control temperatures for a temperature control target are controlled in a plurality of steps. A lower temperature fluid supplied from first supply means (101) and a higher temperature fluid supplied from second supply means (102) are mixed together in a first three-way valve (103) for flow rate control to form a fluid for temperature control, and the fluid for temperature control is fed to the temperature control target. The fluid for temperature control returned from the temperature control target is distributed by a second three-way valve (108) for flow rate control so as to be returned to the first supply means and the second supply means. The lower temperature fluid prevented from being supplied from the first supply means to the first three-way valve for flow rate control is returned to the first supply means by a third three-way valve (112) for flow rate control through a bypass flow passage together with the fluid for temperature control distributed by the second three-way valve for flow rate control. Meanwhile, the higher temperature fluid prevented from being supplied from the second supply means to the first three-way valve for flow rate control is returned to the second supply means by a fourth three-way valve (116) for flow rate control through a bypass flow passage together with the fluid for temperature control distributed by the second three-way valve for flow rate control.
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1. A temperature control device, comprising:
first supply means for supplying a lower temperature fluid adjusted to a first predetermined lower temperature;
second supply means for supplying a higher temperature fluid adjusted to a second predetermined higher temperature;
a first three-way valve for flow rate control configured to mix the lower temperature fluid supplied from the first supply means and the higher temperature fluid supplied from the second supply means while controlling a flow rate of the lower temperature fluid and a flow rate of the higher temperature fluid to form a fluid for temperature control and then supply the lower temperature fluid and the higher temperature fluid to a temperature control target;
a second three-way valve for flow rate control configured to distribute the fluid for temperature control having flowed through the temperature control target to the first supply means and the second supply means while controlling a flow rate of the fluid for temperature control;
a third three-way valve for flow rate control configured to control the flow rate of the fluid for temperature control, which flows through the temperature control target and is distributed by the second three-way valve for flow rate control to the first supply means, and the flow rate of the lower temperature fluid, which is prevented from being supplied from the first supply means to the first three-way valve for flow rate control and is returned to the first supply means;
a fourth three-way valve for flow rate control configured to control the flow rate of the fluid for temperature control, which flows through the temperature control target and is distributed by the second three-way valve for flow rate control to the second supply means, and the flow rate of the higher temperature fluid, which is prevented from being supplied from the second supply means to the first three-way valve for flow rate control and is returned to the second supply means,
wherein the first to fourth three-way valves for flow rate control each include:
a valve main body including a valve seat, the valve seat having a columnar space and having a first valve port, which allows outflow of a fluid and has a rectangular cross section, and a second valve port, which allows outflow of the fluid and has a rectangular cross section;
first and second valve port forming members, which are fitted to the valve main body and form the first valve port and the second valve port, respectively;
a valve body being provided in a freely rotatable manner in the valve seat of the valve main body so as to simultaneously switch the first valve port from a closed state to an opened state and switch the second valve port from an opened state to a closed state, the valve body having a cylindrical shape and having an opening;
a pressure applying portion configured to apply a pressure of the fluid leaking through a gap between the valve body and the valve seat to the first and second valve port forming members so as to suppress shift of a position of the valve body when the valve body opens and closes the first valve port and the second valve port; and
drive means for driving the valve body to rotate.
2. The temperature control device according to
first cooling means for cooling the fluid for temperature control returned to the first supply means;
first heating means for heating in an auxiliary manner the fluid for temperature control cooled by the first cooling means, and supplying the fluid for temperature control as the lower temperature fluid; and
a first storage tank configured to store the lower temperature fluid heated in an auxiliary manner by the first heating means.
3. The temperature control device according to
second cooling means for cooling the fluid for temperature control returned to the second supply means;
second heating means for heating in an auxiliary manner the fluid for temperature control cooled by the second cooling means, and supplying the fluid for temperature control as the higher temperature fluid; and
a second storage tank configured to store the higher temperature fluid heated in an auxiliary manner by the second heating means.
4. The temperature control device according to
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The present invention relates to a temperature control device.
Hitherto, as a technology relating to a temperature control device, there has already been proposed, for example, a temperature control device disclosed in Patent Literature 1.
The invention of Patent Literature 1 has a main object to provide a temperature control system for a semiconductor manufacturing system capable of minimizing power consumption for cooling or heating. The temperature control system is configured to control cooling and heating of a heating medium (coolant) recovered from a load of a semiconductor manufacturing system to supply the heating medium at a target temperature, and the temperature control system for a semiconductor manufacturing system includes: a mixer configured to mix a low temperature heating medium and a high temperature heating medium to supply the mixed heating medium to a load; a first heating medium tank configured to store the low temperature heating medium; a first thermoelectric element block configured to cool the heating medium and provide the heating medium of the first heating medium tank; a second thermoelectric element block configured to cool the recovered heating medium to provide the recovered heating medium to the first heating medium tank; a first 3-way switching valve configured to provide the cooled heating medium in the first heating medium tank, which is provided through the first thermoelectric element block, to the mixer at a first ratio and bypass the remaining heating medium to the second thermoelectric element block to recover the remaining heating medium in the first heating medium tank; a second heating medium tank configured to store the high temperature heating medium; a first heater configured to heat the heating medium in the second heating medium tank; a second heater configured to heat the recovered heating medium and provide the recovered heating medium to the second heating medium tank; a second 3-way switching valve configured to provide the heating medium in the second heating medium tank, which is heated through the first heater, to the mixer at a second ratio and bypass the remaining heating medium to the second heater to recover the remaining heating medium in the second heating medium tank; and a third 3-way switching valve configured to provide the heating medium, which is recovered from the load, to the second thermoelectric element block at the first ratio and provide the heating medium to the second heater at the second ratio.
[PTL 1] JP 2015-79930 A
The present invention has an object to provide a temperature control device capable of controlling a mixture ratio between a lower temperature fluid and a higher temperature fluid with high accuracy and controlling control temperatures for a temperature control target in a plurality of steps, as compared to a configuration incapable of independently controlling a mixture ratio between the lower temperature fluid supplied from first supply means and the higher temperature fluid supplied from the second supply means and a distribution ratio between the lower temperature fluid returned to the first supply means and the higher temperature fluid returned to the second supply means.
According to the invention of claim 1, provided is a temperature control device, including: first supply means for supplying a lower temperature fluid adjusted to a first predetermined lower temperature; second supply means for supplying a higher temperature fluid adjusted to a second predetermined higher temperature; a first three-way valve for flow rate control configured to mix the lower temperature fluid supplied from the first supply means and the higher temperature fluid supplied from the second supply means while controlling a flow rate of the lower temperature fluid and a flow rate of the higher temperature fluid to form a fluid for temperature control and then supply the fluid for temperature control to a temperature control target; a second three-way valve for flow rate control configured to distribute the fluid for temperature control having flowed through the temperature control target to the first supply means and the second supply means while controlling a flow rate of the fluid for temperature control; a third three-way valve for flow rate control configured to control the flow rate of the fluid for temperature control, which flows through the temperature control target and is distributed by the second three-way valve for flow rate control to the first supply means, and the flow rate of the lower temperature fluid, which is prevented from being supplied from the first supply means to the first three-way valve for flow rate control and is returned to the first supply means; and a fourth three-way valve for flow rate control configured to control the flow rate of the fluid for temperature control, which flows through the temperature control target and is distributed by the second three-way valve for flow rate control to the second supply means, and the flow rate of the higher temperature fluid, which is prevented from being supplied from the second supply means to the first three-way valve for flow rate control and is returned to the second supply means.
According to the invention of claim 2, in the temperature control device as described in claim 1, the first supply means includes: first cooling means for cooling the fluid for temperature control returned to the first supply means; first heating means for heating in an auxiliary manner the fluid for temperature control cooled by the first cooling means, and supplying the fluid for temperature control as the lower temperature fluid; and a first storage tank configured to store the lower temperature fluid heated in an auxiliary manner by the first heating means.
According to the invention of claim 3, in the temperature control device as described in claim 1 or 2, the second supply means includes: second cooling means for cooling the fluid for temperature control returned to the second supply means; second heating means for heating in an auxiliary manner the fluid for temperature control cooled by the second cooling means, and supplying the fluid for temperature control as the higher temperature fluid; and a second storage tank configured to store the higher temperature fluid heated in an auxiliary manner by the second heating means.
According to the invention of claim 4, in the temperature control device as described in claim 1 or 2, in accordance with a mixture ratio in the first three-way valve for flow rate control, the third three-way valve for flow rate control increases a ratio of the lower temperature fluid to be supplied from the first supply means and returned to the first supply means, and the fourth three-way valve for flow rate control increases a ratio of the higher temperature fluid to be supplied from the second supply means and returned to the second supply means.
According to the invention of claim 5, in the temperature control device as described in claim 1 or 2, the first to fourth three-way valves for flow rate control each include: a valve main body including a valve seat, the valve seat having a columnar space and having an inflow port, which allows inflow of the fluid for temperature control having flowed through the flow passage for temperature control, a first valve port, which allows outflow of a part of the fluid for temperature control distributed to the first supply means and has a rectangular cross section, and a second valve port, which allows outflow of a part of the fluid for temperature control distributed to the second supply means and has a rectangular cross section; a valve body being provided in a freely rotatable manner in the valve seat of the valve main body so as to simultaneously switch the first valve port from a closed state to an opened state and switch the second valve port from an opened state to a closed state, the valve body having a half-cylindrical shape with a predetermined central angle and having a curved-surface shape or a flat-surface shape at each of both end surfaces of the valve body in a circumferential direction; and drive means for driving the valve body to rotate.
According to the invention of claim 6, in the temperature control device as described in claim 1 or 2, the first to fourth three-way valves for flow rate control each include: a valve main body including a valve seat, the valve seat having a columnar space and having a first valve port, which allows outflow of a fluid and has a rectangular cross section, and a second valve port, which allows outflow of the fluid and has a rectangular cross section; first and second valve port forming members, which are fitted to the valve main body and form the first valve port and the second valve port, respectively; a valve body being provided in a freely rotatable manner in the valve seat of the valve main body so as to simultaneously switch the first valve port from a closed state to an opened state and switch the second valve port from an opened state to a closed state, the valve body having a cylindrical shape and having an opening; a pressure applying portion configured to apply a pressure of the fluid leaking through a gap between the valve body and the valve seat to the first and second valve port forming members so as to suppress shift of a position of the valve body when the valve body opens and closes the first valve port and the second valve port; and drive means for driving the valve body to rotate.
According to the present invention, the temperature control device capable of controlling the mixture ratio between the lower temperature fluid and the higher temperature fluid with high accuracy and controlling control temperatures for the temperature control target in the plurality of steps as compared to the configuration incapable of independently controlling the mixture ratio between the lower temperature fluid supplied from the first supply means and the higher temperature fluid supplied from the second supply means and the distribution ratio between the lower temperature fluid returned to the first supply means and the higher temperature fluid returned to the second supply means can be provided.
In the following, embodiments of the present invention are described with reference to the drawings.
<Schematic Configuration of Chiller Device>
A chiller device 100 is used for, for example, a semiconductor manufacturing apparatus involving plasma etching as described later, and is configured to perform control so as to maintain, for example, a temperature of a semiconductor wafer as one example of a temperature control target (workpiece) W to a constant temperature in the plurality of steps.
As illustrated in
The temperature adjustment target device 105 has a flow passage 106 for temperature control (see
The lower temperature fluid supply portion 101 includes a first bypass pipe 110. Of the lower temperature fluid supplied from the lower temperature fluid supply portion 101 to the first three-way valve 103 for flow rate control through a lower-temperature-side mixing pipe 109, a part of the lower temperature fluid prevented from being supplied to the first three-way valve 103 for flow rate control is returned to the lower temperature fluid supply portion 101 through the first bypass pipe 110. On a return side of the lower temperature fluid supply portion 101, a third three-way valve 112 for flow rate control is provided. The third three-way valve 112 for flow rate control is configured to control a flow rate of the fluid for temperature control, which flows through the flow passage 106 for temperature control and is distributed by the second three-way valve 108 for flow rate control to the lower temperature fluid supply portion 101 through a lower-temperature-side distributing pipe 111, and a flow rate of the lower temperature fluid, which is prevented from being supplied from the lower temperature fluid supply portion 101 to the first three-way valve 103 for flow rate control and is returned to the lower temperature fluid supply portion 101 through the first bypass pipe 110.
Meanwhile, the higher temperature fluid supply portion 102 includes a second bypass pipe 114. Of the higher temperature fluid supplied from the higher temperature fluid supply portion 102 to the first three-way valve 103 for flow rate control through a higher-temperature-side mixing pipe 113, a part of the higher temperature fluid prevented from being supplied to the first three-way valve 103 for flow rate control is returned to the higher temperature fluid supply portion 102 through the second bypass pipe 114. On a return side of the higher temperature fluid supply portion 102, a fourth three-way valve 116 for flow rate control is provided. The fourth three-way valve 116 for flow rate control is configured to control a flow rate of the fluid for temperature control, which flows through the flow passage 106 for temperature control and is distributed by the second three-way valve 108 for flow rate control to the higher temperature fluid supply portion 102 through a higher-temperature-side distributing pipe 115, and a flow rate of the higher temperature fluid, which is prevented from being supplied from the higher temperature fluid supply portion 102 to the first three-way valve 103 for flow rate control and is returned to the higher temperature fluid supply portion 102 through the second bypass pipe 114. As the lower temperature fluid and the higher temperature fluid, the same heating medium (hereinafter, referred to as “brine”) is used.
As illustrated in
Further, the higher temperature fluid supply portion 102 includes a heating-side brine temperature adjustment circuit 124 configured to adjust the brine to a predetermined constant higher temperature. A heat exchanger 126 is connected to the heating-side brine temperature adjustment circuit 124 through intermediation of a higher-temperature-side circulating pipe 125. A third bypass pipe 127 is connected between the heating-side brine temperature adjustment circuit 124 and the heat exchanger 126. The third bypass pipe 127 allows the heating medium flowing from the heating-side brine temperature adjustment circuit 124 to the heat exchanger 126 to flow to the heating-side brine temperature adjustment circuit 124. Further, on an inflow side of the third bypass pipe 127, a fifth three-way valve 128 for flow rate control is provided. The fifth three-way valve 128 for flow rate control is configured to control a flow rate of the fluid for temperature control supplied to the heat exchanger 126 and a flow rate of the fluid for temperature control caused to bypass the heat exchanger 126 and returned to the heating-side brine temperature adjustment circuit 124. The external cooling water 123 is supplied to the heat exchanger 126 through the cooling water pipe 122. The heat exchanger 126 cools the brine. For example, when a temperature of the higher temperature fluid flowing through the higher-temperature-side circulating pipe 125 is equal to or lower than a predetermined threshold value, the fifth three-way valve 128 for flow rate control adjusts an opening degree so as to return a part or entirety of the higher temperature fluid flowing through the higher-temperature-side circulating pipe 125 directly to the heating-side brine temperature adjustment circuit 124.
<Basic Operation of Chiller Device>
The chiller device 100 basically operates as follows.
As illustrated in
As illustrated in
As a result, the fluid for temperature control adjusted in temperature to 20° C. is supplied from the lower temperature fluid supply portion 101 to the flow passage 106 for temperature control of the temperature adjustment target device 105, and the temperature of the temperature adjustment target device 105 is controlled to 20° C., which is the temperature of the fluid for temperature control including only the lower temperature fluid.
Further, as illustrated in
As a result, the fluid for temperature control adjusted in temperature to 80° C. is supplied from the higher temperature fluid supply portion 102 to the flow passage 106 for temperature control of the temperature adjustment target device 105, and the temperature of the temperature adjustment target device 105 is controlled to 80° C., which is the temperature of the fluid for temperature control including only the higher temperature fluid.
Moreover, as illustrated in
For example, when the mixture ratio between the lower temperature fluid and the higher temperature fluid in the first three-way valve 103 for flow rate control is 4:6, the opening degree of the second three-way valve 108 for flow rate control is controlled so that the same distribution ratio of 4:6 is obtained between the lower temperature fluid and the higher temperature fluid, and the second three-way valve 108 for flow rate control distributes the fluid for temperature control with such ratio to the lower temperature fluid supply portion 101 and the higher temperature fluid supply portion 102.
Along with this, the chiller device 100 controls the flow rate of the higher temperature fluid returned by the fourth three-way valve 116 for flow rate control to the higher temperature fluid supply portion 102 through the second bypass pipe 114, and thus returns the remaining higher temperature fluid, which is supplied from the higher temperature fluid supply portion 102 to the first three-way valve 103 for flow rate control, to the higher temperature fluid supply portion 102. Similarly, the chiller device 100 controls the flow rate of the lower temperature fluid returned by the third three-way valve 112 for flow rate control to the lower temperature fluid supply portion 101 through the first bypass pipe 110, and thus returns the remaining lower temperature fluid, which is supplied from the lower temperature fluid supply portion 101 to the first three-way valve 103 for flow rate control, to the lower temperature fluid supply portion 101.
In the above-mentioned example, for example, when the mixture ratio between the lower temperature fluid and the higher temperature fluid in the first three-way valve 103 for flow rate control is 4:6, the fourth three-way valve 116 for flow rate control controls a ratio (flow rate ratio) between the higher temperature fluid returned to the higher temperature fluid supply portion 102 through the second bypass pipe 114 and the fluid for temperature control distributed by the second three-way valve 108 for flow rate control to the higher temperature fluid supply portion 102 to 4:6.
Similarly, in the above-mentioned example, for example, when the mixture ratio between the lower temperature fluid and the higher temperature fluid in the first three-way valve 103 for flow rate control is 4:6, the third three-way valve 112 for flow rate control controls a ratio (flow rate ratio) between the lower temperature fluid returned to the lower temperature fluid supply portion 101 through the first bypass pipe 110 and the fluid for temperature control distributed by the second three-way valve 108 for flow rate control to the lower temperature fluid supply portion 101 to 6:4.
As a result, the fluid for temperature control, which is obtained by mixing the lower temperature fluid supplied from the lower temperature fluid supply portion 101 and the higher temperature fluid supplied from the higher temperature fluid supply portion 102 in accordance with the opening degree of the first three-way valve 103 for flow rate control, is supplied to the flow passage 106 for temperature control of the temperature adjustment target device 105. Thus, a temperature of the temperature adjustment target device 105 is controlled to be equal to the temperature of the fluid for temperature control determined in accordance with the mixture ratio between the lower temperature fluid and the higher temperature fluid.
As described above, the chiller device 100 adjusts the temperature of the fluid for temperature control being a mixed fluid by controlling the mixture ratio between the lower temperature fluid supplied from the lower temperature fluid supply portion 101 and the higher temperature fluid supplied from the higher temperature fluid supply portion 102 through use of the first three-way valve 103 for flow rate control, and thus can control the temperature of the temperature adjustment target device 105, which includes the flow passage 106 for temperature control allowing the flow of the fluid for temperature control, in a desired temperature range (for example, range of from +20° C. to +80° C.) corresponding to a temperature range of the fluid for temperature control flowing through the temperature adjustment target device 105. The temperature range of the temperature adjustment target device 105 is not limited to the range of from +20° C. to +80° C., and the temperature of the temperature adjustment target device 105 may be controlled in a desired temperature range (for example, range of from −20° C. to +120° C.)
The lower temperature fluid supply portion 101 is configured to supply, for example, the lower temperature fluid set to −20° C. at a flow rate of 30 L/min under a pressure of 0.8 MPa. Further, the higher temperature fluid supply portion 102 is configured to supply, for example, the higher temperature fluid set to +120° C. at a flow rate of 30 L/min under a pressure of 0.8 MPa. The lower temperature fluid and the higher temperature fluid are the same fluid as described above. Examples of the heating medium (brine) used as the lower temperature fluid and the higher temperature fluid include fluids such as a fluorine-based inert liquid, for example, Fluorinert (3M Company: trademark) and ethylene glycol usable in a temperature range of from about −30° C. to about +120° C. However, when the temperature range is from about +20° C. to about +80° C., water (such as pure water) adjusted to a temperature of from about 0° C. to about 30° C. under a pressure of from 0 MPa to 1 MPa, and water (pure water) adjusted to a temperature of from about 50° C. to about 80° C. are suitably used as the lower temperature fluid and the higher temperature fluid, respectively.
<Configuration of Plasma Treatment Apparatus>
As the semiconductor manufacturing apparatus to which the chiller device 100 is applied, a plasma treatment apparatus 200 involving plasma treatment can be given.
As illustrated in
Further, a gas intake port 201a is formed in the vacuum container 201, and is configured to introduce active gas (reactive gas) for etching therethrough. The upper electrode 203 is connected to a ground potential (GND) through intermediation of the lid portion extending outward. Further, the lower electrode 202 is connected to a radio-frequency (RF) oscillator 204 and a blocking capacitor 205 through intermediation of the lid portion extending outward. One end of the radio-frequency (RF) oscillator 204 is connected to the ground potential (GND). Moreover, a light emission detector 206 is provided on an outer side of a window portion formed in a wall of the vacuum container 201 opposed to the gas intake port 201a, and is configured to monitor a light emission state when plasma for etching is produced to perform etching by the plasma treatment.
Incidentally, under a state in which the active gas is ionized through the plasma treatment, positive ions of the active gas are attracted to the temperature control target W located on a side of the lower electrode 202 being the cathode electrode, and thus are used for etching. Electrons produced by ionizing the active gas through the plasma treatment exhibit various behaviors. The electrons flow toward the temperature control target W, or flow to the ground potential through the upper electrode 203. Most of the electrons are stored in the blocking capacitor 205 through the lower electrode 202.
As the temperature control target W to be controlled in temperature by the chiller device 100, a semiconductor element, a flat panel display (FPD), or a solar cell is given. In the embodiment of the present invention, as the temperature control target W, a semiconductor wafer to be used for a three-dimensional NAND flash memory is given. As illustrated in
When the number of laminated layers of the SiO2 layers 302 and the poly-Si layers 303 is twenty-four, etching treatment is performed to form the hole 304 so that the depth of the hole 304 is about 2,400 nm and the diameter of the hole 304 is 50 nm. As a result, the aspect ratio is 48 (=2, 400/50). As described above, the etching treatment for forming the hole 304 corresponds to etching treatment performed on a substance obtained by laminating the SiO2 layers 302 and the poly-Si layers 303. It is required that etching gas (charged particles of plasma) be caused to perpendicularly enter an entire surface of the semiconductor wafer W having a diameter of about 300 mm.
However, as illustrated in
In order to prevent and suppress such etching failure called “bowing” 321, it is effective to increase the temperature of the semiconductor wafer W in accordance with progress of the etching treatment, to thereby reduce a deposit ratio of carbon (C) on the side surface of the opening of the mask (resist portion) 320. Therefore, in the plasma treatment apparatus 200, it is important to control the temperature of the semiconductor wafer W.
In
Thus, in order to perform etching evenly on the hole 304 having a high aspect ratio and improve a yield in manufacture of the three-dimensional NAND flash memory 300, as illustrated in
Further, it is desired that the chiller device 100 not only can control the temperature of the semiconductor wafer W in the plurality of steps with excellent accuracy, but also can satisfy a requirement that a transition time period for reaching a target temperature be matched with a step time period in each etching step. The step time period in each etching step depends on a matter of the etching step and treatment performance of the plasma treatment apparatus 200. However, it is desired that one step take from 200 seconds to 300 seconds, and it is more desired that a plurality of steps proceed with such a transition time period that the plurality of steps are performed at between 20° C. and 80° C. and one step takes about 100 seconds (0.6° C./second).
<Specific Configuration of Chiller Device>
As described above, the chiller device 100 is used to control the temperature of the temperature control target (workpiece) W, which is held on, for example, the electrostatic chuck 129 of the plasma treatment apparatus 200 (see
A first pump 132 is connected to a downstream side of the first heater 130 in a flowing direction of the brine. The first pump 132 is configured to supply the lower temperature fluid to the temperature adjustment target device 105. The first pump 132 is configured to control a discharge rate of the lower temperature fluid through an inverter circuit (not shown) based on the flow rate of the lower temperature fluid detected by a first flow rate sensor 133 through a control unit (not shown). For example, the first pump 132 is controlled so as to keep the discharge rate of the lower temperature fluid constant. Further, based on the flow rate of the lower temperature fluid detected by the first flow rate sensor 133, the opening degree of the third three-way valve 112 for flow rate control is controlled by the control unit (not shown) as required.
A first storage tank 134 as one example of first storage means is connected to a downstream side of the first pump 132 in the flowing direction of the brine through intermediation of a first flow meter 133. The first storage tank 134 is configured to store a certain amount of the lower temperature fluid adjusted to a desired temperature to be supplied to the temperature adjustment target device 105. A first temperature sensor 135 is connected to a supply-side branching portion of the first bypass pipe 110 on a downstream side of the first storage tank 134. The first temperature sensor 135 is one example of first temperature detection means for detecting the temperature of the lower temperature fluid to be supplied to the first three-way valve 103 for flow rate control. Further, a second temperature sensor 136 is connected to a return-side inlet of the lower temperature fluid supply portion 101. The second temperature sensor 136 is one example of the first temperature detection means for detecting the temperature of the fluid for temperature control returned to the lower temperature fluid supply portion 101 through the third three-way valve 112 for flow rate control. Based on a detection value of the second temperature sensor 136, for example, a heating level of the lower temperature fluid by the first heater 130 is controlled by the control unit (not shown).
The chiller device 100 includes, in the heating-side brine temperature adjustment circuit 124, a second heater 137 as one example of second heating means for heating in an auxiliary manner the brine, which is cooled on the secondary side of the evaporator 126, to a desired temperature. The evaporator 126 of the higher temperature fluid supply portion 102 adjusts the temperature of the fluid for temperature control returned to the higher temperature fluid supply portion 102 by cooling the returned fluid for temperature control to a temperature (for example, about +70° C.) lower than an original set temperature (for example, +80° C.) As the second heater 137, for example, there is used heating means such as an electric heater for heating in an auxiliary manner the fluid for temperature control to a desired temperature for the higher temperature fluid. The second heater 137 is connected to the common tank 131. The brine is supplied from the common tank 131 to the second heater 137 as required.
A second pump 138 is connected to a downstream side of the second heater 137 in the flowing direction of the brine. The second pump 138 is configured to supply the higher temperature fluid to the temperature adjustment target device 105. The second pump 138 is configured to control a discharge rate of the higher temperature fluid through an inverter circuit (not shown) based on the flow rate of the higher temperature fluid detected by a second flow rate sensor 139 through a control unit (not shown). For example, the second pump 139 is controlled so as to keep the discharge rate of the higher temperature fluid constant. Further, based on the flow rate of the higher temperature fluid detected by the second flow rate sensor 139, the opening degree of the fourth three-way valve 116 for flow rate control is controlled by the control unit (not shown).
A second storage tank 140 as one example of second storage means is connected to a downstream side of the second pump 138 in the flowing direction of the brine through intermediation of a second flowmeter 139. The second storage tank 140 is configured to store a certain amount of the higher temperature fluid adjusted to a desired temperature to be supplied to the temperature adjustment target device 105. A third temperature sensor 141 is connected to a supply-side branching portion of the second bypass pipe 114 on a downstream side of the second storage tank 140 in the flowing direction of the brine. The third temperature sensor 141 is one example of third temperature detection means for detecting the temperature of the higher temperature fluid. Further, a fourth temperature sensor 142 is connected to a return-side inlet of the higher temperature fluid supply portion 102. The fourth temperature sensor 142 is one example of fourth temperature detection means for detecting the temperature of the fluid for temperature control returned through the fourth three-way valve 116 for flow rate control. Based on a detection value of the fourth temperature sensor 142, a heating level of the higher temperature fluid by the second heater 137 is controlled by the control unit (not shown).
<Configurations of First to Fifth Three-Way Valves for Flow Rate Control>
As described above, the chiller device 100 includes the first to fifth three-way valves 103, 108, 112, 116, and 128 for flow rate control. The first to fifth three-way valves 103, 108, 112, 116, and 128 for flow rate control basically have the same configuration except that a relationship between an inflow port and an outflow port is reversed depending on arrangement. Here, the three-way motor valve to be used as the first three-way valve 103 for flow rate control as mixing means is described as a representative.
A three-way motor valve 1 is constructed as a rotary three-way valve. As illustrated in
As illustrated in
In the first embodiment of the present invention, instead of directly forming the first inflow port 7 and the first valve port 9 in the valve main body 6, a first valve seat 70 as one example of a first valve port forming member having the first valve port 9, and a first flow passage forming member 15 forming the first inflow port 7 are fitted to the valve main body 6, thereby providing the first inflow port 7 and the first valve port 9.
As illustrated in
As a material for the first valve seat 70, for example, so-called “super engineering plastic” is used. The super engineering plastic has higher heat resistance and higher mechanical strength under a high temperature than ordinary engineering plastic. Examples of the super engineering plastic include, for example, polyether ether ketone (PEEK), polyphenylene sulfide (PPS), polyether sulfone (PES), polyamide imide (PAI), a liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), polychlorotrifluoroethylene (PCTFE), polyvinylidene fluoride (PVDF), or composite materials thereof. As the material for the first valve sheet 70, there may be used, for example, “TECAPEEK” (trademark) manufactured by Ensinger Japan Co., Ltd. serving as a PEEK resin material for cutting work, and “TECAPEEK TF 10 blue” (product name) having blending therein 10% PTFE, which is excellent in sliding property, is particularly suitably used.
As illustrated in
Under a state in which the first valve seat 70 is fitted to the recess 76 of the valve main body 6, a slight gap is defined between an outer peripheral surface of the first valve seat 70 and the inner peripheral surface of the recess 76 of the valve main body 6. A fluid having flowed into the valve seat 8 may leak and flow into a region around an outer periphery of the first valve seat 70 through the slight gap. Further, the fluid having leaked into the region around the outer periphery of the first valve seat 70 is led into the first pressure applying portion 94 being a space defined on an outer side of the cylindrical portion 72 of the first valve seat 70. The first pressure applying portion 94 is configured to apply a pressure of the fluid to a surface 70a of the first valve seat 70 opposite to the valve shaft 34. As described later, the fluid flowing into the valve seat 8 is a fluid flowing in through a second valve port 18 as well as a fluid flowing in through the first valve port 9. The first pressure applying portion 94 is partitioned under a state in which the first flow passage forming member 15 seals the first pressure applying portion 94 with respect to the first inflow port 7.
The pressure of the fluid, which is to be applied to the valve shaft 34 arranged inside the valve seat 8, depends on a flow rate of the fluid determined by an opening/closing degree of the valve shaft 34. The fluid flowing into the valve seat 8 also flows (leaks) through the first valve port 9 and the second valve port 18 into a slight gap defined between the valve seat 8 and an outer peripheral surface of the valve shaft 34. Therefore, into the first pressure applying portion 94 adapted for the first valve seat 70, not only the fluid flowing in through the first valve port 9 flows (leaks), but also the fluid flowing into the slight gap defined between the valve seat 8 and the outer peripheral surface of the valve shaft 34 and flowing in through the second valve port 18 flows (leaks).
Further, as illustrated in
As illustrated in
However, in a case in which the concave portion 74 of the first valve seat 70 is brought into contact with the valve shaft 34, there is a fear in that driving torque of the valve shaft 34 is increased due to contact resistance of the concave portion 74 when the valve shaft 34 is driven to rotate. Accordingly, a contact degree of the concave portion 74 of the first valve seat 70 with the valve shaft 34 is adjusted in consideration of rotational torque of the valve shaft 34. That is, the contact degree is adjusted to such an extent as to involve no increase in the driving torque of the valve shaft 34 or involve slight increase even when the driving torque is increased, and cause no trouble for rotation of the valve shaft 34.
As illustrated in
A first wave washer (corrugated washer) 16 is provided on an outer side of the cylindrical portion 72 of the first valve seat 70 along an axial direction thereof. The first wave washer 16 is one example of an elastic member configured to allow the first valve seat 70 to move in the direction of moving close to and away from the valve shaft 34 while allowing displacement of the first valve seat 70 in the direction of moving close to and away from the valve shaft 34. As illustrated in
Moreover, a first adjusting ring 77 is arranged on an outer side of the first wave washer 16. The first adjusting ring 77 is one example of an adjusting member configured to adjust the gap G1 between the valve shaft 34 and the concave portion 74 of the first valve seat 70 via the first wave washer 16. As illustrated in
As illustrated in
The first adjusting ring 77 is configured to adjust an amount (distance) of pushing and moving the first valve seat 70 inward by the first adjusting ring 77 through adjustment of a fastening amount of the first adjusting ring 77 with respect to the female thread portion 78 of the valve main body 6. When the fastening amount of the first adjusting ring 70 is increased, as illustrated in
Further, as illustrated in
As illustrated in
In the first embodiment of the present invention, instead of directly forming the second inflow port 17 and the second valve port 18 in the valve main body 6, the second inflow port 17 and the second valve port 18 are formed in a second valve seat 80 that forms the second valve port 18 as one example of the valve port forming member and a second flow passage forming member 25 that forms the second inflow port 17 are fitted to the valve main body 6, thereby providing the second inflow port 17 and the second valve port 18.
The second valve seat 80 has a configuration similar to the configuration of the first valve seat 70 as illustrated in
As illustrated in
Under a state in which the second valve seat 80 is fitted to the recess 86 of the valve main body 6, a slight gap is defined between the rectangular tube portion 81 of the valve seat 80 and the rectangular tube portion 86a of the valve main body 6. A fluid having flowed into the valve seat 8 can flow into a region around an outer periphery of the second valve seat 80 through the slight gap. Further, the fluid having flowed into the region around the outer periphery of the second valve seat 80 is led into the second pressure applying portion 96 being a space defined on an outer side of the cylindrical portion 82 of the second valve seat 80. The second pressure applying portion 96 is configured to apply a pressure of the fluid to a surface 80a of the second valve seat 80 opposite to the valve shaft 34. The fluid flowing into the valve seat 8 is a fluid flowing out through the first valve port 9 as well as a fluid flowing out through the second valve port 18. The second pressure applying portion 98 is partitioned under a state in which the second flow passage forming member 25 seals the second pressure applying portion 98 with respect to the second inflow port 17.
The pressure of the fluid, which is to be applied to the valve shaft 34 arranged inside the valve seat 8, depends on a flow rate of the fluid determined by an opening/closing degree of the valve shaft 34. The fluid flowing into the valve seat 8 also flows (leaks) through the first valve port 9 and the second valve port 18 into a slight gap defined between the valve seat 8 and an outer peripheral surface of the valve shaft 34. Therefore, into the second pressure applying portion 96 adapted for the second valve seat 80, not only the fluid flowing in through the second valve port 18 flows (leaks), but also the fluid flowing into the slight gap defined between the valve seat 8 and the outer peripheral surface of the valve shaft 34 and flowing in through the first valve port 9 flows (leaks).
Further, as illustrated in
As illustrated in
However, in a case in which the concave portion 84 of the second valve seat 80 is brought into contact with the valve shaft 34, there is a fear in that driving torque of the valve shaft 34 is increased due to contact resistance of the concave portion 84 when the valve shaft 34 is driven to rotate. Accordingly, a contact degree of the concave portion 84 of the second valve seat 70 with the valve shaft 34 is adjusted in consideration of the rotational torque of the valve shaft 34. That is, the contact degree is adjusted to such an extent as to involve no increase in the driving torque of the valve shaft 34 or involve slight increase even when the driving torque is increased, and cause no trouble for rotation of the valve shaft 34.
A second wave washer (corrugated washer) 26 is provided on an outer side of the cylindrical portion 82 of the second valve seat 80. The second wave washer 26 is one example of an elastic member configured to push and move the second valve seat 80 in a direction of coming into contact with the valve shaft 34 while allowing displacement of the second valve seat 80 in a direction of moving close to and away from the valve shaft 34. As illustrated in
Moreover, a second adjusting ring 87 is arranged on an outer side of the second wave washer 26. The second adjusting ring 87 is one example of an adjusting member configured to adjust the gap G3 between the valve shaft 34 and the concave portion 84 of the second valve seat 80 via the second wave washer 26. As illustrated in
As illustrated in
The second adjusting ring 87 is configured to adjust an amount (distance) of pushing and moving the second valve seat 80 inward by the second adjusting ring 877 via the second wave washer 26 through adjustment of a fastening amount of the second adjusting ring 87 with respect to the female thread portion 88 of the valve main body 6. When the fastening amount of the second adjusting ring 87 is increased, as illustrated in
As illustrated in
In the embodiment illustrated in
As the fluid, for example, water (such as pure water) adjusted to pressure of from 0 MPa to 1 MPa and within a temperature range of from about 0° C. to about 80° C. is suitably used. Further, as the fluid, for example, within a temperature range of from about −20° C. to about +120° C., there is used a fluid such a fluorine-based inert liquid, for example, Fluorinert (trademark) and ethylene glycol, which are neither frozen at a temperature of about −20° C. nor boiled at a temperature of about +120° C.
Further, as illustrated in
The valve seat 8 is formed in a center of the valve main body 6. The valve seat 8 forms the first valve port 9 having a rectangular cross section and the second valve port 18 having a rectangular cross section when the first valve seat 70 and the second valve seat 80 are fitted to the valve main body 6. The valve seat 8 has a space having a columnar shape corresponding to an outer shape of a valve body to be described later. Further, part of the valve seat 8 is formed by the first valve seat 70 and the second valve seat 80. The valve seat 8 having a columnar shape is provided in a state of penetrating an upper end surface of the valve main body 6. As illustrated in
Further, as illustrated in
As illustrated in
The upper and lower shaft support parts 36 and 37 each have a cylindrical shape having an outer diameter smaller than that of the valve body portion 35 and having an equal or a different diameter. A length of the lower shaft support portion 37 in an axial direction is set to be slightly larger than that of the upper shaft support portion 36. As illustrated in
Further, as illustrated in
Further, a cross section of each of both end surfaces 45a and 45b of the valve operating portion 45 in a circumferential direction (rotation direction), which is taken along a direction intersecting (orthogonal to) the center axis C, has a curved-surface shape. More specifically, as illustrated in
The cross section of each of the both end portions 45a and 45b of the valve operating portion 45 in the circumferential direction, which is taken along a direction intersecting the rotation axis C, is not limited to an arc shape. Each of the both end surfaces 45a and 45b in the circumferential direction (rotation direction) may have a curved-surface shape. As illustrated in
As illustrated in
Further, the both end portions 45a and 45b of the valve operating portion 45 in the circumferential direction is not limited thereto. As illustrated in
As illustrated in
The coupling portion 5 is arranged between the valve main body 6, in which the sealing portion 4 is provided, and the actuator 3. The coupling portion 5 is configured to connect the valve shaft 34 and a rotation shaft (not shown), which allows the valve shaft 34 to be integrally rotated, to each other. The coupling portion 5 includes a spacer member 59, an adaptor plate 60, and a coupling member 62. The spacer member 59 is arranged between the sealing portion 4 and the actuator 3. The adaptor plate 60 is fixed to an upper portion of the spacer member 59. The coupling member 62 is accommodated in a space 61 having a columnar shape formed in a state of penetrating an inside of the spacer member 59 and the adaptor plate 60, and connects the valve shaft 34 and the rotation shaft (not shown) to each other. The spacer member 59 is obtained by forming metal, for example, SUS, into a rectangular tube shape, which has substantially the same shape in plan view as that of the valve main body 6 and a relatively small height. The spacer member 59 is fixed to both the valve main body 6 and the adaptor plate 60 through means such as screw fastening. Further, as illustrated in
As illustrated in
As illustrated in
In
<Operation of Three-way Motor Valve>
In the three-way motor valve 1 according to the embodiment of the present invention, the flow rate of the fluid is controlled as follows.
As illustrated in
In the first embodiment of the present invention, the gap G1 between the outer peripheral surface of the valve shaft 34 and the concave portion 74 of the first valve seat 70 or the concave portion 84 of the second valve seat 80 is set to be smaller than 10 μm. However, the gap G1 between the outer peripheral surface of the valve shaft 34 and the concave portion 74 of the first valve seat 70 or the concave portion 84 of the second valve seat 80 is not limited to the above-mentioned value. The gap G1 may be set to a value smaller than the above-mentioned value, for example, may satisfy the gap G1=0 μm (contact state). Alternatively, the gap G1 may be set to 10 μm or more.
As illustrated in
As illustrated in
At this time, as illustrated in
As illustrated in
Further, in the three-way motor valve 1, each of the both end portions 45a and 45b of the valve operating portion 45 in the circumferential direction has a cross section having a curved-surface shape or a flat-surface shape. Thus, the opening areas of the first and second valve ports 9 and 18 can be linearly changed with respect to the rotation angle of the valve shaft 34. Further, it is conceivable that the fluid regulated in flow rate by the both end portions 45a and 45b of the valve operating portion 45 flow in a form of a nearly laminar flow. Therefore, the mixture ratio (flow rate) between the fluid can be controlled with high accuracy in accordance with the opening areas of the first valve port 9 and the second valve port 18.
In the three-way motor valve 1 according to the first embodiment of the present invention, as described above, under an initial state, the valve operating portion 45 of the valve shaft 34 simultaneously closes (completely closes) the first valve port 9 and opens (completely opens) the second valve port 18.
At this time, in the three-way motor valve 1, when the valve operating portion 45 of the valve shaft 34 closes (completely closes) the first valve port 9, ideally, the flow rate of the fluid should be zero.
However, as illustrated in
Incidentally, in the three-way motor valve 1 according to the first embodiment of the present invention, as illustrated in
Therefore, in the three-way motor valve 1, in order to prevent metal-to-metal biting of the valve shaft 34 into the inner peripheral surface of the valve seat 8, even when the valve shaft 34 is provided in a freely rotatable manner so as to be held in non-contact with the valve seat 8 with the slight gap between the outer peripheral surface of the valve shaft 34 and the inner peripheral surface of the valve seat 8, inflow of the fluid through the first valve port 9 into the slight gap G2 defined between the outer peripheral surface of the valve shaft 34 and the inner peripheral surface of the valve seat 8 is significantly restricted and suppressed by the gap G1 that is a region corresponding to a partially reduced gap between the outer peripheral surface of the valve shaft 34 and the inner peripheral surface of the valve seat 8.
Accordingly, the three-way motor valve 1 can significantly suppress leakage of the fluid when the three-way motor valve 1 completely closes the valve port as compared to a three-way motor valve that does not include the concave portions 74 and 84 formed to partially reduce the gap between the valve shaft 34 and the first valve seat 70, which is opposed to the valve shaft 34, and the gap between the valve shaft 34 and the second valve seat 80, which is opposed to the valve shaft 34.
Preferably, the three-way motor valve 1 according to the first embodiment of the present invention can significantly reduce the gaps G1 and G2 through contact of the concave portion 74 of the first valve seat 70 and the concave portion 84 of the second valve seat 80 with the outer peripheral surface of the valve shaft 34, thereby significantly suppressing leakage of the fluid when the three-way motor valve 1 completely closes the valve port.
Further, similarly, the three-way motor valve 1 can significantly suppress leakage and outflow of the fluid through the second valve port 18 to another first valve port 9 side even when the valve operating portion 45 of the valve shaft 34 closes (completely closes) the second valve port 18.
Moreover, as illustrated in
Therefore, in the three-way motor valve 1 against which no countermeasures are taken, due to the difference in pressure between the second valve port 18 and the first valve port 9, the valve shaft 34 is moved (displaced) to the side of the first valve port 9 under a relatively low pressure so that the valve shaft 34 is held in unbalanced contact with the bearing 41. As a result, there is a fear in that driving torque is increased when the valve shaft 34 is driven to rotate in a direction of closing the valve shaft 34, thereby causing operation malfunction.
In contrast, in the three-way motor valve 1 according to the first embodiment of the present invention, as illustrated in
Further, the three-way motor valve 1 according to the first embodiment of the present invention similarly operates also under a state in which the first valve port 9 is nearly completely opened, that is, the second valve port 18 is nearly completely closed, and thus can prevent and suppress the increase in driving torque when the valve shaft 34 is driven to rotate.
Incidentally, in the three-way motor valve 1 configured as described above, a flow coefficient Cv value is calculated by the following relational expression. Here, V, G, and ΔP represent a flow rate of a fluid (1/min), specific gravity of the fluid (specific gravity of water is equal to one), and a differential pressure (kPa), respectively.
When the three-way motor valve 1 is used as the first three-way valve 103 for flow rate control for mixture, the differential pressure ΔP represents a difference between the pressure at the first inflow port 7 and the pressure at the outflow port 26, and a difference between the pressure at the second inflow port 18 and the pressure at the outflow port 26. Accordingly, the flow coefficient Cv value of the three-way motor valve 1 varies between a case in which there is the difference in pressure between the first inflow port 7 and the second inflow port 18 and a case in which there is no difference in pressure therebetween.
In the three-way motor valve 1, when the flow rate at the first inflow port 7 and the flow rate at the second inflow port 18 are substantially equal, it can be considered that the pressure at the first inflow port 7 and the pressure at the second inflow port 18 are substantially equal. However, when the opening degree of the valve shaft 34 of the three-way motor valve 1 is deviated from 50%, the flow rate at the first inflow port 7 and the flow rate at the second inflow port 18 differ from each other. As a result, it cannot be considered that the pressure at the first inflow port 7 and the pressure at the second inflow port 18 are substantially equal. Thus, the three-way motor valve 1 has the difference in pressure between the first inflow port 7 and the second inflow port 18, with the result that characteristics of the flow coefficient Cv value vary. Thus, in the three-way motor valve 1, in accordance with the opening degree of the valve shaft 34, the pressure at the first inflow port 7 and the pressure at the second inflow port 18 differ from each other, and the flow coefficient Cv value is deviated from the values shown in
According to studies conducted by the inventor of the present invention, as described above, the flow rate of the fluid flowing through the three-way motor valve 1 depends on the flow coefficient Cv value. However, when the pressure at the first inflow port 7 and the pressure at the second inflow port 18 differ from each other, it is apparent that the flow coefficient Cv value varies, and that a target mixture ratio between the lower temperature fluid and the higher temperature fluid cannot be obtained.
Therefore, in the embodiment of the present invention, as illustrated in
Further, in the embodiment of the present invention, as illustrated in
That is, as illustrated in
In contrast, in the embodiment of the present invention, even when the mixture ratio between the higher temperature fluid and the lower temperature fluid in the first three-way valve 103 for flow rate control is 6:4, the fourth three-way valve 116 for flow rate control is configured to, without controlling the ratio (flow rate ratio) between the higher temperature fluid returned to the higher temperature fluid supply portion 102 through the second bypass pipe 114 and the fluid for temperature control distributed by the second three-way valve 108 for flow rate control to the higher temperature fluid supply portion 102 to 4:6, control the ratio to, for example, 5:5 by performing control so as to reduce a ratio (flow rate ratio) of the fluid for temperature control distributed by the second three-way valve 108 for flow rate control to the higher temperature fluid supply portion 102.
Similarly, in the embodiment of the present invention, even when the mixture ratio between the higher temperature fluid and the lower temperature fluid in the first three-way valve 103 for flow rate control is 4:6, the third three-way valve 112 for flow rate control is configured to, without controlling the ratio (flow rate ratio) between the higher temperature fluid returned to the higher temperature fluid supply portion 102 through the second bypass pipe 114 and the fluid for temperature control distributed by the second three-way valve 108 for flow rate control to the higher temperature fluid supply portion 102 to 6:4, control the ratio to, for example, 7:3 by performing control so as to reduce a ratio (flow rate ratio) of the fluid for temperature control distributed by the second three-way valve 108 for flow rate control to the higher temperature fluid supply portion 102.
In this manner, in the embodiment of the present invention, in a case in which the three-way motor valve 1 is used as the first three-way valve 103 for flow rate control for mixture, even when, in accordance with the opening degree of the valve body of the first three-way valve 103 for flow rate control, the flow rates of the lower temperature fluid and the higher temperature fluid flowing into the valve through the first inflow port 7 and the second inflow port 18 differ from each other and the pressure at the first inflow port 7 and the pressure at the second inflow port 18 differ from each other, the opening degree of the valve shaft 34 of the fourth three-way valve 116 for flow rate control is controlled to obtain not the ratio of 4:6, which is originally set, but the ratio of 5:5 in such a manner that the flow rate of the fluid flowing to a bypass side of the fourth three-way valve 116 for flow rate control is relatively increased, thereby reducing the ratio of the flow rate of the higher temperature fluid to be supplied to the first three-way valve 103 for flow rate control. As a result, the pressure of the higher temperature fluid to be supplied to the first three-way valve 103 for flow rate control is increased, thereby ensuring the flow rate of the higher temperature fluid to be supplied to the first three-way valve 103 for flow rate control.
Similarly, in the embodiment of the present invention, even when the mixture ratio between the lower temperature fluid and the higher temperature fluid in the first three-way valve 103 for flow rate control is 4:6, without controlling the ratio (flow rate ratio) between the lower temperature fluid returned to the lower temperature fluid supply portion 101 through the first bypass pipe 110 and the fluid for temperature control distributed by the second three-way valve 108 for flow rate control to the lower temperature fluid supply portion 101 to 6:4, the third three-way valve 112 for flow rate control controls the ratio to, for example, 7:3 by performing control so as to reduce a ratio (flow rate ratio) of the fluid for temperature control distributed by the second three-way valve 108 for flow rate control, which is a main passage side, to the lower temperature fluid supply portion 101. As a result, the pressure of the lower temperature fluid to be supplied to the first three-way valve 103 for flow rate control is increased, thereby ensuring the flow rate of the lower temperature fluid to be supplied to the first three-way valve 103 for flow rate control.
Therefore, in the chiller device 100, in a case in which the three-way motor valve 1 is used as the first three-way valve 103 for flow rate control for mixture, even when, in accordance with the opening degree of the valve body of the first three-way valve 103 for flow rate control, the pressures of the lower temperature fluid and the higher temperature fluid flowing into the valve through the first inflow port 7 and the second inflow port 18 differ from each other and the flow rates of the lower temperature fluid and the higher temperature fluid differ from the predetermined flow coefficient Cv values, the opening degree of the valve shaft 34 of each of the third and fourth three-way valves 112 and 116 for flow rate control is changed from the original value, thereby ensuring the pressures of the lower temperature fluid and the higher temperature fluid flowing into the valve through the first inflow port 7 and the second inflow port 18. Thus, a desired mixture ratio between the lower temperature fluid and the higher temperature fluid is obtained, thereby being capable of controlling the temperature of the temperature control target with excellent accuracy.
The present invention is capable of controlling a mixture ratio between the lower temperature fluid and the higher temperature fluid with excellent accuracy, and is capable of controlling control temperatures for a temperature control target in a plurality of steps.
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