shown in
(Modifications of Substrate Support Structure)
In the above-mentioned embodiment, a configuration has been described which suppresses the effect of a fluid pressure by changing a depth of the groove portion 412b of the movable base 412. However, provided that a configuration can adjust a biasing force of the elastic body 413 corresponding to a depth in a solution, any other configuration may be adopted.
(First Modification)
(Second Modification)
(Third Modification)
(Fourth Modification)
In the above description, a case has been described where the groove portion is formed on the movable base 412, and the protrusion is mounted on the support base 411. However, the groove portion may be formed on the support base 411 and the protrusion may be mounted on the movable base 412.
(Fifth Modification)
The configuration shown in
(Sixth Modification)
A change in diameter of the elastic body 413 according to the fifth modification and a change in hardness of the elastic body 413 according to the sixth modification may be used in combination so as to acquire a desired biasing force of the elastic body 413. For example, when there is a limitation on an increase in diameter of an elastic body due to reasons such as a restricted installation space, an increase in diameter of the elastic body and an increase in hardness of the elastic body can be used in combination so as to acquire a desired biasing force. Alternatively, the configuration shown in
(Seventh Modification)
A biasing mechanism according to a seventh modification is described with reference to
Instead of increasing a spring constant of the springs 705, an arrangement density of the springs 705 may be increased in a region (or at a position) where a fluid pressure is large. Alternatively, a change in spring constant of the springs 705 and a change in arrangement density of the springs 705 may be used in combination so as to acquire a desired biasing force. Instead of changing a spring constant and/or an arrangement density of springs in one region (or at one position) of the movable base as in the case of the above-mentioned embodiment, a spring constant and/or an arrangement density of springs may be changed such that a biasing force of the springs is increased in a continuous manner or in a stepwise manner along with the increase in fluid pressure in the entire region of the movable base. Alternatively, a spring constant and/or an arrangement density of springs may be changed such that a biasing force of the springs is increased in a continuous manner or in a stepwise manner along with the increase in fluid pressure in one region (or at one position) of the movable base. As one example, it may be possible to increase only a spring constant of a single spring, which is disposed at a deepest position in a solution.
The substrate holder according to the above-mentioned embodiment can be manufactured as follows. First, the support base, the movable base and the biasing mechanism are prepared. The support base, the movable base and the biasing mechanism are assembled with each other such that one region (or one position) of the movable base is biased with a biasing force which differs from a biasing force applied to another region (or another position) of the movable base. According to the manufacturing method of this embodiment, the biasing mechanism is formed such that a biasing force of the biasing mechanism varies depending of a position on the movable base so that it is possible to easily manufacture a substrate holder where an effect of a difference in fluid pressure can be suppressed or prevented. The configuration, where one region (or one position) of the movable base is biased with a biasing force which differs from a biasing force applied to another region (or another position) of the movable base, may be realized by using various methods described with reference to
[1] According to the above-mentioned embodiment, a substrate can be biased toward the protruding portion (seal) with a biasing force which varies depending on a region (or a position) on the movable base. A biasing force of the biasing mechanism is set large at a portion which receives a large fluid pressure. With such a configuration, the movable base can be biased in the direction along which the movable base is separated from the support base with a biasing force of a magnitude corresponding to a magnitude of a fluid pressure. As a result, a fluctuation in amount of seal compression caused by a fluid pressure difference can be suppressed. As a result, a leakage of a plating solution can be suppressed or prevented. An inclination of the movable base (an inclination of the substrate) caused by a fluid pressure can be also suppressed or prevented. Further, the substrate and the contacts 370 can be favorably brought into contact with each other over the entire circumference. Accordingly, non-uniformity in plating thickness can be suppressed. That is, by performing electrolytic plating treatment on a substrate using the substrate holder of this embodiment, a thickness of metal formed on the substrate can be made substantially uniform in the plane.
[2] According to the above-mentioned embodiment, when the substrate holder is disposed in the plating tank, a biasing force of the biasing mechanism is larger in a lower region (or at a lower position) of the movable base than in an upper region (or at an upper position) of the movable base. Accordingly, the movable base can be biased against a large fluid pressure in the lower region (or at a lower position) of the movable base. With such a configuration, in the lower region (or at the lower position) of the movable base, it is possible to suppress or prevent a decrease in amount of seal compression so that an inclination of the movable base (an inclination of the substrate) can be suppressed or prevented.
[3] According to one example, a biasing force of the biasing mechanism is set corresponding to a distance from one end of the movable base. For example, assume an end portion of the movable base on a shallow depth side in a solution as the first end portion and an end portion of the movable base on a deep depth side in the solution as the second end portion. In such a case, a biasing force of the biasing mechanism is set so as to gradually increase toward the end portion of the movable base on the deep depth side. With such a configuration, a biasing force can be set with higher accuracy corresponding to a fluid pressure.
[4] According to one example, spring constants of the springs are varied depending on a region (or a position) on the movable base so that a biasing force can be varied. Accordingly, a biasing force can be varied depending on a region (or a position) on the movable base while an increase in arrangement space of the springs is suppressed or prevented. By setting spring constants in a region (or at a position) at a deep depth in a solution larger than spring constants in a region (or at a position) at a shallow depth in the solution, a biasing force corresponding to a magnitude of a fluid pressure can be realized by the springs.
[5] According to one example, an arrangement density of the springs is changed depending on a region (or a position) on the movable base so that a biasing force can be varied. Accordingly, a biasing force also can be varied depending on a region (or a position) on the movable base by changing an arrangement density of the springs of an identical type.
[6] According to one example, a change in spring constant and a change in arrangement density of springs are used in combination corresponding to a region (or a position) on the movable base so that a biasing force can be varied. For example, when there is a restriction on an arrangement space of springs, an arrangement density of springs is increased within an allowable range of the arrangement space so that an insufficient biasing force can be compensated for by increasing a spring constant. With such a configuration, it is possible to suppress a design change or the like brought about by the increase in arrangement space and, at the same time, an increase in spring constant difference can be also suppressed.
[7] According to one example, the rod-shaped elastic body is sandwiched between the groove and/or the protrusion formed on at least one of the movable base and the support base, and a size of the groove and the protrusion is varied depending on a region (or a position) on the movable base so as to vary an amount of compression of the elastic body. The larger the amount of compression of the elastic body, the larger a biasing force applied to the movable base becomes. Accordingly, for example, an amount of compression of the elastic body is set such that a distance between the movable base and the support base becomes small at a deep depth position in a solution. With such setting, when a substrate is sandwiched between the first and second holding members, the amount of compression of the elastic body becomes large between the movable base and the support base at a deep depth position in the solution so that a larger biasing force is generated. Accordingly, a biasing force corresponding to a fluid pressure can be applied to the movable base at a deep depth position in the solution so that it is possible to suppress or prevent a decrease or a variation in amount of seal compression and an inclination of the movable base which are caused by an effect of a fluid pressure.
In the configuration which uses the rod-shaped elastic body, a thickness of the space, which is required for installing the elastic body, can be reduced compared to the configuration which uses springs and, at the same time, a continuity of a biasing force can be maintained along a seal region. Accordingly, a thickness of the substrate holder can be reduced, and a continuity of a biasing force is also enhanced. For this reason, the substrate holder according to this embodiment can be suitably applicable to a quadrangular substrate having a small thickness and a large size.
[8] According to one example, an inclination is formed on the groove and/or the protrusion so as to vary a size of the groove and/or the protrusion depending on a position on the movable base. In this case, a size of the groove and/or the protrusion can be continuously varied corresponding to a fluid pressure.
[9] According to one example, the size adjustment member is disposed on the bottom surface of the groove and/or the end surface of the protrusion so as to vary a depth of the groove depending on a position on the movable base. In this case, after the groove and/or the protrusion are formed on the movable base and/or the support base, a size of the groove can be easily varied corresponding to a fluid pressure.
[10] According to one example, a biasing force can be varied by varying at least one of a diameter of the elastic body, hardness of the elastic body, and the number of elastic bodies depending on a region (or a position) on the movable base. In this case, even when a size of the groove and/or the protrusion formed on the movable base and/or the support base is not varied, a biasing force can be varied depending on a region (or a position) on the movable base by adjusting at least one of a diameter of the elastic body, hardness of the elastic body, and the number of elastic bodies. Alternatively, elastic bodies (for example, O rings) of different diameters, different hardnesses, and/or different numbers are prepared. Then, the elastic bodies of different diameters, different hardnesses, and/or different numbers are disposed corresponding to a region (or a position) on the movable base. With such a configuration, a biasing force can be easily varied.
[11] According to one example, an adjustment of a size of the groove and/or the protrusion on the movable base and/or the support base and an adjustment of at least one of a diameter of the elastic body, hardness of the elastic body, and the number of elastic bodies are used in combination so that it is possible to realize a biasing force corresponding to a region (or a position) of the movable base. In this case, for example, when there is a restriction on an adjustment range of a size of the groove and/or the protrusion due to reasons such as a restricted size of the substrate holder in the thickness direction and required mechanical strength, an insufficient biasing force can be compensated for by adjusting at least one of a diameter of the elastic body, hardness of the elastic body, and the number of elastic bodies. In this case, an increase in thickness of the substrate holder can be suppressed, and an insufficient adjustment of a biasing force can be compensated for in a flexible manner by adjusting at least one of a diameter of the elastic body, hardness of the elastic body, and the number of elastic bodies while required mechanical strength is acquired.
[12] According to the substrate treatment apparatus of this embodiment, plating treatment can be performed on a substrate while an effect of a fluid pressure difference on the substrate holder can be suppressed or prevented.
At least following technical concept can be recognized from the above-described embodiments.
[1] According to an aspect 1, there is provided a substrate holder. The substrate holder includes a first holding member and a second holding member which are configured to sandwich a substrate. The first holding member includes: a support base; a movable base configured to support the substrate; and a biasing mechanism disposed between the support base and the movable base, and configured to bias the movable base in a direction along which the movable base is separated from the support base. The second holding member includes a protruding portion brought into contact with the substrate so as to seal the substrate. A biasing force of the biasing mechanism which is applied to a region or a position of the movable base differs from a biasing force of the biasing mechanism which is applied to another region or another position of the movable base. A position may be one position or a plurality of positions.
According to the aspect 1, the substrate can be biased toward the protruding portion (seal) with a biasing force which varies depending on a position on the movable base. For example, when the substrate holder is disposed in a plating tank in a substantially vertical posture so as to perform plating treatment, a fluid pressure (water pressure) which respective portions of the substrate holder receive varies depending on a depth in a plating solution. That is, a fluid pressure which the substrate holder receives varies depending on a position on the movable base. The movable base is pressed toward the support base at a large fluid pressure at a deep depth position in the solution. On the other hand, the movable base is pressed toward the support base at a small fluid pressure at a shallow depth position in the solution. The movable base receives a fluid pressure from a plating solution by way of a surface to be plated of the substrate which is exposed from the second holding member. In this case, when a biasing force of the biasing mechanism is set constant in the entire region of the movable base, the movable base approaches the support base more at the deep depth position in the solution than at other depth positions due to a fluid pressure so that an amount of seal compression (compression margin) becomes small. Such a decrease or a variation in amount of seal compression may cause a leakage of a plating solution. When an amount of seal compression is set large in the entire region of the movable base, there is a possibility of causing breakage of a substrate. Inclination (deflection) of the movable base caused by a fluid pressure difference may also cause a substrate on the movable base to be inclined. Further, at a portion where an amount of seal compression is lowered, a substrate and contacts may not be favorably brought into contact with each other so that a plating thickness may become non-uniform.
According to the aspect 1, a biasing force of the biasing mechanism is set large at a portion which receives a large fluid pressure (a portion which receives a large force in the direction along which the movable base is made to approach the support base). With such a configuration, the movable base can be biased in the direction along which the movable base is separated from the support base with a biasing force of a magnitude corresponding to a magnitude of a fluid pressure. As a result, a fluctuation in amount of seal compression caused by a fluid pressure difference can be suppressed. As a result, a leakage of a plating solution can be suppressed or prevented. An inclination of the movable base (an inclination of the substrate) caused by a fluid pressure can be also suppressed or prevented. Further, the substrate and the contacts can be favorably brought into contact with each other over the entire circumference. Accordingly, non-uniformity in plating thickness can be suppressed.
[2] According to an aspect 2, in the substrate holder of the aspect 1, the substrate holder is used in the plating tank in a substantially vertical posture, and the biasing force of the biasing mechanism is larger in a region or at a position disposed on a lower side in the plating tank than in a region or at a position disposed on an upper side in the plating tank.
According to the aspect 2, when the substrate holder is disposed in the plating tank, a biasing force of the biasing mechanism is larger in a lower region or at a lower position of the movable base than in an upper region or at an upper position of the movable base. Accordingly, the movable base can be biased against a large fluid pressure in the lower region or at the lower position of the movable base. With such a configuration, in the lower region or at the lower position of the movable base, it is possible to suppress or prevent a decrease in amount of seal compression so that an inclination of the movable base (an inclination of the substrate) can be suppressed or prevented.
[3] According to an aspect 3, in the substrate holder of the aspect 1 or 2, the movable base has a first end portion and a second end portion, and the biasing force of the biasing mechanism increases corresponding to a distance in a direction from the first end portion of the movable base toward the second end portion of the movable base.
According to the aspect 3, a biasing force of the biasing mechanism is set corresponding to a distance from one end of the movable base. For example, assume an end portion of the movable base on a shallow depth side in a solution as a first end portion and an end portion of the movable base on a deep depth side in the solution as a second end portion. In such a case, a biasing force of the biasing mechanism is set so as to gradually increase toward the end portion of the movable base on the deep depth side. With such a configuration, a biasing force can be set with higher accuracy corresponding to a fluid pressure.
[4] According to an aspect 4, in the substrate holder of any one of the aspects 1 to 3, the biasing mechanism includes a plurality of springs, and spring constants of the plurality of springs are adjusted so as to vary the biasing force of the biasing mechanism.
According to the aspect 4, spring constants of the springs are varied depending on a position on the movable base so that a biasing force can be varied. Accordingly, a biasing force can be varied depending on a position on the movable base while an increase in arrangement space of the springs is suppressed or prevented. For example, by setting spring constants in a region or at a position at a deep depth in a solution larger than spring constants in a region or at a position at a shallow depth in the solution, a biasing force corresponding to a magnitude of a fluid pressure can be realized by the springs.
[5] According to an aspect 5, in the substrate holder of any one of the aspects 1 to 3, the biasing mechanism includes a plurality of springs, and an arrangement density of the springs is adjusted so as to vary the biasing force of the biasing mechanism.
According to the aspect 5, an arrangement density of the springs is changed depending on a position on the movable base so that a biasing force can be varied. Accordingly, a biasing force can be varied depending on a position on the movable base also by changing an arrangement density of springs of an identical type. For example, by setting an arrangement density of the springs disposed in a region or at a position at a deep depth in a solution larger than an arrangement density of the springs disposed in a region or at a position at a shallow depth in the solution, a biasing force corresponding to a magnitude of a fluid pressure can be realized by the springs.
[6] According to an aspect 6, in the substrate holder of any one of the aspects 1 to 3, the biasing mechanism includes a plurality of springs, and spring constants of the plurality of springs and an arrangement density of the springs are adjusted so as to vary the biasing force of the biasing mechanism.
According to the aspect 6, a change in spring constant and a change in arrangement density of springs are used in combination so that a biasing force can be varied depending on a position on the movable base. For example, when there is a restriction on an arrangement space of springs, an arrangement density of springs is increased within an allowable range of the arrangement space so that an insufficient biasing force can be compensated for by increasing a spring constant. With such a configuration, it is possible to suppress a design change or the like brought about by the increase in arrangement space and, at the same time, an increase in spring constant difference can be also suppressed. Further, by using a change in spring constant and a change in arrangement density of springs in combination, an adjustment range of a biasing force can be expanded.
[7] According to an aspect 7, in the substrate holder of any one of the aspects 1 to 3, the biasing mechanism includes one or a plurality of rod-shaped elastic bodies, at least one of a groove or a protrusion is formed on at least one of a portion of the movable base where the elastic body is disposed and a portion of the support base where the elastic body is disposed, and a size of at least one of the groove or the protrusion is adjusted corresponding to a position on the movable base so as to vary the biasing force of the biasing mechanism.
According to the aspect 7, the rod-shaped elastic body is sandwiched between the groove and/or the protrusion formed on at least one of the movable base and the support base, and a size of the groove and the protrusion (a depth of the groove and a height of the protrusion) is varied depending on a position on the movable base so as to vary an amount of compression of the elastic body. The larger the amount of compression of the elastic body, the larger a biasing force applied to the movable base becomes. Accordingly, for example, an amount of compression of the elastic body is set such that a distance between the movable base and the support base becomes small at a deep depth position in a solution. With such setting, when a substrate is sandwiched between the first and second holding members, the amount of compression of the elastic body becomes large between the movable base and the support base at a deep depth position in the solution so that a larger biasing force is generated. Accordingly, a biasing force corresponding to a fluid pressure can be applied to the movable base at a deep depth position in the solution so that it is possible to suppress or prevent a decrease or a variation in amount of seal compression and an inclination of the movable base which are caused by an effect of a fluid pressure.
In the configuration which uses the rod-shaped elastic body, a thickness of the elastic body, which is required for installing the elastic body, can be reduced compared to the configuration which uses springs and, at the same time, a continuity of a biasing force can be maintained along a seal region. Accordingly, a thickness of the substrate holder can be reduced, and a continuity of a biasing force is also enhanced. The configuration which uses the rod-shaped elastic body can be suitably applicable to a quadrangular substrate having a small thickness and a large size.
[8] According to an aspect 8, in the substrate holder of the aspect 7, at least one of the groove or the protrusion is formed on at least one of the movable base and the support base, and an inclination is formed on at least one of the groove or the protrusion.
According to the aspect 8, an inclination is formed on the groove and/or the protrusion so as to vary a size of the groove and/or the protrusion depending on a position on the movable base. In this case, a size of the groove and/or the protrusion can be continuously varied corresponding to a fluid pressure.
[9] According to an aspect 9, in the substrate holder of the aspect 7 or 8, at least one of the groove or the protrusion is formed on at least one of the movable base and the support base, and a size adjustment member is disposed on at least one of a bottom surface of the groove or an end surface of the protrusion. The size adjustment member may be formed of a plate member or a rod-like member having a fixed or varying size (thickness, diameter) in cross section.
According to the aspect 9, the size adjustment member is disposed on the bottom surface of the groove and/or the end surface of the protrusion so as to vary a depth of the groove and/or a height of the protrusion depending on a position on the movable base. In this case, after the groove and/or the protrusion are formed on the movable base and/or the support base, a size of the groove can be easily varied corresponding to a fluid pressure.
[10] According to an aspect 10, in the substrate holder of any one of the aspects 1 to 3, the biasing mechanism includes one or a plurality of rod-shaped elastic bodies, and at least one of a diameter of the elastic body, hardness of the elastic body and the number of elastic bodies is adjusted corresponding to a position on the movable base so as to vary the biasing force of the biasing mechanism.
According to the aspect 10, a biasing force can be varied by varying at least one of a diameter of the elastic body, hardness (elasticity) of the elastic body, and the number of elastic bodies depending on a position on the movable base. In this case, even when a size of the groove and/or the protrusion formed on the movable base and/or the support base is not varied, a biasing force can be varied depending on a position on the movable base by adjusting at least one of a diameter of the elastic body, hardness of the elastic body, and the number of elastic bodies. Alternatively, elastic bodies (for example, O rings) of different diameters, different hardnesses, and/or different number are prepared. Then, the elastic bodies having different diameters, different hardnesses, and/or of different number are disposed corresponding to a position on the movable base. With such a configuration, a biasing force can be easily varied.
[11] According to an aspect 11, in the substrate holder of any one of the aspects 1 to 3, the biasing mechanism includes one or a plurality of rod-shaped elastic bodies, at least one of a groove or a protrusion is formed on at least one of a portion of the movable base where the elastic body is disposed and a portion of the support base where the elastic body is disposed, a size of at least one of the groove or the protrusion is adjusted corresponding to a position on the movable base, and at least one of a diameter of the elastic body, hardness of the elastic body and the number of elastic bodies is adjusted corresponding to a position on the movable base so as to vary the biasing force of the biasing mechanism.
According to the aspect 11, an adjustment of a size of the groove and/or the protrusion on the movable base and/or the support base and an adjustment of at least one of a diameter of the elastic body, hardness of the elastic body, and the number of elastic bodies are used in combination so that it is possible to realize a biasing force corresponding to a region or a position of the movable base. In this case, for example, when there is a restriction on an adjustment range of a size of the groove and/or the protrusion due to reasons such as a restricted size of the substrate holder in the thickness direction and required mechanical strength, an insufficient biasing force can be compensated for by adjusting at least one of a diameter of the elastic body, hardness of the elastic body, and the number of elastic bodies. In this case, an increase in thickness of the substrate holder can be suppressed, and an insufficient adjustment of a biasing force can be compensated for in a flexible manner by adjusting at least one of a diameter of the elastic body, hardness of the elastic body, and the number of elastic bodies while required mechanical strength is acquired.
[12] According to an aspect 12, the substrate holder according to any one of the aspects 1 to 11 is configured to hold a substrate having a quadrangular shape.
According to the aspect 12, it is possible to acquire functions and effects substantially equal to the functions and effects in the aspect 1. Particularly, recently, substrates having a quadrangular shape have reduced in thickness and have increased in size thus having a large size in the vertical direction. Accordingly, there is a tendency to increase a fluid pressure difference between an upper portion and a lower portion of the substrate holder. Further, the substrate holder has a small thickness and hence, the substrate holder is easily affected by a fluid pressure. By applying the aspect 12 to such a substrate holder holding a quadrangular substrate, an effect, which may be caused on the substrate holder by a fluid pressure difference, can be effectively suppressed or prevented.
[13] According to an aspect 13, the substrate holder according to any one of the aspects 1 to 11 is configured to hold a substrate having a circular shape.
According to the aspect 13, it is possible to acquire functions and effects substantially equal to the functions and effects in the aspect 1. Recently, a diameter of semiconductor wafers has increased. Due to an increase in size of semiconductor wafers in the vertical direction, there is a tendency to increase a fluid pressure difference between an upper portion and a lower portion of the substrate holder. According to the aspect 13, an effect, which may be caused on the substrate holder by a fluid pressure difference, can be effectively suppressed or prevented.
[14] According to an aspect 14, there is provided a substrate treatment apparatus which includes a plating tank in which the substrate holder according to any one of the aspects 1 to 13 is disposed. According to this substrate treatment apparatus, plating treatment can be performed on a substrate while an effect of a fluid pressure difference on the substrate holder can be suppressed or prevented.
[15] According to an aspect 15, there is provided a method for manufacturing a substrate holder for sandwiching a substrate, the method including the steps of: preparing a support base, a movable base and a biasing mechanism; and assembling the support base, the movable base and the biasing mechanism with each other such that a region or a position of the movable base is biased with a biasing force which differs from a biasing force applied to another region or another position of the movable base.
According to the aspect 15, the biasing mechanism is formed such that a biasing force of the biasing mechanism varies depending on a position on the movable base. Accordingly, it is possible to easily manufacture a substrate holder where an effect on the substrate holder caused by a fluid pressure difference can be suppressed or prevented.
Although the embodiment of the present invention has been described heretofore based on some examples, the above-mentioned embodiment of the present invention is provided for facilitating the understanding of the present invention, and does not limit the present invention. As a matter of course, without departing from the gist of the present invention, various modifications and variations are conceivable, and the present invention includes a technique equivalent to the present invention. Within a range where at least a portion of the above-mentioned problems can be solved or within a range where at least a portion of the above-mentioned functions and effects can be acquired, respective constitutional elements described in the claims and the specification may be combined or omitted as desired.
The present application claims priority to Japanese Patent Applications No. 2016-234169 filed on Dec. 1, 2016. The entire disclosure of Japanese Patent Applications No. 2016-234169 filed on Dec. 1, 2016, including specification, claims, drawings and summary is incorporated herein by reference in its entirety.
The entire disclosure of Japanese Patent No. 5643239 specification (PTL 1), Japanese Patent Laid-Open No. 2015-145537 (PTL 2), and Japanese Patent Laid-Open No. 2016-3376 (PTL 3) including specification, claims, drawings and summary is incorporated herein by reference in its entirety.
REFERENCE SIGNS LIST
1, 1a: substrate
25: cassette
25a: cassette
holder
table
27: substrate
28: traveling
transferring
mechanism
device
29: substrate
30: stocker
attaching
and detaching
mechanism
32: pre-wetting
33: presoaking
34: pre-rinse
tank
tank
tank
35: blow tank
36: rinse tank
37: substrate holder
38: overflow
transporting device
tank
39: plating tank
50: cleaning
50a: cleaning
device
part
100: plating
110: loading/
120: treatment
apparatus
unloading part
part
120A: pretreatment
120B: plating
and post-treatment
treatment part
part
175: controller
175A: CPU
175B: memory
175C: control part
300: front plate
301: front
surface
302: back surface
303: opening
310: front plate
portion
body
311: wiring buffer
311a: wiring
312: face portion
portion
hole
313: thick wall
320: mounting
330: arm portion
portion
portion
331: connector
340: clamp
340a: engaging
342: lever
portion
350: fixing member
361: inner seal
362: outer seal
363: seal holder
363a: wiring
364: seal holder
groove
365: cable path
370: contact
390: positioning
pin
400: back plate
401: front
402: back
surface
surface
410: back plate
411: support
411a: recessed
body
base
portion
411b: bottom
411c: recessed
411d: bottom
surface
portion
surface
411e: protrusion
412: movable
412a: peripheral
base
edge portion
412b: groove
412c: substrate
412d: recessed
portion
support surface
portion
412e: recessed
412f: shim
412g: shim
413: elastic
portion
body
414: guide
420: clip portion
421: clip
mechanism
421a: pawl portion
421b: elongated
421c: circular
hole
hole
422: coil spring
422a: leg portion
422b: leg portion
422c: wound
423: fixed
423a: restricting
portion
portion
surface
423b: guide surface
424: fixed shaft
430: engagement
receiving
portion
430a: projecting
470: button
471: force
receiving
portion
portion
472: elastic portion
473: mounting
474: pressing
portion
member
475: fastening
490: positioning
601: conductive
member
piece
wire
602: cover
701: first
702: second
holding
holding
member
member
702a: protruding
702b: body
703: support
portion (seal)
base
704: movable base
705: elastic body
706: guide
member
706a: flange
4121: upper side
4122: lower side
4123: right side
4124: left side
Suzuki, Kiyoshi, Fujikata, Jumpei, Miyamoto, Matsutaro
Patent | Priority | Assignee | Title |
11236435, | Nov 21 2018 | Ebara Corporation | Method for holding substrate on substrate holder |
11384447, | Sep 08 2016 | Ebara Corporation | Substrate holder, plating apparatus, method for manufacturing substrate holder, and method for holding substrate |
Patent | Priority | Assignee | Title |
5578167, | Jan 31 1996 | SHENZHEN XINGUODU TECHNOLOGY CO , LTD | Substrate holder and method of use |
8197649, | May 17 2005 | TOAGOSEI CO , LTD | Ion exchange membrane electrolytic cell |
8337680, | Jun 21 2002 | Ebara Corporation | Substrate holder and plating apparatus |
20030019741, | |||
20040074763, | |||
20090071820, | |||
20090139871, | |||
20130192983, | |||
20140024178, | |||
20160348264, | |||
JP2015145537, | |||
JP2016003376, | |||
JP5643239, |
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Sep 22 2017 | SUZUKI, KIYOSHI | Ebara Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 044268 | /0276 | |
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