FET IC structures that enable formation of high-Q inductors in a “flipped” SOI IC structure made using a back-side access process, such as an single layer transfer (SLT) process. Essentially, the interconnect layer superstructure of an IC is split into two parts, a “lower” superstructure and an “upper” superstructure. In various embodiments, one or more low-resistance interconnect layers are fabricated within an upper superstructure formed after the application of a back-side access process, allowing fabrication of inductors in one or more low-resistance interconnect layer. A significant advantage of such IC structures is that the low-resistance interconnect layer or layers are relocated from being near the handle wafer of a conventional SLT IC to being spaced away from the handle wafer by intervening structures. Fabricating inductors in such spaced low-resistance interconnect layer or layers reduces electromagnetic coupling with the handle wafer and thus increases the Q factor of the inductors.
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1. An integrated circuit structure having a first side originally formed on a substrate, and an opposite second side, the first side being attached to a handle wafer and the opposite second side including one or more low-resistance interconnect layers fabricated within an upper superstructure formed after the application of a back-side access process.
8. An integrated circuit structure attached to a handle wafer and including one or more low-resistance interconnect layers fabricated within an upper superstructure formed after the application of a back-side access process, further including at least one inductor fabricated as part of at least one of the one or more low-resistance interconnect layers of the upper superstructure.
18. An integrated circuit structure attached to a handle wafer and including one or more low-resistance interconnect layers fabricated within an upper superstructure formed after the application of a back-side access process, further including at least one inductor fabricated as part of a first one of the one or more low-resistance interconnect layers of the upper superstructure, and at least one inductor fabricated as part of a second one of the one or more low-resistance interconnect layers of the upper superstructure, wherein at least one inductor fabricated as part of the first one of the one or more low-resistance interconnect layers is positioned sufficiently close to at least one inductor fabricated as part of the second one of the one or more low-resistance interconnect layers so as to function as a transformer.
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The present application may be related to the following patents and patent applications, the contents of all of which are incorporated herein by reference:
This invention relates to electronic integrated circuits, and more particularly to electronic integrated circuits having transistors fabricated with semiconductor-on-insulator technology.
Virtually all modern electronic products—including laptop computers, mobile telephones, and electric cars—utilize complementary metal oxide semiconductor (CMOS) transistor integrated circuits (ICs), and in many cases CMOS ICs fabricated using a semiconductor-on-insulator process, such as silicon-on-insulator (SOI) or germanium-on-insulator. SOI transistors in which the electrical insulator is aluminum oxide (i.e., sapphire) are called silicon-on-sapphire or “SOS” devices. Another example of a semiconductor-on-insulator technology is “silicon-on-glass”, and other examples are known to those of ordinary skill in the art.
Taking SOI as one example of semiconductor-on-insulator, SOI technology encompasses the use of a layered silicon-insulator-silicon substrate in place of conventional “bulk” silicon substrates in semiconductor manufacturing. More specifically, SOI transistors are generally fabricated on a layer of silicon dioxide, SiO2 (often called a “buried oxide” or “BOX” layer) formed on a bulk silicon substrate. The BOX layer reduces certain parasitic effects typical of bulk silicon CMOS processes, thereby improving performance. SOI-based devices thus differ from conventional bulk silicon devices in that the silicon regions of the CMOS transistors are fabricated on an electrical insulator (typically silicon dioxide or aluminum oxide) rather than on a bulk silicon substrate.
As a specific example of a semiconductor-on-insulator process for fabricating ICs,
If the source S and drain D are highly doped with N type material, the FET is an N-type FET, or NMOS device. Conversely, if the source S and drain D are highly doped with P type material, the FET is a P-type FET, or PMOS device. Thus, the source S and drain D doping type determines whether a FET is an N-type or a P-type. CMOS devices comprise N-type and P-type FETs co-fabricated on a single IC die, in known fashion. The gate G is typically formed from polysilicon.
The BOX layer 104, the active layer 106, and one or more FETs 108 may be collectively referred to as a “device region” 114 for convenience (noting that other structures or regions may intrude into the device region 114 in particular IC designs). A superstructure 112 of various elements, regions, and structures may be fabricated in known fashion on or above the device region 114 in order to implement particularly functionality. The superstructure 112 may include, for example, conductive interconnections from the FET 108 to other components (including other FETs) and/or external contacts, passivation layers and regions, and protective coatings. The conductive interconnections may be, for example, copper or other suitable metal or electrically conductive material. Other elements, regions, and structures may be included for particular circuit designs. The formation of various layers creates a physical coupling between adjacent layers, which may include bonds at the atomic or molecular level and/or merging of layers (e.g., by implantation of dopants or the like).
As should be appreciated by one of ordinary skill in the art, a single IC die may embody from one electronic component—such as FET 108—to millions of electronic components. Further, the various elements of the superstructure 112 may extend in three-dimensions and have quite complex shapes. In general, the details of the superstructure 112 will vary from IC design to IC design.
The BOX layer 104, while enabling many beneficial characteristics for SOI IC's, also introduces some problems, such as capacitive coupling to the substrate 102, a thermal barrier to heat flow, and a voltage breakdown path to the substrate 102. Capacitive coupling with the substrate 102 alone can cause numerous side effects compared to an ideal SOI transistor, such as increased leakage current, lower breakdown voltage, signal cross-coupling, and linearity degradation. However, the most serious capacitive coupling effect caused by the BOX layer 104 is often the “back-channel” effect.
Referring back to
It is possible to mitigate some of the side effects of the secondary parasitic back-channel FET 120. One known mitigating technique utilizes “single layer transfer”, or SLT, as part of the IC fabrication process. The SLT process essentially flips or inverts an entire SOI transistor structure upside down onto a “handle wafer”, with the original substrate (e.g., substrate 102 in
In the structure of
Although not exactly to scale, the BOX layer 104 in
A contact 302 is made to the gate G of the FET 108, typically at the M1 level. In the illustrated example, the second passivation layer 206 has been patterned and covered in whole or in part by a top-side layer 304 of conductive material (commonly aluminum). The top-side layer 304 may be used, for example, to distribute high current power around an IC chip and for signal connections.
The thicker interconnect levels (e.g., M4 and M5) are generally lower in electrical resistance than the thinner interconnect levels (e.g., M1-M3), and are commonly used to convey power around an IC. Of note, in the illustrated example, the top layer interconnect level M5 is closer to the handle wafer 204 than is the M1 interconnect level. In contrast, in a conventional, non-SLT configuration, such as the type shown in
As is taught in U.S. patent application Ser. No. 15/920,321, the top-side layer 304 also may be used to mitigate or eliminate the problems caused by the secondary parasitic back-channel FET of conventional FET IC structures. More particularly, embodiments of that invention enable full control of the secondary parasitic back-channel FET of semiconductor-on-insulator IC primary FETs by fabricating such ICs using a process which allows access to the backside of the FET, such as an SLT process (collectively, a “back-side access process”). Thereafter, as shown in
While “flipped” SOI IC structures of the type shown in
The present invention encompasses FET IC structures that enable formation of high-Q inductors in a “flipped” SOI IC structure made using a back-side access process, such as an SLT process.
Essentially, the interconnect layer superstructure of an IC is split into two parts, a “lower” superstructure and an “upper” superstructure (“lower” and “upper” being with reference to the “new top” of an IC structure made using a back-side access process, such as the SLT process). Splitting the superstructure beneficially takes advantage of the realization that the interconnect layers are generally sequentially formed, and that a back-side access process can be applied at nearly any point of the process.
In one example embodiment, a single low-resistance interconnect layer is fabricated within an upper superstructure formed after the application of a back-side access process, allowing fabrication of inductors in the low-resistance interconnect layer. In another example embodiment, multiple low-resistance interconnect layers are fabricated within an upper superstructure formed after the application of a back-side access process, allowing fabrication of inductors in one or more low-resistance interconnect layer.
A significant advantage of IC structures in accordance with the present invention is that the low-resistance interconnect layer or layers are relocated from being near the handle wafer of a conventional SLT IC to being spaced away from the handle wafer by intervening structures. Fabricating inductors in such spaced low-resistance interconnect layer or layers reduces electromagnetic coupling with the handle wafer and thus increases the Q factor of the inductors.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the invention will be apparent from the description and drawings, and from the claims.
Like reference numbers and designations in the various drawings indicate like elements.
The present invention encompasses FET IC structures that enable formation of high-Q inductors in a “flipped” or inverted SOI IC structure made using a back-side access process, such as an SLT process. Essentially, the interconnect layer superstructure of an IC is split into two parts, a “lower” superstructure and an “upper” superstructure (“lower” and “upper” being with reference to the “new top” of an IC structure made using a back-side access process, such as the SLT process). Splitting the superstructure beneficially takes advantage of the realization that the interconnect layers are generally sequentially formed, and that a back-side access process can be applied at nearly any point of the process.
In one example embodiment, a single low-resistance interconnect layer is fabricated within an upper superstructure formed after the application of a back-side access process, allowing fabrication of inductors in the low-resistance interconnect layer. In another example embodiment, multiple low-resistance interconnect layers are fabricated within an upper superstructure formed after the application of a back-side access process, allowing fabrication of inductors in one or more low-resistance interconnect layer.
A significant advantage of IC structures in accordance with the present invention is that the low-resistance interconnect layer or layers are relocated from being near the handle wafer of a conventional SLT IC to being spaced away from the handle wafer by intervening structures. Fabricating inductors in such spaced low-resistance interconnect layer or layers reduces electromagnetic coupling with the handle wafer and thus increases the Q factor of the inductors.
IC Inductors
Inductors are widely used in alternating current electronic equipment, particularly in radio frequency (RF) equipment.
Even though inductor components are often assumed to be pure inductors, in practice they always have a finite amount of resistance. Such resistance affects the inductor quality factor, Q, and is one of the major factors affecting the performance of the inductor component. Any resistance will reduce the overall inductor Q factor, since Q equals the reactance of the inductor (XL) divided by the resistance of the inductor (R): Q=XL/R. Thus, lower resistance means higher Q, and accordingly IC inductors are preferably fabricated in low resistance materials.
In conventional ICs of the type shown in
However, as should be apparent from
While handle wafers made of non-conducting material (e.g., glass, quartz, diamond) would not exhibit electromagnetic coupling with inductors formed in proximate interconnect levels, such handle wafers are currently quite expensive compared to conventional silicon wafers (currently, a factor of 10-12 difference). Further, some IC fabrication foundries are not set up to handle such less conventional materials. Accordingly, it is useful to use conventional silicon wafers for handle wafers, particularly inexpensive low resistivity silicon wafers.
With respect to the figures referenced in the examples below, note that the dimensions for the various elements are not to scale; some dimensions have been exaggerated vertically and/or horizontally for clarity or emphasis. In addition, references to orientations and directions (e.g., “top”, “bottom”, “above”, “below”, “lateral”, “orthogonal” etc.) are relative to the example drawings, and not necessarily absolute orientations or directions.
In the example shown in
After application of the SLT process step shown in
As illustrated in
Of particular note, the M5 interconnect layer in the upper superstructure 112b may be patterned to form one or more inductors each comprising a coil similar to the type shown in
It should be appreciated that electrical connections to an M5 Inductor can be made in a variety of ways. For example, electrical connections may be made: solely from the top-side layer 304 (e.g., 304b, 304c); from the top-side layer 304 and, by means of one or more optional vias 506, directly to other interconnect layers through the second passivation layer 206 and other intervening structures; solely by means of one or more optional vias 506, directly to other interconnect layers through the second passivation layer 206 and other intervening structures; through other extents of the M5 interconnect layer; and/or any feasible combination of the above. Thus, a simple two-port or a multi-port M5 Inductor may be coupled to other components in an assortment of ways to accommodate the design and layout of a particular IC.
The IC structure shown in
For example,
In the example shown in
After application of the SLT process step shown in
The M4 and M5 interconnect layers are patterned to provide needed electrical connections and signal pathways to various components and structures within the IC. Vias 310 may be formed between various parts of the M4 and M5 interconnect layers suing conventional techniques. Also shown is a via 602 connecting one part of the M4 interconnect layer to structures “below” the second passivation layer 206 (in this case, the M1 interconnect layer). Again, the need for and position of such vias depends on the design of each particular IC.
As illustrated in
Of particular note, either of both of the M4 and M5 interconnect layers in the upper superstructure 112b may be patterned to form one or more inductors each comprising a coil similar to the type shown in
Of course, a particular IC may include multiple M4 Inductors and/or M5 Inductors (as well as coupled inductors, which allow for more turns). A significant advantage of the IC structure shown in
It should be appreciated that electrical connections to an M4 Inductor or an M5 Inductor can be made in a variety of ways. For example, electrical connections may be made: solely from the top-side layer 304 (e.g., 304b, 304c indirectly); from the top-side layer 304 and, by means of one or more optional vias 606, directly to other interconnect layers through the second passivation layer 206 and other intervening structures; solely by means of one or more optional vias 606, directly to other interconnect layers through the second passivation layer 206 and other intervening structures; through other extents of the M4 and/or M5 interconnect layers, directly or through vias 310; and/or any feasible combination of the above. Thus, a simple two-port or a multi-port M4 Inductor or M5 Inductor may be coupled to other components in an assortment of ways to accommodate the design and layout of a particular IC.
In addition, because inductors can be made in adjacent interconnect layers, intentionally (as opposed to parasitically) electromagnetically coupled inductors can be formed, where “intentionally” means inductors having a coupling coefficient k greater than about 0.1. For example, in
A major benefit of IC structures of the type shown in
Another benefit of IC structures of the type shown in
It should be appreciated that the inventive concepts are not limited to ICs having only five interconnect layers, but more generally applies to embodiments in which one or more low-resistance interconnect layers are fabricated within an upper superstructure formed after the application of a back-side access process, allowing fabrication of inductors in one or more low-resistance interconnect layer. It should also be appreciated that the inventive concepts extend to embodiments in which one or more low-resistance interconnect layers are fabricated within an upper superstructure formed after the application of a back-side access process, whether or not inductors are also formed in such one or more low-resistance interconnect layers. As a general proposition, pre-SLT fabrication of an IC may be stopped at nearly any interconnect layer (particularly after the M1 interconnect layer), the first passivation layer 202 applied, and an SLT or SLT-like process applied, with additional interconnect layers formed within an upper superstructure of the IC after layer transfer.
While the particular IC examples shown in
The heat extraction and transfer structures and methods taught in the co-pending U.S. Patent Application entitled “Thermal Extraction of Single Layer Transfer Integrated Circuits” and referenced above, may be applied to ICs fabricated in accordance with the split superstructure teachings of the present invention. Indeed, since the relatively thick interconnect layers (e.g., M5, or M4 and M5) of an upper superstructure 112b generally have low thermal resistivity as well as low electrical resistivity (particularly if formed from copper, for example), and are readily accessible from the “new top” of the IC structure, heat extraction and transfer in an IC may be significantly improved by combining the teachings of the present invention with the teachings of the co-pending U.S. Patent Application entitled “Thermal Extraction of Single Layer Transfer Integrated Circuits”.
Embodiments of the present invention may include integrated circuit capacitor structures of the type described in co-pending U.S. Patent Application entitled “SLT Integrated Circuit Capacitor Structure and Methods and referenced above.
Circuits and devices made using IC structures in accordance with the present invention may be used alone or in combination with other components, circuits, and devices. Integrated circuit embodiments of the present invention may be encased in IC packages and/or or modules for ease of handling, manufacture, and/or improved performance.
Circuits and devices made using IC structures in accordance with the present invention are useful in a wide variety of larger radio frequency (RF) circuits for performing a range of functions. Such functions are useful in a variety of applications, such as radar systems (including phased array and automotive radar systems), radio systems, and test equipment. Such circuits may be useful in systems operating over some or all of the RF range (e.g., from around 20 kHz to about 300 GHz).
Radio system usage includes cellular radios systems (including base stations, relay stations, and hand-held transceivers) that use such technology standards as various types of orthogonal frequency-division multiplexing (“OFDM”), various types of quadrature amplitude modulation (“QAM”), Code Division Multiple Access (“CDMA”), Wide Band Code Division Multiple Access (“WCDMA”), Global System for Mobile Communications (“GSM”), Enhanced Data Rates for GSM Evolution (EDGE), Long Term Evolution (“LTE”), 5G New Radio (“5G NR”), as well as other radio communication standards and protocols.
In particular, the present invention is useful in portable battery-operated devices, such as cellular telephones, that would benefit from RF circuitry having high-Q inductors.
Another aspect of the invention includes methods for fabricating ICs with high Q factor inductors. For example,
Other aspects of the inventive methods may include one or more of the following; wherein the second superstructure includes one or more low-resistance interconnect layers, and further including fabricating at least one inductor as part of at least one of the one or more low-resistance interconnect layers of the upper superstructure; wherein at least one inductor has a Q factor of at least about 16 at about 2.4 GHz, with some embodiments having at least one inductor having a Q factor as high as 30 at about 2.4 GHz; fabricating at least one inductor as a coil having at least a first port and a second port; wherein the second superstructure includes a plurality of low-resistance interconnect layers, further including fabricating at least one inductor as part of a first low-resistance interconnect layer of the second superstructure, and fabricating at least one inductor as part of a second low-resistance interconnect layer of the second superstructure; positioning at least one inductor fabricated as part of the first low-resistance interconnect layer sufficiently close to at least one inductor fabricated as part of the second low-resistance interconnect layer so as to electromagnetically couple; wherein the first superstructure includes one or more interconnect layers; fabricating at least one via to connect the second superstructure to the first superstructure through the second passivation layer and the inverted device region; fabricating at least one field effect transistor as part of the integrated circuit structure; fabricating, as part of the integrated circuit structure, at least one field effect transistor having a conductive aligned supplemental gate; fabricating the integrated circuit structure using a silicon-on-insulator process; wherein the handle wafer is principally silicon; wherein the handle wafer is principally silicon having a bonding layer of silicon dioxide, and the integrated circuit structure is attached to the bonding layer; and/or wherein the handle wafer includes a low resistivity silicon wafer.
The term “MOSFET”, as used in this disclosure, means any field effect transistor (FET) with an insulated gate and comprising a metal or metal-like, insulator, and semiconductor structure. The terms “metal” or “metal-like” include at least one electrically conductive material (such as aluminum, copper, or other metal, or highly doped polysilicon, graphene, or other electrical conductor), “insulator” includes at least one insulating material (such as silicon oxide or other dielectric material), and “semiconductor” includes at least one semiconductor material.
As should be readily apparent to one of ordinary skill in the art, various embodiments of the invention can be implemented to meet a wide variety of specifications. Unless otherwise noted above, selection of suitable component values is a matter of design choice and various embodiments of the invention may be implemented in any suitable integrated circuit (IC) technology (including but not limited to MOSFET structures), or in hybrid or discrete circuit forms. Integrated circuit embodiments may be fabricated using any suitable substrates and processes, including but not limited to standard bulk silicon, silicon-on-insulator (SOI), and silicon-on-sapphire (SOS). Unless otherwise noted above, the invention may be implemented in other transistor technologies such as bipolar, GaAs HBT, GaN HEMT, GaAs pHEMT, and MESFET technologies. However, the inventive concepts described above are particularly useful with an SOI-based fabrication process (including SOS), and with fabrication processes having similar characteristics. Fabrication in CMOS on SOI or SOS processes enables circuits with low power consumption, the ability to withstand high power signals during operation due to FET stacking, good linearity, and high frequency operation (i.e., radio frequencies up to and exceeding 50 GHz). Monolithic IC implementation is particularly useful since parasitic capacitances generally can be kept low (or at a minimum, kept uniform across all units, permitting them to be compensated) by careful design.
Voltage levels may be adjusted, and/or voltage and/or logic signal polarities reversed, depending on a particular specification and/or implementing technology (e.g., NMOS, PMOS, or CMOS, and enhancement mode or depletion mode transistor devices). Component voltage, current, and power handling capabilities may be adapted as needed, for example, by adjusting device sizes, serially “stacking” components (particularly FETs) to withstand greater voltages, and/or using multiple components in parallel to handle greater currents. Additional circuit components may be added to enhance the capabilities of the disclosed circuits and/or to provide additional functionality without significantly altering the functionality of the disclosed circuits.
A number of embodiments of the invention have been described. It is to be understood that various modifications may be made without departing from the spirit and scope of the invention. For example, some of the steps described above may be order independent, and thus can be performed in an order different from that described. Further, some of the steps described above may be optional. Various activities described with respect to the methods identified above can be executed in repetitive, serial, or parallel fashion.
It is to be understood that the foregoing description is intended to illustrate and not to limit the scope of the invention, which is defined by the scope of the following claims, and that other embodiments are within the scope of the claims. (Note that the parenthetical labels for claim elements are for ease of referring to such elements, and do not in themselves indicate a particular required ordering or enumeration of elements; further, such labels may be reused in dependent claims as references to additional elements without being regarded as starting a conflicting labeling sequence).
Yamada, Hiroshi, Paul, Abhijeet, Duvallet, Alain
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