A semiconductor processing robot is provided with a robot arm on which is mounted an integrated edge gripper having an orienting assembly and a detecting assembly. The orienting assembly operates to rotate a substrate such that a substrate reference marking, or indicium, is positioned at the detecting assembly. The detecting assembly detects the location of the reference indicium and thereby derives information about the relative orientation of the substrate in the integrated edge gripper.
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1. A robot for transporting a substrate having a reference indicium, the robot comprising:
a robot arm having at least first and second links disposed between relatively movable proximal and distal portions, wherein the first and second links are pivotably connected to one another at a first end of the second link, and the second link and distal portion are pivotably connected to one another at a second, opposite end of the second link; and an integrated edge gripper mounted at the distal portion of the robot arm such that the integrated edge gripper is movable with respect to the proximal portion, the integrated edge gripper being adapted to support the substrate and comprising: an orienting assembly for orienting the substrate such that the reference indicium is at a predetermined position in the integrated edge gripper; and a detecting assembly adapted to generate a signal indicative of the presence of the reference indicium at the predetermined position. 7. An alignment device for use with a substantially circular, planar substrate having a reference indicium, the alignment device adapted to support the substrate in a support position relative to the alignment device, comprising:
a detecting assembly adapted to generate a signal indicative of the presence of the reference indicium at a predetermined position in the alignment device; and an orienting assembly for orienting the substrate such that the reference indicium is at the predetermined position, the orienting assembly comprising: a first set of one or more wheels each adapted to engage the edge of the substrate and each being mounted for rotation about a corresponding wheel axis; a second set of one or more wheels each adapted to engage the edge of the substrate in an engagement position and each being mounted for rotation about a corresponding wheel axis and for movement between the engagement position and a disengagement position; a first mechanical assembly, including a first motor, for rotating at least one wheel of the first set of wheels, wherein said rotation causes rotation of the substantially circular substrate; and a second mechanical assembly for moving the second set of wheels between the engagement and disengagement positions, wherein, in the disengagement position, the wheels of the second set lie outside the plane of the substrate when the substrate is in the support position. 10. A robot for transporting a substrate having a reference indicium, the robot comprising:
a robot arm having one or more links disposed between relatively movable proximal and distal portions; and an integrated edge gripper mounted at the distal portion of the robot arm such that the integrated edge gripper is movable with respect to the proximal portion, the integrated edge gripper being adapted to support the substrate and comprising: an orienting assembly for orienting the substrate such that the reference indicium is at a predetermined position in the integrated edge gripper; and a detecting assembly adapted to generate a signal indicative of the presence of the reference indicium at the predetermined position, wherein the substrate is substantially circular in shape and wherein the orienting assembly comprises:
a first set of one or more wheels each adapted to engage the edge of the substrate and each being mounted for rotation about a corresponding wheel axis; a second set of one or more wheels each adapted to engage the edge of the substrate in an engagement position and each being mounted for rotation about a corresponding wheel axis and for movement between the engagement position and a disengagement position; a first mechanical assembly, including a first motor, for rotating at least one wheel of the first set of wheels, wherein said rotation causes rotation of the substantially circular substrate; and a second mechanical assembly for moving the second set of wheels between the engagement and disengagement positions.
4. An alignment device for use with a substantially circular substrate having a reference indicium, the alignment device comprising:
a detecting assembly adapted to generate a signal indicative of the presence of the reference indicium at a predetermined position in the alignment device; and an orienting assembly for orienting the substrate such that the reference indicium is at the predetermined position, the orienting assembly comprising: a first set of one or more wheels each adapted to engage the edge of the substrate and each being mounted for rotation about a corresponding wheel axis; a second set of one or more wheels each adapted to engage the edge of the substrate in an engagement position and each being mounted for rotation about a corresponding wheel axis and for movement between the engagement position and a disengagement position; a first mechanical assembly, including a first motor, for rotating at least one wheel of the first set of wheels, wherein said rotation causes rotation of the substantially circular substrate; and a second mechanical assembly for moving the second set of wheels between the engagement and disengagement positions, wherein the second mechanical assembly includes a set of rods each associated with a wheel of the second set of wheels, each rod having the associated wheel rotatably mounted thereon about said wheel axis and each rod being rotatably mounted about an axis which is transverse to the wheel axis of the associated wheel, wherein rotation of a rod causes movement of an associated wheel between the engagement and disengagement positions. 3. The robot of
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(Not applicable)
1. Field of the Invention
The invention relates to semiconductor processing devices, and more particularly to robots used to transport semiconductor substrates between processing stations and/or storage stations.
2. Description of Related Art
The aforementioned prior art system introduces several additional steps associated with the alignment device 20. For example, the substrate has to first be transported to the alignment device 20 and deposited therein, then after orientation determination and/or adjustment, the substrate has to be retrieved from alignment device 20 and then transported to the destination station. This represents a disruption in the flow path and introduces various steps which increase processing time and potential malfunction.
The invention overcomes deficiencies of the prior art by providing a system in which the substrate transporting robot is itself capable of determining the orientation of the substrate and changing this orientation. Specifically, in accordance with the invention, there is provided a robot for transporting a substrate having a reference indicium which comprises a robot arm on which an integrated edge gripper is mounted. The integrated edge gripper includes an orienting assembly for orienting the substrate such that the reference indicium is at a predetermined position in the integrated edge gripper, and a detecting assembly adapted to generate a signal indicative of the presence of the reference indicium at the predetermined position.
Further in accordance with the invention, an alignment device for use with a substantially circular substrate having a reference indicium is disclosed. The alignment device is provided with a detecting assembly adapted to generate a signal indicative of the presence of the reference indicium at a predetermined position in the alignment device and an orienting assembly for orienting the substrate such that the reference indicium is at the predetermined position. The orienting assembly includes a first set of one or more wheels each adapted to engage the edge of the substrate and each being mounted for rotation about a corresponding wheel axis; a second set of one or more wheels each adapted to engage the edge of the substrate in an engagement position and each being mounted for rotation about a corresponding wheel axis and for movement between the engagement position and a disengagement position; a first mechanical assembly, including a first motor, for rotating at least one wheel of the first set of wheels, wherein said rotation causes rotation of the substantially circular substrate; and a second mechanical assembly for moving the second set of wheels between the engagement and disengagement positions.
Many advantages of the present invention will be apparent to those skilled in the art with a reading of this specification in conjunction with the attached drawings, wherein like reference numerals are applied to like elements and wherein:
An integrated edge gripper 28 is mounted at the distal portion 27 so as to also be relatively movable with respect to the proximal portion 25. Integrated edge gripper 28 may also be mounted for movement relative to distal portion 27, in order to achieve additional degrees of freedom, which may include yaw motion in the direction of double-arrow y. Robot arm 26 operates in conjunction with integrated edge gripper 28 to transport semiconductor substrates (not shown) between the various stations 24 for processing. A processor (not shown) issues command signals to the servo motors associated with the links of robot arm 26 and with integrated edge gripper 28 in order to realize motion trajectories suitable for the transport tasks of robot 21.
FIG. 3 and
As seen from
Wheels 40 are shown in greater detail in
While wheels 40 are preferably freely rotating, at least one of the wheels of the first set--that is, wheels 36 and 38--is a drive wheel which is mechanically linked to a servo motor 41 via a suitable mechanical linkage 43. It is preferred that wheels 36 be configured as the drive wheels. The mechanical linkage can comprise any combination of belts and/or pulleys (not shown), as is known in the art. Motor 41 causes rotation of a wheel 36 (or 38), which in turn rotates the substantially round substrate 34, whose edge is supported in the v-shaped groove of the wheels, in the direction indicated at d. The other wheels, including wheels 40, are idle wheels--that is, they provide no rotation power--and rotate freely in conjunction with the rotation of the substrate 34. The size, number and spacing of wheels 40, which are preferably smaller than wheels 36 and 38, is selected so as not to interfere with rotation of substrate 34. Also, while in the drawing figures the first set of wheels is depicted as containing four wheels, it will appreciated that any number of wheels can be used, depending on the particular design.
As seen in
The above are exemplary modes of carrying out the invention and are not intended to be limiting. It will be apparent to those of ordinary skill in the art that modifications thereto can be made without departure from the spirit and scope of the invention as set forth in the following claims.
Todorov, Alexander, Genov, Mila
Patent | Priority | Assignee | Title |
10204811, | Mar 30 2005 | BROOKS AUTOMATION HOLDING, LLC; Brooks Automation US, LLC | Substrate transport apparatus with active edge gripper |
10615068, | Sep 10 2003 | BROOKS AUTOMATION HOLDING, LLC; Brooks Automation US, LLC | Substrate handling system for aligning and orienting substrates during a transfer operation |
11020852, | Oct 05 2017 | BROOKS AUTOMATION HOLDING, LLC; Brooks Automation US, LLC | Substrate transport apparatus with independent accessory feedthrough |
11508597, | Mar 30 2005 | BROOKS AUTOMATION HOLDING, LLC; Brooks Automation US, LLC | High speed substrate aligner apparatus |
11837485, | Jan 31 2017 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate holding hand and substrate conveying apparatus |
6817640, | Jun 28 2001 | Applied Materials, Inc. | Four-bar linkage wafer clamping mechanism |
6822413, | Mar 20 2002 | TEL FSI, INC | Systems and methods incorporating an end effector with a rotatable and/or pivotable body and/or an optical sensor having a light path that extends along a length of the end effector |
6935830, | Jul 13 2001 | TRU-SI TECHNOLOGIES, INC | Alignment of semiconductor wafers and other articles |
6948898, | Jul 13 2001 | Tru-Si Technologies, Inc. | Alignment of semiconductor wafers and other articles |
6961639, | Jan 29 2002 | Recif, Societe Anonyme | Apparatus and process for identification of characters inscribed on a semiconductor wafer containing an orientation mark |
7052229, | Jul 13 2001 | Tru-Si Technologies Inc. | Alignment of semiconductor wafers and other articles |
7140655, | Sep 04 2001 | MultiMetrixs LLC | Precision soft-touch gripping mechanism for flat objects |
7789614, | Jun 13 2005 | Kabushiki Kaisha Yaskawa Denki | Aligner |
7891936, | Mar 30 2005 | BROOKS AUTOMATION HOLDING, LLC; Brooks Automation US, LLC | High speed substrate aligner apparatus |
8167522, | Mar 30 2005 | BROOKS AUTOMATION HOLDING, LLC; Brooks Automation US, LLC | Substrate transport apparatus with active edge gripper |
8388298, | Jul 31 2006 | Daifuku Co., Ltd. | Apparatus for automatically correcting a positional deviation of a load |
8403619, | Mar 30 2005 | BROOKS AUTOMATION HOLDING, LLC; Brooks Automation US, LLC | High speed substrate aligner apparatus |
8545165, | Mar 30 2005 | BROOKS AUTOMATION HOLDING, LLC; Brooks Automation US, LLC | High speed substrate aligner apparatus |
8628288, | Mar 30 2005 | BROOKS AUTOMATION HOLDING, LLC; Brooks Automation US, LLC | Substrate transport apparatus with active edge gripper |
8801069, | Feb 26 2010 | BROOKS AUTOMATION HOLDING, LLC; Brooks Automation US, LLC | Robot edge contact gripper |
9430849, | Jun 20 2012 | GEVIS SRL | Apparatus and method for performing at least one geometric dimension of an object |
9601362, | Mar 30 2005 | BROOKS AUTOMATION HOLDING, LLC; Brooks Automation US, LLC | High speed substrate aligner apparatus |
Patent | Priority | Assignee | Title |
4685206, | Dec 05 1984 | Nippon Kogaku K. K. | Positioning apparatus for a circular substrate |
4770590, | May 16 1986 | AVIZA TECHNOLOGY, INC | Method and apparatus for transferring wafers between cassettes and a boat |
5102291, | May 21 1987 | ASYST TECHNOLOGIES, INC | Method for transporting silicon wafers |
6012192, | Apr 21 1997 | SCREEN HOLDINGS CO , LTD | Substrate processing apparatus |
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