A method of forming an electrically conductive floor or wall coating that includes: applying to the surface of the floor or wall a first coating consisting essentially of a conductive pigment A, an inorganic binder in which the pigment is dispersed, and a hardener; allowing the first coating to become tack free, and applying to the first coating a second coating consisting of a conductive pigment B, a non-conductive pigment C, a binder in which pigements B and C are dispersed, and a flow control substance; and allowing the second coating to become dry to the touch.

Patent
   5118578
Priority
Dec 11 1989
Filed
Dec 11 1989
Issued
Jun 02 1992
Expiry
Dec 11 2009
Assg.orig
Entity
Small
6
4
all paid
1. The method of forming an electrically conductive floor or wall coating, that includes:
a) applying to the surface of the floor or wall a first coating consisting essentially of an electrically conductive pigment A, an organic binder in which the pigment is dispersed, and a hardener,
b) allow the first coating to dry, and
c) applying to the first coating a second coating consisting of an electrically conductive pigment B, a non electrically conductive pigment C, a binder in which pigments B and C are dispersed, and a flow control substance,
d) and allowing the second coating to dry,
e) said binder in each coating consisting essentially of epoxide,
f) said hardener in each coating selected from the group consisting of polyfunctional amines,
g) the weight percentages of first coating ingredients are:
______________________________________
pigment A 25 to 65 wt. %
binder 10 to 50 wt. %
hardener 20 to 40 wt. %
______________________________________
h) the weight percentage of second coating ingredients are:
______________________________________
pigment B 30 to 50 wt. %
pigment C 10 to 20 wt. %
binder 20 to 40 wt. %
hardener 10 to 20 wt. %
______________________________________
i) and wherein the electrical resistance of the composite of the two coatings, as measured at the surface of the second coating, when cured, is between 1 and 100 megohms.
2. The method of claim 1 wherein the electrical resistance of the first coating when cured is between 0 and 1 megohm.
3. The method of claim 1 wherein the electrical resistance of the first coating is about 200,000 ohms.
4. The method of claim 1 wherein said coatings have thicknesses as follows:
first coating: between 0.005 and 0.010 inches
second coating: between 0.10 and 0.3 inches
5. The method of claim 1 wherein said coatings are applied at ambient temperatures.
6. The conductive floor or wall coating produced by the method of claim 1.

This invention relates generally to the provision of work or other surfaces having controlled electrical conductivity, and more particularly, the provision of coatings on floor or other surfaces, such coatings characterized a providing electrical conductivity, such as to allow electrical current flow.

It is found that material surfaces, typically having certain moisture content, provide for electrical current flow, but that when such surfaces become dry, their resitivity increases to the point that electrical current will not flow in or through them.

In certain instances it becomes necessary to provide for assured electrical current flow in or through surfaces (such as floors, walls, etc.), an example being in electronic assembly rooms where grounding leads are attached between workers' wrists and the floor, to ground stray current. Accordingly, there is need for assuredly conductive surfaces.

It is a major object of the invention to provide a method for producing such an assuredly conductive surface or surfaces. Basically, the method includes the steps:

a) applying to the surface of the floor or wall a first coating consisting essentially of a conductive pigment A, an organic binder in which the pigment is dispersed, and a diluent (hardener),

b) allowing the first coating to set (dry tack free), and

c) applying to the first coating a second coating consisting of a conductive pigment B, a non-conductive pigment C, and organic binder in which pigments B and C are dispersed, and a flow control substance,

d) and allowing the second coating to dry.

Further, the method includes determining the electrical resistance of the first coating, and of the composite of the two coatings. As will appear, the resistance of the first coating must be between 0 and 500,000 ohms, and the resistance of the second coating must be between 1 and 100 megohms.

The coatings are applied to have total thickness between 0.010 and 0.250 inches; and each coating is at least 0.005 inch thick.

These and other objects and advantages of the invention, as well as the details of an illustrative embodiment, will be more fully understood from the following specification and drawings, in which:

FIG. 1 is an elevation taken in section showing application of a first coating to a surface;

FIG. 2 is a view like FIG. 1 showing application of a second coating onto the first coating;

FIG. 3 is a view like FIG. 1 showing electrical resistance testing of the first coating; and

FIG. 4 is a view like FIGS. 1 and 2 showing the completed and cured coatings, and electrical resistance testing.

FIG. 1 shows application at 10 of first coating material 11 onto a surface 12. While the description will refer to a floor surface, it will be understood that the invention is applicable to any surface, such as a wall, floor, ceiling, etc. The material is in a spreadable mass or slowly flowable viscous condition, and wets surface 12. A leveling device 13 may be employed to produce a uniform thickness "t", coating 11a and that dimension may vary from 0.003 inches to a larger thickness. The material 11 is typically applied under ambient temperature conditions, and it dries to form coating 11a bonded to the surface 12, in from about 30 minutes to about 24-48 hours, depending upon formulation of the binder component in the coating.

After completion of first coating drying, a second material 16 is applied at 17 onto the exposed surface of the first coating 11'. Material 16 is in spreadable mass or slowly flowable viscous condition, and wets the surface 11b of coating 11a. Leveling device 13a may be employed to produce uniform thickness "t2 " coating 16a, and that coating may vary from 0.005 inches to a larger thickness, where the total thickness T of both coatings (t1 and t2) is between 0.010 inches and about 0.250 inches. The second coating is then cured at ambient temperature for between 30 minutes to 24-48 hours, depending upon its formulation.

The coating ingredients and their amounts consist essentially of:

______________________________________
FIRST COATING
Range of Preferred
Ingredient wt. % wt. %
______________________________________
conductive pigment A
25 to 65 40
binder 10 to 50 40
hardener (diluent)
20 to 40 20
______________________________________

The conductive, comminuted pigment A consists of one or more of the following:

carbon particles

silver or silver coated particles

nickel or nickel coated particles

copper or copper coated particles

These particles may be one or more of the following forms:

powder (5 microns to 30 mils)

flake (30 microns to 30 mils cross dimension and 0.3 microns to 5 mils thick)

fiber (30 mils to 0.5 inch, in length, and 20 microns to 5 mils thick)

Among the suitable binders are: acrylics, epoxides, and polyvinyls. Hardeners include: polyfunctional amines (alkyl diphenyl ether, for example) for epoxides; and suitable known catalysts for acrylics and vinyls. The ingredients in the coating are thoroughly mixed, so that the pigment particles are completely dispersed, uniformly, in the binder, prior to application.

______________________________________
SECOND COATING
Range of Preferred
Ingredient wt. % wt. %
______________________________________
conductive pigment B
30 to 50 40
non-conductive pigment C
10 to 20 15
binder 20 to 40 30
hardener (diluent) 10 to 20 15
______________________________________

The particulate on conductive pigment B consists of one or more of the following (as in the case of A):

powder (5 microns to 30 mils)

flake (30 microns to 30 mils cross dimension and 0.3 microns to 5 mils thick)

fiber (30 mils to 0.5 inch, in length, and 20 microns to 5 mils thick)

The binder and hardener may have the same compositions in the first coating. The non conductive pigment C consists of silica flour, clay, or other inert particulate material, and typically has a size between 5 microns to 50 mils.

FIG. 3 shows electrical resistance testing of the first layer 11a, using electrodes 20 and 21 separated by distance "d" and contacting the surface of the cured coating. Resistance of this coating must be in the range 0 to 1 megohm under applied voltage of 10 to 1000 volts applied to 20. Electrode 21 is grounded.

FIG. 4 shows electrical resistance testing of the final composite of coatings 11a and 16a, using electrodes 20 and 21 separated by distance "d", and contacting the upper surface of coating 16a. Electrical resistance must be in the range 1 to 100 megohms under applied voltage of 10 to 1,000 volts. The preferred electrical resistance of the composite is about 5 megohm; and the preferred electrical resistance of the first coating is about 200,000 ohms.

The coatings have thicknesses as follows:

first coating: between 0.005 and 0.010 inches

second coating: between 0.10 and 0.3 inches

The coatings are applied at ambient temperature.

Berger, Albert J., Engay, Cir C.

Patent Priority Assignee Title
5545250, Jul 30 1993 Milliken & Company Polytype electroconductive powders
5631311, Aug 18 1994 Milliken & Company Transparent static dissipative formulations for coatings
5716553, Jul 30 1993 Milliken & Company Polytype electroconductive powders
5885706, Aug 18 1994 Milliken & Company Transparent, static-dissipative formulations for coatings
6004889, Apr 28 1998 Kabushiki Kaisya Nippankenkyusyo Composition for antistatic finish
6477027, Jun 02 2000 Hubbell Incorporated Grounding mat
Patent Priority Assignee Title
3894169,
4460625, Aug 29 1980 Rohm and Haas Company Method of coating and impregnating concrete substrates, and products obtained thereby
4699820, Dec 03 1984 Armstrong World Industries, Inc. Decorative materials comprising crinkled chips
4879143, Dec 06 1985 Rang KG Haus Moderner Fussboden Process for the production of floor covering
//////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Nov 28 1989BERGER, ALBERT J COATINGS COMPOSITES, A CA CORP ASSIGNMENT OF ASSIGNORS INTEREST 0051920594 pdf
Nov 28 1989ENGAY, CIR C COATINGS COMPOSITES, A CA CORP ASSIGNMENT OF ASSIGNORS INTEREST 0051920594 pdf
Dec 11 1989Coatings/Composites(assignment on the face of the patent)
Dec 14 1992SAUEREISEN CEMENTS COMPANYMELLON BANK, N A SECURITY INTEREST SEE DOCUMENT FOR DETAILS 0064190216 pdf
Dec 15 1992COATINGS COMPOSITIES, INC SAUEREISEN CEMENTS COMPANYASSIGNMENT OF ASSIGNORS INTEREST 0063760388 pdf
Jan 01 1994SAUEREISEN CEMENTS COMPANYMELLON BANK, N A ASSIGNMENT FOR SECURITY0069450633 pdf
Date Maintenance Fee Events
Aug 14 1995M283: Payment of Maintenance Fee, 4th Yr, Small Entity.
Sep 07 1999M284: Payment of Maintenance Fee, 8th Yr, Small Entity.
Dec 17 2003REM: Maintenance Fee Reminder Mailed.
Jan 14 2004M2553: Payment of Maintenance Fee, 12th Yr, Small Entity.
Jan 14 2004M2556: 11.5 yr surcharge- late pmt w/in 6 mo, Small Entity.


Date Maintenance Schedule
Jun 02 19954 years fee payment window open
Dec 02 19956 months grace period start (w surcharge)
Jun 02 1996patent expiry (for year 4)
Jun 02 19982 years to revive unintentionally abandoned end. (for year 4)
Jun 02 19998 years fee payment window open
Dec 02 19996 months grace period start (w surcharge)
Jun 02 2000patent expiry (for year 8)
Jun 02 20022 years to revive unintentionally abandoned end. (for year 8)
Jun 02 200312 years fee payment window open
Dec 02 20036 months grace period start (w surcharge)
Jun 02 2004patent expiry (for year 12)
Jun 02 20062 years to revive unintentionally abandoned end. (for year 12)