The present invention is directed to a packaged semiconductor chip that utilizes a multilevel leadframe that positions the lead fingers close to the bond pads while positioning the bus bars on a different level and behind or outboard of the lead finger connections such that it is unnecessary for any wires to cross over the bus bars or the lead fingers. The leadframe may comprise a multi-part frame, or be fabricated from a single sheet of metal.
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1. A semiconductor device assembly, comprising:
a semiconductor die having a plurality of bond pads disposed on an interior portion of an active surface of said semiconductor die; at least one lead finger at least partially disposed in a first plane and having a bond end for electrical connection to at least one of said plurality of bond pads; and at least one bus bar including a pair of distal lead fingers and a transverse bar extending between said distal lead fingers, said transverse bar extending substantially perpendicular to said at least one lead finger, said transverse bar occupying a second plane above said first plane and positioned a distance farther from said plurality of bond pads than said at least one lead finger bond end, and wherein said transverse bar within said second plane is electrically connected to at least one of said plurality of bond pads by at least one discrete conductive element directly extending therebetween.
12. A semiconductor device assembly, comprising:
a semiconductor die having a plurality of bond pads disposed on an interior portion of an active surface of said semiconductor die; a first leadframe comprising at least one lead finger at least partially disposed in a first plane and having a bond end for electrical connection to at least one of said plurality of bond pads; and a second leadframe comprising at least one bus bar including a pair of distal lead fingers and a transverse bar extending between said distal lead fingers, said transverse bar extending substantially perpendicular to said at least one lead finger, said transverse bar occupying a second plane above said first plane and positioned a distance farther from said plurality of bond pads than said at least one lead finger bond end, and wherein said transverse bar is electrically connected to at least one of said plurality of bond pads by at least one discrete conductive element directly extending therebetween.
15. A semiconductor device assembly, comprising:
a semiconductor die having a plurality of bond pads disposed on an interior portion of an active surface of said semiconductor die; at least one lead finger at least partially disposed in a first plane and having a bond end for electrical connection to at least one of said plurality of bond pads; and at least one bus bar including a pair of distal lead fingers and a transverse bar extending between said distal lead fingers, said transverse bar extending substantially perpendicular to said at least one lead finger, said transverse bar occupying a second plane above said first plane and wherein said transverse bar is folded to abut said pair of distal lead fingers to position said transverse bar a distance farther from said plurality of bond pads than said at least one lead finger bond end, and wherein said transverse bar is electrically connected to at least one of said plurality of bond pads by at least one discrete conductive element directly extending therebetween.
9. A semiconductor device assembly, comprising:
a semiconductor die having a plurality of bond pads disposed on an interior portion of an active surface of said semiconductor die; a first leadframe portion comprising at least one lead finger at least partially disposed in a first plane and having a bond end for electrical connection to at least one of said plurality of bond pads, and a pair of distal attachment fingers; and a second leadframe portion comprising at least one bus bar including a pair of distal lead fingers attached to said first leadframe portion pair of distal attachment fingers and a transverse bar extending between said distal lead fingers, said transverse bar extending substantially perpendicular to said at least one lead finger, said transverse bar occupying a second plane above said first plane and positioned a distance farther from said plurality of bond pads than said at least one lead finger bond end, and wherein said transverse bar is electrically connected to at least one of said plurality of bond pads by at least one discrete conductive element directly extending therebetween.
6. A semiconductor device assembly, comprising:
a semiconductor die having a plurality of bond pads disposed on an interior portion of an active surface of said semiconductor die; at least one lead finger at least partially disposed in a first plane and having a bond end for electrical connection to at least one of said plurality of bond pads; and at least one bus bar including a pair of distal lead fingers and a transverse bar extending between said distal lead fingers, said transverse bar extending substantially perpendicular to said at least one lead finger, said transverse bar occupying a second plane above said first plane and positioned a distance farther from said plurality of bond pads than said at least one lead finger bond end wherein position of said transverse bar is effectuated with a plurality of convolutions in said pair of distal lead fingers, and wherein said transverse bar is electrically connected to at least one of said plurality of bond pads by at least one discrete conductive element directly extending therebetween; and wherein said at least one lead finger and said at least one bus bar comprise a single piece of conductive material.
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1. Field of the Invention
The present invention relates to a leadframe structure used for making electrical connections to a semiconductor device. More particularly, the present invention relates to a multilevel leadframe configuration for improving reliability and performance by reducing the number of wires that must extend over or "jump" a bus bar in a lead-over-frame configuration.
2. State of the Art
A typical semiconductor chip is generally constructed from a semiconductor die which is in electrical communication with a component known as a leadframe. The semiconductor die and leadframe are usually sealed in an encapsulant, such as a transfer-molded plastic (filled polymer), wherein portions of the leadframe extend from the encapsulant to ultimately, after fitting and trimming, form electrical communication between the semiconductor die and external circuitry, such as a printed circuit board ("PCB") or the like.
The leadframe is typically formed from a single continuous sheet of metal by a metal stamping or etching operation. As shown in
As shown in
U.S. Pat. No. 4,862,245 issued Aug. 29, 1989 to Pashby et al. ("the Pashby patent") illustrates a so-called "leads over chip" arrangement ("LOC") on the semiconductor die. As shown in
In a conventional configuration (non-LOC), some of the lead fingers carry input or output signals to or from the semiconductor die while others provide a power source or a ground. In an LOC configuration, the lead fingers likewise provide the input or output signals to or from the semiconductor device, but the power source and ground are typically provided by bus bars. The bus bars form an elongated contact in close proximity to the bond pads and typically lie in a perpendicular orientation to the other lead fingers. It is, of course, understood that the bus bars can also carry an input or an output signal which is usually common to more than one bond pad.
A conventional LOC configuration 400, including bus bars, is shown in
U.S. Pat. No. 4,796,078 issued Jan. 3, 1989 to Phelps, Jr. et al. illustrates a multi-layered leadframe assembly. A semiconductor die is bonded to a recess in a first, lower leadframe. Wire bonds extend from lead fingers of the first leadframe terminating short of the sides of the die to peripheral bond pads. A second, upper leadframe of an LOC configuration is secured to the top of the semiconductor die and the first leadframe with an adhesive tape. The lead fingers of the second leadframe extending over the die have selected wire bonds made to central terminals by bondwires. Thus, it appears that LOC technology is integrated with a conventional peripheral-lead attachment. One problem with this type of configuration is that it requires a central die attach pad that was essentially eliminated by use of LOC technology.
U.S. Pat. No. 5,461,255 issued Oct. 24, 1995 to Chan et al. also illustrates a multi-layered leadframe assembly. As shown in
U.S. Pat. No. 5,331,200 issued Jul. 19, 1994 to Teo et al. illustrates a multi-layered leadframe assembly to facilitate direct inner lead bonding for both the power bus and the main leadframe. As shown in
U.S. Pat. No. 5,286,999 issued Feb. 15, 1994 to Chiu illustrates a conventional LOC leadframe with the bus bar folded under the lead fingers. As shown in
U.S. Pat. No. 5,550,401 issued Aug. 27, 1996 to Maeda illustrates a conventional LOC leadframe with the bus bar folded back over the lead finger. As shown in
Thus, it would be advantageous to develop a simple and relatively inexpensive leadframe frame configuration such that the bond pads could be electrically connected to the lead fingers and the bus bars using typical wire bonding techniques without having lead wires cross over or "jump" the bus bars or other lead fingers.
The present invention relates to an easily fabricated leadframe configuration for minimizing the number of bond wires that must cross over a bus bar in an LOC type configuration.
The present invention comprises a multilevel leadframe that positions the lead fingers close to the bond pads while positioning the bus bars on a different level or plane and behind or outboard of the lead finger connections such that it is unnecessary for any bond wires to cross over the bus bars or the lead fingers.
While the specification concludes with claims particularly pointing out and distinctly claiming that which is regarded as the present invention, the advantages of this invention can be more readily ascertained from the following description of the invention when read in conjunction with the accompanying drawings in which:
As illustrated in
Alternately, in an embodiment 140 as shown in
Referring to either
The leadframe 102 may also be formed as a single piece of conductive material, such as a metal sheet, as is typically done in a conventionally-configured leadframe (see
Alternately, as shown in embodiment 160 of
The present invention may also be achieved by combining two leadframes, as shown in
The first leadframe 170 and second leadframe 180 of the stacked leadframe 190 may remain offset from one another after trim and form and encapsulation, in which case spacers 194, as shown in
Having thus described in detail preferred embodiments of the present invention, it is to be understood that the invention defined by the appended claims is not to be limited by particular details set forth in the above description as many apparent variations thereof are possible without departing from the spirit or scope thereof.
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