A wafer support pin lifting device includes a support plate, a slide block and a lifting pole. The support plate is for supporting multiple support pins. The slide block is slidably connected to an inner wall of a cavity so that the slide block slides relative to the cavity. The lifting pole has a first end, a second end and a third end. The first end is connected to the support plate, the second end is pivotally connected to the slide block, and the third end is connected to an actuator. With the pivotal connection between the second end of the lifting pole and the slide block, the lifting pole approaching the high position causes the support plate to be approximately horizontal, and the lifting pole approaching the low position causes the support plate to be tilted.
|
1. A wafer support pin lifting device, suitable for a cavity, the device comprising:
a support plate, for supporting a plurality of support pins;
a slide block, slidably connected to an inner wall of a cavity so that the slide block slides relative to the cavity; and
a lifting pole, having a first end, a second end and a third end, wherein the first end is connected to the support plate, the second end is pivotally connected to the slide block, the third end is connected to an actuator, and the actuator is for controlling the lifting pole to ascend and descend between a high position and a low position;
wherein, with a pivotal connection between the second end of the lifting pole and the slide block, the lifting pole approaching the high position causes the support plate to be approximately horizontal, and the lifting pole approaching the low position causes the support plate to be tilted.
2. The wafer support pin lifting device according to
3. The wafer support pin lifting device according to
4. The wafer support pin lifting device according to
5. The wafer support pin lifting device according to
6. The wafer support pin lifting device according to
7. The wafer support pin lifting device according to
8. The wafer support pin lifting device according to
9. The wafer support pin lifting device according to
10. The wafer support pin lifting device according to
11. The wafer support pin lifting device according to
12. The wafer support pin lifting device according to
13. The wafer support pin lifting device according to
14. The wafer support pin lifting device according to
|
|||||||||||||||||||||||||||||||
This non-provisional application claims priority under 35 U.S.C. § 119(a) to Patent Application No(s). 202011633338.2 filed in China on Dec. 31, 2020, the entire contents of which are hereby incorporated by reference.
The present invention relates to a lifting device, and more particularly to a lifting device for controlling wafer support pins in a processing cavity.
A semiconductor film on a wafer or a substrate is formed in a cavity of a coating device (or a processing device). Mechanical fingers place a wafer to be processed on a plurality of support pins of a carrier plate in the cavity, or take a processed wafer out of a cavity from support pins on a carrier plate. The support pins are components that can ascend or descend relative to the carrier plate, so as to transfer the wafer from the mechanical fingers onto the carrier plate.
It is conventionally known that a lifting device for controlling lifting of the support pins is configured below the carrier plate at a bottom portion of the cavity. In general, it is known that a lifting device can raise or lower support pins with vertical degrees of freedom, and in order to ensure that the wafer does not slip on the support pins while the wafer is transferred by the mechanical pins, horizontal levels of these support pins need to be kept at an equal height, or it is necessary that any tilting of common mechanisms connecting these support pins be avoided. In a situation where the support pins are kept at an equal height, if the cavity still contains gas when the support pins lower the wafer onto the carrier plate, the wafer may encounter airflow disturbances as approaching a surface of the carrier plate and possibly shifted. When the support pins raise the wafer, if any slight vacuum suction force exists between a bottom surface of the wafer and the surface of the carrier plate, the wafer may slip on the support pins at the instant moment when lifted. There are known techniques that use a plurality of independent lifting devices to respectively control lifting of the support pins, allowing tilting of the wafer and a contact with the carrier plate. However, such control strategy involves complications. Moreover, if any of the lifting device malfunctions, shifting of the position of the wafer may be caused.
Therefore, there is a need for a simple support pin lifting device that allows a wafer to contact a carrier plate at a tolerable tilting angle.
It is an object of the present invention to provide a wafer support pin lifting device suitable for a cavity. The wafer support pin lifting device includes: a support plate, for supporting a plurality of support pin; a slide block, slidably connected to an inner wall of the cavity so that the slide block slides relative to the cavity; and a lifting pole, having a first end, a second end and a third end. The first end is connected to the support plate, the second end is pivotally connected to the slide block, and the third end is connected to an actuator, wherein the actuator is for controlling the lifting pole to ascend and descend between a high position and a low position. With the pivotal connection between the second end of the lifting pole and the slide block, the lifting pole approaching the high position causes the support plate to be approximately horizontal, and the lifting pole approaching the low position causes the support plate to be tilted.
In a specific embodiment, the support plate has a top portion and a bottom portion. The top portion is for carrying the plurality of support pins, and the bottom portion is connected to the first end of the lifting pole.
In a specific embodiment, the top portion of the support plate has a first support portion, a second support portion and a third support portion for carrying the plurality of support pins. The bottom portion of the support plate has a sleeve, the position of the sleeve is opposite to the position of the first support portion, and the sleeve is connected to the first end of the lifting pole.
In a specific embodiment, the inner wall of the cavity is provided with a slide track, and the slide block is connected to the inner wall via the slide track so that the slide block ascends and descends relative to the inner wall.
In a specific embodiment, the first end of the lifting pole is opposite to the third end, the second end of the lifting pole is located between the first end and the third end, the second end has a connection arm laterally extending from the lifting pole, and the connection arm is pivotally connected to the slide block so that the lifting pole is pivotal relative to the slide block.
In a specific embodiment, the slide block has an inner side and an outer side. The outer side has a slide channel for connecting to the slide track, a first limiting surface and a second limiting surface are formed at the inner side, and the first limiting surface and the second limiting surface are opposite so as to form an accommodating space.
In a specific embodiment, the connection arm has a top portion and a bottom portion. The top portion of the connection arm has a protrusion, and the protrusion extends upwards from a top portion of the connection arm and is partially accommodated in the accommodating space formed by the first limiting surface and the second limiting surface.
In a specific embodiment, the second limiting surface is provided with a first spring, and the first spring applies a lateral biasing force towards the first limiting surface on the protrusion.
In a specific embodiment, the inner wall is provided with a second spring, and the second sprig is located below the connection arm and configured to apply an upward biasing force on the bottom portion of the connection arm when the lifting pole approaches the low position, so that the lifting pole pivots relative to the slide block, causing the support plate tilted.
In a specific embodiment, the connection arm at the high position receives only the lateral biasing force applied on the protrusion from the first spring, so that the protrusion contacts the first limiting surface to force the support plate to become horizontal, and the horizontal support plate causes the plurality of support pins to be at same horizontal level.
In a specific embodiment, the connection arm at the low position receives the lateral biasing force applied on the protrusion from the first spring and the upward biasing force applied on the bottom portion of the connection arm from the second spring, so that the support plate is forced to become tilted, and the tilted support plate causes the plurality of support pins to be at different horizontal levels.
In a specific embodiment, a bottom portion of the slide block has a pair of pivotal arms, and the connection arm of the lifting pole is located between the pair of pivotal arms and forms a pivotal connection between the connection arm and the pair of pivotal arms via a shaft.
In a specific embodiment, the second spring is located between the shaft and the inner wall and is secured by a fixing seat on the inner wall.
It is another object of the present invention to provide a cavity having a carrier plate for carrying a wafer. The support plate is below the carrier plate, the plurality of support pins are configured to ascend and descend relative to the carrier plate, the support plate at the high position forces the plurality of contacted support pins to be raised at same horizontal level above the carrier plate, and the support plate at the low position forces the plurality of contacted support pins to be raised at different horizontal levels above the carrier plate, so that the wafer supported by the plurality of support pins away from above the carrier plate is horizontal, and the wafer close to the carrier plate is tilted until the wafer is completely placed on the carrier plate.
Reference can be made to the drawings and description below to better understand the present invention. Non-limiting and non-exhaustive embodiments are described with reference to the drawings below. It is to be noted that the components in the drawings are not necessarily drawn to their actual sizes, and are depicted to focus on the description on structures and principles.
In
To better describe the present invention, examples and specific embodiments are given with the accompanying drawings below. However, the subject matter of the application may be specifically implemented in various different forms, and the construction covered or asserted by the subject matter of the application is not limited to any exemplary specific embodiments disclosed in the detailed description of the application; it should be understood that the specific embodiments are non-limiting and are not to be construed as restrictive. Similarly, the present invention is to provide a reasonably broad scope for the subject matter applied or covered by the subject matter. In addition, the asserted subject matter may be implemented in form of a method, device or system. Thus, the specific embodiments may be embodied by any combination (non-software known) of such as hardware, software and firmware.
The expression “in one embodiment” used in the literature of the application does not necessarily refer to the same specific embodiment, and the expression “in other (some/certain) embodiments” used in the literature of the application does not necessarily refer to different specific embodiments. The object of the above is, for example, to include combination of all or part of the exemplary specific embodiments by the subject matter set forth.
The carrier plate (12) is provided with a plurality of support pins (121), which can ascend and descend relative to the carrier plate (120). For example, these support pins (121) may be raised to a high position, so that mechanical fingers entering the cavity from the wafer transfer port (201) can place the wafer on these support pins (121) at the high position. Then, these support pins (121) are lowered to a low position (for example, a position lower than a surface of the plate) so as to transfer the wafer onto the carrier plate (12) to complete placement of the wafer. As given in the description of the related prior art, conventional support pins are kept at the same height during a motion process from a high position to a low position (or from a low position to a high position), such that an airflow is easily caused at a bottom portion of the wafer and a surface of the carrier plate to shift the wafer. Thus, the effect to be achieved by the present invention is to both lower and to raise a wafer on a carrier plate in a tilted manner.
The wafer support pin lifting device (10) includes a support plate (101), which is configured below the carrier plate (12) and is capable of ascending and descending movements. According to
The support plate (101) has a top portion (1014) and a bottom portion (1015). The top portion (1014) is substantially a flat surface, and is for contacting bottom ends of the support pins (121). Thus, when the support plate (101) is in a horizontal state, that is, when the support plate (101) is parallel to the carrier plate (12), the support pins (121) are equivalent to being located on a same horizontal plane, and these support pins (121) protrude from the carrier plate (12) with a same height. When the support plate (101) is in a tilted state, that is, when the support plate (101) is not parallel to the carrier plate (12), the bottom ends of these support pins (121) may located at different heights, and these support pins (121) protrude from the carrier plate (12) with different heights. Accordingly, whether the support plate (101) is horizontal or tilted affects the relation between the wafer and the carrier plate (12). In particular, a means of the support plate (101) lowered to a low position and exhibiting a tilted state is one of the technical results to be achieved by the present invention.
The wafer support pin lifting device (10) of the present invention further includes a slide block (102), which is slidably connected to the inner wall (202). In particular, an inner side of the inner wall (202) is provided with a slide track (2021), so that the slide block (102) is connected to the inner wall (202) via the slide track (2021) and is thus operable to ascend or descend. Specifically, the slide block (102) moves between a high position and a low position on the slide track (2021). The slide block (102) primarily guides the ascending and descending movements of the wafer support pin lifting device (10) of the present invention, and limits a level of tilting of the support plate (101). Other details of the slide block (102) will be described later.
It is to be understood that, the terms “high position” and “low position” used in the disclosure do not simply refer to a highest position and a lowest position defined by the mechanical structure itself. The terms “high position” and “low position” in the disclosure are to be interpreted as a relative relation of ascending and descending movements in a predetermined range; that is, the term “high position” in the disclosure should include a highest position or the vicinity of the highest position of the ascending and descending movements, and the term “low position” should include a lowest position or the vicinity of the lowest position of the ascending and descending movements. For example, “high position” and “low position” of the slide track (2021) are not necessarily at ends of the track.
The slide block (102) is coupled to the support plate (101) by a lifting pole (103). Specifically, the slide block (102) is pivotally connected to the lifting pole (103), and the two are configured such that the lifting pole (103) pivotally rotates relative to the slide block (102) during the ascending and descending movements. The lifting pole (103) passes through and fixedly connected to the bottom of the support plate (101), so that the lifting pole (103) tilts the support plate (101) according to the pivoting during the ascending and descending movements.
An actuator (104) is provided at a bottom end of the inner wall (202) and below the lifting pole (103), and is connected to the lifting pole (103) by a post (1041). Specifically, the actuator (104) is a cylinder actuator, is connected to the lifting pole (103) by the post (1041) and is for used for controlling ascending and descending movements of the lifting pole (103). The lifting pole (103) also drives the slide block (102) for synchronous ascending and descending movements. Other details of the lifting pole (103) will be described later.
The limiting portion (1024) has a first spring (605), which is configured at the second limiting surface (604) and is compressible in a horizontal direction. The first spring (605) is for contacting the inner side (1039) of the protrusion (1036) and applying a lateral biasing force on the protrusion (1036). Preferably, the lateral biasing force is continuously applied on the protrusion (1036), forcing the outer side (1038) of the protrusion (1036) to touch against the first limiting surface (602) so as to ensure that the lifting pole (103) is kept in an erected state. The third gap (G3) can determine the compression level of the first spring (605). For example, when the lifting pole (103) starts pivotally rotating from the erected state, the inner side (1039) of the protrusion (1036) first compresses the first spring (605), preventing the protrusion (1036) from direct colliding with the second limiting surface (604). The degree of the pivoting may be determined by the second limiting surface (604). However, in other possible implementations, the range of the pivoting may be determined by the gaps (G1, G2, G3 and G4).
Referring to
During the process of the lifting pole (103) being lowered from the high position to the low position and before contacting the second spring (606), the lifting pole (103) is kept in the erected state. Thus, the wafer (700) is kept horizontal during the descending process, until the wafer (700) is about to touch the surface of the carrier plate (12). Once the connection arm (1034) starts contacting the second spring (606), the upward biasing force forces the lifting pole (103) to start the deflection. Specifically, the top portion (that is, the first end 1031) of the lifting pole (103) starts to tilt toward the column at the bottom of the carrier plate (12), and the tilting becomes more noticeable as the descending of the lifting pole (103) increases. The support plate (101) also tilts in synchronization. Referring to
Movement of the mechanism should be designed such that before the wafer is about to but not yet contacting the carrier plate (12), the lifting pole (103) necessarily touches the second spring (606) to start the deflection. During the descending process to the low position, a lower end of the tilted wafer (700) first touches the carrier plate (12), and the other higher end in opposite then subsequently touches the carrier plate (12). The placement approach above helps gradual discharge of air from between the wafer (700) and the carrier plate (12), preventing drastic air flow disturbances. In other words, the two support pins (121) away from the lifting pole (103) first lower to the low position, and the support pin (121) close to the lifting pole (103) then last lowers to the low position. As shown in
Similarly, the same strategy is used for raising the wafer (700) from the carrier plate (12). The raised lifting pole (103) first lifts the support pins (121) at the distal and proximal ends, so that one end of the wafer (700) is first lifted and the other opposite end is then lifted. The lifting approach above helps gradually drawing air into between the wafer (700) and the carrier plate (12), preventing drastic air flow disturbances. Once the upward biasing force from the second spring (606) has decreased to a point where it no longer acts on the lifting pole (103), the wafer (700) is deflected to the horizontal state as shown in
The support pins of the present invention are described in detail by way of the preferred embodiments and the accompanying above. All the features disclosed in the present application may be combined with other means, and each of the features disclosed in the present application may also be selectively replaced by the same, equivalent to similar objective features. Therefore, apart from the more obvious features, the features disclosed in the present application are merely one example of equivalent or similar features. With the preferred embodiments of the present invention, a person skilled in the art could understand that the present invention is a novel, inventive and industrially applicable invention and possesses development values. Various modifications may be made to the present invention by a person skilled in the art without departing from the scope of protection of the appended claims.
Yang, Dezan, Yang, Hualong, Wu, Fengli
| Patent | Priority | Assignee | Title |
| Patent | Priority | Assignee | Title |
| 4825714, | Oct 25 1984 | Omron Tateisi Electronics Co. | Pivotal micromotion device |
| 9460954, | Feb 22 2009 | ASML NETHERLANDS B V | Method of clamping a substrate and clamp preparation unit using capillary clamping force |
| 20030000775, | |||
| 20110222038, | |||
| 20110236162, | |||
| 20150243542, | |||
| 20170287753, | |||
| 20180350644, | |||
| 20180350654, | |||
| CN110970343, |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Dec 14 2021 | Piotech Inc. | (assignment on the face of the patent) | / | |||
| Jan 03 2022 | YANG, DEZAN | PIOTECH INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 058585 | /0384 | |
| Jan 03 2022 | YANG, HUALONG | PIOTECH INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 058585 | /0384 | |
| Jan 03 2022 | WU, FENGLI | PIOTECH INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 058585 | /0384 |
| Date | Maintenance Fee Events |
| Dec 14 2021 | BIG: Entity status set to Undiscounted (note the period is included in the code). |
| Dec 27 2021 | SMAL: Entity status set to Small. |
| Date | Maintenance Schedule |
| May 21 2027 | 4 years fee payment window open |
| Nov 21 2027 | 6 months grace period start (w surcharge) |
| May 21 2028 | patent expiry (for year 4) |
| May 21 2030 | 2 years to revive unintentionally abandoned end. (for year 4) |
| May 21 2031 | 8 years fee payment window open |
| Nov 21 2031 | 6 months grace period start (w surcharge) |
| May 21 2032 | patent expiry (for year 8) |
| May 21 2034 | 2 years to revive unintentionally abandoned end. (for year 8) |
| May 21 2035 | 12 years fee payment window open |
| Nov 21 2035 | 6 months grace period start (w surcharge) |
| May 21 2036 | patent expiry (for year 12) |
| May 21 2038 | 2 years to revive unintentionally abandoned end. (for year 12) |