A socket assembly (1) includes a socket (2) and a vacuum pickup cap (3). The socket includes a base (20), a cover (21) movably assembled upon the base and an actuating rod (22) assembled on both the base and the cover for driving the cover to move in relative to the base. The cover defines a through hole (200) in a center thereof. The vacuum pickup cap includes a flexible bottom plate (31) and a flexible film (32). The flexible bottom plate has a sticky bottom surface (310) adhered to an upper surface of the cover and covering the through hole of the cover. The flexible film has a sticky bottom surface (320) adhered to the flexible bottom plate and a smooth upper surface (321) adapted for being sucked by a vacuum pickup device.
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4. An electrical connector assembly, comprising:
an electrical connector adapted for electrically connecting an electronic device to a printed circuit board, the connector defining a hole therein; and a vacuum pickup cap mounted on the connector adapted for being sucked by a vacuum pickup device, comprising: a bottom plate attached to the connector and covering the hole; and a top film attached to the bottom plate; wherein the bottom plate is made of paper.
11. An electrical connector comprising:
an insulative housing defining a central through hole around a gravity center thereof; first and second stacked flexible layers applied on a top face of the housing; wherein the first layer is thicker/stronger than the second layer, said first layer cover and the second layer are at least partially overlapped with each other above said central hole, and said first layer covers less area of said top face than said second layer, wherein both said first layer and said second layer are equipped with adhesive thereon, respectively.
1. A socket assembly adapted for being sucked by a vacuum pickup device, comprising:
a socket comprising: a base; and a cover being movably assembled upon the base and defining a through hole in a center thereof; and a vacuum pickup cap comprising: a flexible bottom plate having a sticky bottom surface adhered to an upper surface of the cover and covering the through hole of the cover; and a flexible film having a sticky bottom surface adhered to the flexible bottom plate and a smooth upper surface adapted for being sucked by the vacuum pickup device. 8. An electrical connector comprising:
an insulative housing defining therein a central large hole and a plurality of through holes surrounding said central large hole; and first and second stacked flexible layers applied on a top face of the housing; wherein the first layer is thicker/stronger than the second layer, said first layer cover and the second layer are at least partially overlapped with each other, and said first layer covers less area of said top face than said second layer, wherein both said first layer and said second layer have adhesive on bottom faces thereof, respectively.
2. The socket assembly as described in
5. The electrical connector assembly as described in
7. The electrical connector assembly as described in
9. The connector as described in
10. The connector as described in
12. The connector as described in
13. The connector as described in
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This patent application is a Co-pending Application of patent application Ser. No. 10/126,219, entitled "PICK UP DEVICE USED FOR AN ELECTRICAL SOCKET", filed on Apr. 18, 2002, invented by Bono Liao et al.; Ser. No. 10/041,096, entitled "PICK-AND-PLACE DEVICE OF CPU SOCKET", filed on Dec. 28, 2001, invented by Sung-Pei Hou and Ser. No. 10/071/550, entitled "VACUUM PICKUP CAP FOR USE WITH ELECTRICAL CONNECTOR", filed on Feb. 8, 2002, invented by Bob Mchugh et al., all assigned to the same assignee as this patent application.
1. Field of the Invention
The present invention relates to a socket assembly, and particularly to a socket assembly with a vacuum pickup cap.
2. Description of Related Art
As the technology develops, manual assembling is replaced by automatic assembling. In general, during the automation of assembling an electrical connector to a printed circuit board, frequently, a vacuum pickup device is used to pick up the electrical connector from one position to another position. However, referring to U.S. Pat. Nos. 6,290,805, 6,328,574, 5,651,684, 5,819,404 and 6,337,489, when picked up by a vacuum pickup device, the electrical connector has to define a smooth surface for being sucked by the pickup device. An article entitled "MicroPGA packages" which is shown in Page 92 of Electronic Design published on Jan. 7, 2002 discloses a socket for a Central Processor Unit (CPU). The socket defines a rectangular through hole in a center thereof for dissipating beat produced by the CPU; therefore, the socket cannot be directly sucked by a vacuum pickup device. Generally, the socket is provided with a vacuum pickup cap for being sucked by the vacuum pickup device.
Referring to
Hence, an improved vacuum pickup cap is required to overcome the disadvantages of the related vacuum pickup caps.
Accordingly, an object of the present invention is to provide a socket assembly with a vacuum pickup cap which can be automatically assembled to a socket and which can decrease the material cost.
In order to achieve the above object, a socket assembly includes a socket and a vacuum pickup cap. The socket includes a base, a cover movably assembled upon the base and an actuating rod assembled on the base and the cover for driving the cover to move relative to the base. The cover defines a through hole in a center thereof. The vacuum pickup cap includes a flexible bottom plate and a flexible film. The flexible bottom plate has a sticky bottom surface adhered to an upper surface of the cover and covering the through hole of the cover. The flexible film has a sticky bottom surface adhered to the flexible bottom plate, and a smooth upper surface adapted for being sucked by a vacuum pickup device.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
Reference will now be made to the drawing figures to describe the present invention in detail.
Referring to
The socket 2 is used for electrically connecting an integrated circuit (IC) package (not shown) with a printed circuit board (not shown). The socket 2 comprises a base 20, a cover 21 movably assembled upon the base 20 with through holes 211 therein, and an actuating rod 22. The actuating rod 22 is assembled on both the base 20 and the cover 21 for driving the cover 21 to move relative to the base 20. The base 20 and the cover 21 each define a rectangular through hole 200 in a center thereof for well dissipating heat produced by the IC package. In addition, the cover 21 comprises an upper surface 210.
Referring to
The bottom plate 31, which covers the hole 200 is made of paper which is cheaper than the transparent film 32. The bottom plate 31 is given a sufficient thickness so it is strong enough to withstand the vacuum force of the pickup device acting on the pickup cap 3 on a region of the hole 200.
It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Lin, Nick, Liao, Fang-Jwu, Chen, Hsiang-Ping, Liu, Chi-Hung
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 26 2002 | LIN, NICK | HON HAI PRECISION INC CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013470 | /0345 | |
Jul 26 2002 | LIAO, FANG-JWU | HON HAI PRECISION INC CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013470 | /0345 | |
Jul 26 2002 | CHEN, HSIANG-PING | HON HAI PRECISION INC CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013470 | /0345 | |
Jul 26 2002 | LIU, CHI-HUNG | HON HAI PRECISION INC CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013470 | /0345 | |
Nov 04 2002 | Hon Hai Precision Ind. Co., LTD | (assignment on the face of the patent) | / |
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