A method of manufacturing a high temperature superconductor is disclosed. The method includes depositing, by pulsed laser deposition, alternating layers of yba2Cu3O7-x (Y123) and Y2BaCuO5-y (Y211). The Y211 layers are characterized by a multiplicity of nanosized globular inclusions, effectively enhancing flux pinning and thus increasing current transport.
|
1. A pulsed laser deposition method of manufacturing a high temperature superconductor while concurrently implanting a flux-pinning mechanism therein, comprising the steps of:
providing a pulsed laser deposition chamber including a pulsed laser; placing yba2Cu3O7-x and Y2BaCuO5-y targets within said chamber; placing a substrate within said chamber; forming, by pulsed laser deposition, a superconducting layer of yba2Cu3O7-x uniformly upon said substrate by irradiating said yba2Cu3O7-x target with the emission of said pulsed laser; depositing, by pulsed laser deposition, a non-superconducting layer of Y2BaCuO5-y by irradiating said Y2BaCuO5-y target with the emission of said pulsed laser, said non-superconducting layer of Y2BaCuO5-y being characterized by a multiplicity of nanosized globular inclusions; covering said layer of Y2BaCuO5-y with another layer of superconducting yba2Cu3O7-x by irradiating said yba2Cu3O7-x target with the emission of said pulsed laser; and, repeating said depositing and said covering steps to fabricate a multilayered superconductor.
5. A pulsed laser deposition method of manufacturing a high temperature superconductor while concurrently implanting a flux-pinning mechanism therein, comprising the steps of:
providing a pulsed laser deposition chamber including a pulsed laser; placing a yba2Cu3O7-x target within said chamber; placing a non-superconducting material target within said chamber; placing a substrate within said chamber; forming, by pulsed laser deposition, a superconducting layer of yba2Cu3O7-x uniformly upon said substrate by irradiating said yba2Cu3O7-x target with the emission of said pulsed laser; depositing, by pulsed laser deposition, a layer of non-superconducting material upon said substrate by irradiating said non-superconducting material target with the emission of said pulsed laser, said layer of non-superconducting material being characterized by a multiplicity of nanosized globular inclusions; covering said layer of non-superconducting material with another layer of superconducting yba2Cu3O7-x by irradiating said yba2Cu3O7-x target with the emission of said pulsed laser; and, repeating said depositing and said covering steps to fabricate a multilayered superconductor.
8. A pulsed laser deposition method of manufacturing a high temperature superconductor while concurrently implanting a flux-pinning mechanism therein, comprising the steps of:
providing a pulsed laser deposition chamber including a pulsed laser; placing yba2Cu3O7-x and Y2BaCuO5-y targets within said chamber; placing a substrate within said chamber; forming, by pulsed laser deposition, a non-superconducting layer of Y2BaCuO5-y upon said substrate by irradiating said Y2BaCuO5-y target with the emission of said pulsed laser, said non-superconducting layer of Y2BaCuO5-y being characterized by a multiplicity of nanosized globular inclusions; depositing, by pulsed laser deposition, a superconducting layer of yba2Cu3O7-x uniformly upon said layer of Y2BaCuO5-y by irradiating said yba2Cu3O7-x target with the emission of said pulsed laser; covering said layer of yba2Cu3O7-x with another layer of non-superconducting Y2BaCuO5-y by pulsed laser deposition by irradiating said Y2BaCuO5-y target with the emission of said pulsed laser, said another layer of non-superconducting Y2BaCuO5-y being characterized by a multiplicity of nanosized globular inclusions; and, repeating said depositing and said covering steps to fabricate a multilayered superconductor.
12. A pulsed laser deposition method of manufacturing a high temperature superconductor while concurrently implanting a flux-pinning mechanism therein, comprising the steps of:
providing a pulsed laser deposition chamber including a pulsed laser; placing a yba2Cu3O7-x target within said chamber; placing a non-superconducting material target within said chamber; placing a substrate within said chamber; forming, by pulsed laser deposition, a layer of non-superconducting material upon said substrate by irradiating said non-superconducting material target with the emission of said pulsed laser, said layer of non-superconducting material being, characterized by a multiplicity of nanosized globular inclusions; depositing, by pulsed laser deposition, a superconducting layer of yba2Cu3O7-x uniformly upon said layer of non-superconducting material by irradiating said yba2Cu3O7-x target with the emission of said pulsed laser; covering said layer of yba2Cu3O7-x with another layer of non-superconducting material by pulsed laser deposition by irradiating said non-superconducting material target with the emission of said pulsed laser, said another layer of non-superconducting material being characterized by a multiplicity of nanosized globular inclusions; and, repeating said depositing and said covering steps to fabricate a multilayered superconductor.
2. The method of
3. The method of
4. The method of
6. The method of
7. The method of
9. The method of
10. The method of
11. The method of
13. The method of
14. The method of
|
The present application is related to and claims priority on prior copending provisional Application No. 60/355,994, filed Feb. 8, 2002, entitled "Flux Pinning of High Temperature Superconductors by Multi-Layered Deposition".
The invention described herein may be manufactured and used by or for the Government of the United States for all governmental purposes without the payment of any royalty.
The present invention relates generally to a method of manufacturing a high temperature superconductor and more specifically to a pulsed laser deposition method of applying a plurality of alternating thin layers of non-superconducting material and superconducting material in high temperature superconductors.
The desirability of providing efficient high temperature superconductors for operation at 20°C K and higher is well known. Indeed, there has been an enormous amount of experimental activity in these so called high temperature superconductors since research in the mid 1980s first demonstrated dramatic gains in raising the maximum critical transition temperatures from the 20°C K range to the 90°C K range.
In general, superconductors and superconducting material exhibit zero resistance when operating at temperatures below their maximum critical transition temperature. This quality of operating at zero resistance facilitates the construction and operation of highly efficient devices such as superconducting magnets, magnetic levitators, propulsion motors and magnetohydronamics, power generators, particle accelerators, microwave and infrared detectors, etc.
In addition to the quality of operating at zero resistance, superconductors display other, unusual characteristics. For example, a surprising effect of superconductivity is that magnetic flux is expelled from superconductors. This is commonly known as the Meissner or Meissner-Ochsenfeld effect. Other unexpected phenomena include current flow via electron pairs rather than individual electrons and large scale quantum behaviors such as flux quantization and flux tubes.
According to current accepted nomenclature, superconducting materials fall within two broad categories, Type I and Type II. The Type I materials are pure metallic elements. Type II materials are alloys or compounds and are characterized by their ability to retain superconductive attributes in the presence of applied magnetic fields. Unlike Type I materials, Type II materials tolerate some degree of applied magnetic flux intrusion into their interiors without destroying the superconducting state. More specifically, as applied flux and/or temperature increase, microscopic flux tubes or fluxons begin to develop within the material. In this mixed state of superconductivity, the material within the flux tubes is in a normal state of resistivity. The material surrounding the flux tubes remains in a state of superconductivity. Since the Type II materials will support mixed superconductivity at elevated temperatures and applied magnetic field intensities, the Type II materials seem to be the best candidates for, commercial application and further development.
More specifically, under equilibrium conditions, magnetic flux penetrates the; bulk of a type II superconductor above the lower critical field. Over most of the available magnetic field-temperature (H-T) space, H>Hc1, this magnetic flux exists as a lattice of quantized line vortices or fluxons. Each fluxon is a tube in which superconducting screening currents circulate around a small non-superconducting core. Bulk superconductivity is destroyed when the normal cores overlap at the upper critical field. In isotropic materials such as Nb--Ti and Nb3Sn, vortex lines are continuous, but the weak superconductivity of the blocking layers of High Temperature Superconducting (HTS) compounds produces a stack of weakly coupled `pancake` vortices whose circulating screening currents are mostly confined within the superconducting CuO2 planes. Superconductors can carry bulk current density only if there is a macroscopic fluxon density gradient. This gradient can be sustained only by pinning the vortices (flux pinning) at microstructural defects. Increasing T and H weaken the potential wells at which vortices are pinned. Flux pinning is determined by spatial perturbations of the free energy of the vortex lines due to local interactions of their normal cores and screening currents with these microstructural imperfections. The critical current density Jc (T, H) is then defined by the balance of the pinning and Lorentz forces. Ideally, a type II superconductor can carry any non-dissipative current density J smaller than Jc. When J exceeds Jc, a superconductor switches into a dissipative, vortex-flow state, driven by the Lorentz force.
High temperature superconducting generators and magnets are significantly lighter and more compact than their conventional counterparts. The development of these devices is of great importance especially in applications requiring compact lightweight, high power sources or compact high field magnets. HTS coated conductor can be used to make the coil windings in HTS generators as well as HTS magnet windings and thus long lengths of coated conductor with high current transport and lower ac losses are desirable.
Various attempts have been made to stabilize or pin the flux vortices within HTS conductors. Introducing impurities or defects into the superconducting material is a known way to provide flux pinning. Such flux pins can be holes, nanotubes, particles, grain boundaries or other defects intentionally introduced into the superconducting material.
Another, recent technique under investigation for introducing flux pinning mechanisms into superconducting materials is to create a coated HTS conductor including a series of layers that alternate between superconducting and non-superconducting materials. See, for example, U.S. Pat. No. 6,191,073 to Hojczyk et al. and U.S. Pat. No. 6,383,989 to Jia et al. (U.S. Patent Application Publication, US 2001/0056041)
While the known methods of improving current carrying capacity within highs temperature superconductors by introducing flux-pinning defects into the superconducting material have achieved some degree of success, they are not without the need for improvement. A need exists for an improved method of manufacturing a high temperature superconductor while concurrently implanting a flux-pinning mechanism therein. Such a method would be relatively simple and inexpensive to implement while providing improved current carrying capability at high temperatures and applied magnetic fields.
Accordingly, it is a primary object of the present invention to provide a method of manufacturing a high temperature superconductor overcoming the limitations and disadvantages of the prior art.
Another object of the present invention is to provide a method of manufacturing a high temperature superconductor providing a multilayered coated conductor having an effective flux pinning mechanism implanted therein.
Yet another object of the present invention is to provide a method of manufacturing a high temperature superconductor that can be readily implemented using known pulsed laser deposition equipment.
Still another object of the present invention is to provide a method of manufacturing a high temperature superconductor that alternately combines a layer of superconducting material with a layer of non-superconducting material, wherein the layer of non-superconducting material is a multiplicity of nanosized globular inclusions of material rather than a uniform layer.
It is still another object of the present invention to provide a method of manufacturing a high temperature superconductor that incorporates alternating layers of superconducting material interspersed with layers of non-superconducting material characterized by a multiplicity of nanosized globular inclusions wherein the material comprising the non-superconducting layer is not chemically reactive with the superconducting material.
It is yet another object of the present invention to provide a method of manufacturing a high temperature superconductor utilizing superconducting YBa2Cu3O7-x (Y123) and non-superconducting Y2BaCuO5-y (Y211).
These and other objects of the invention will become apparent as the description of the representative embodiments proceeds.
In accordance with the foregoing principles and objects of the invention, a method of manufacturing a high temperature superconductor utilizing pulsed laser deposition is described. The method of the present invention can be used to fabricate high temperature superconductors using known pulsed laser deposition equipment and techniques.
As can be seen, it is desirable to pin magnetic flux within high temperature superconductors to improve current transport at higher fields. One technique is to add a high density (number) of non-superconducting defects into the superconducting material, for example, ∼0.5×1011 M cm-2 or ∼5 per 100 nm in a linear direction to pin a 5 T field (M being the magnetic field strength in Tesla). This pinning defect should be greater than or equal to the coherence length of the HTS material which, in the case of YBa2Cu3O7-x is in the range of about 1-2 nm. This can become problematic, however, in that many compounds diffuse and react with the HTS material during high temperature processing when the layer thickness is ∼1 nm. This leads to degradation of performance and efficiency of the completed HTS conductor.
Advantageously, the method of manufacturing a high temperature superconductor of the present invention utilizes a non-superconducting layer material that is not chemically reactive with the HTS material. This avoids the degradation of performance noted above.
According to the method of the present invention, YBa2Cu3O7-x and Y2BaCuO5-y targets are placed within a pulsed laser deposition chamber. A substrate upon which the superconductor will be grown is also placed within the deposition chamber. The pulsed laser deposition system is placed into operation and a first layer of Y123 is grown upon the substrate by irradiating the YBa2Cu3O7-x target with the emission from the pulsed laser. The process is allowed to continue until a layer of superconducting Y123 is deposited to a thickness of about 7-10 nm. Next, a layer of Y211 is grown upon the layer of Y123 by irradiating the Y2BaCuO5-y target with the emission from the pulsed laser. The process is allowed to continue until a layer of non-superconducting Y211 is deposited to a thickness equal to or exceeding the coherence length of the material, here ∼1-2 nm. The layer of Y211 is characterized by a multiplicity of; nanosized globular inclusions, effectively enhancing the flux pinning nature of the Y211 layer. The process is then repeated until a multilayered superconductor is fabricated.
The accompanying drawing incorporated in and forming a part of the specification, illustrates several aspects of the present invention and together with the description serves to explain the principles of the invention. In the drawing:
Reference is made to the drawing figures showing the high temperature superconductor 10 fabricated according to the method of the present invention. The method of the present invention can be used to fabricate high temperature superconductors using known pulsed laser deposition equipment and techniques and the superconductors thus made exhibit dramatically increased current transport.
Advantageously, the method of the present invention is used to fabricate High Temperature Superconducting (HTS) coated conductors while concurrently implanting a flux-pinning mechanism implanted therein. The desirability of providing flux-pinning centers within high temperature superconductors to improve current transport at higher fields is known. Introducing impurities or defects into the superconducting material, is a known way to provide flux pinning. Such flux pins can be holes, nanotubes, particles grain boundaries or other defects intentionally introduced into the superconducting material. One technique of implanting flux-pinning mechanisms is to add a high density (number) of non-superconducting defects into the superconducting material, for example, ∼0.5×1011 M cm-2 or ∼5 per 100 nm in a linear direction to pin a 5 T field, where M is the magnetic field strength in Tesla. This pinning defect must be greater than or equal to the coherence length of the HTS material which, in the case of YBa2Cu3O7-x (Y123) is in the range of about 1-2 nm. This approach is problematic because many compounds diffuse and react with the HTS material during high temperature processing when the layer thickness is ∼1 nm, leading to degradation of performance and efficiency of the completed HTS conductor.
Advantageously, the method of manufacturing a high temperature superconductor of the present invention incorporates the use of a non-superconducting material that is not chemically reactive with the HTS material. The avoidance of compound reactions provides for the implantation of an effective flux-pinning mechanism by assuring that the non-superconducting layer of material is uniform.
According to the method of the present invention, YBa2Cu3O7-x (Y123) and Y2BaCuO5-y (Y211) targets are placed within a pulsed laser deposition chamber. Pulsed laser deposition systems are commercially available or they can be made in-house. One commercial supplier of pulsed laser deposition systems suitable for v performing the steps of the present invention is Neocera, Inc., Beltsville, Md. A substrate upon which the superconductor will be grown is also placed within the deposition chamber. The substrate can be chosen from a variety of materials such as a single crystal, buffered metallic or non-metallic textured substrate such that allow epitaxial growth of YBa2Cu3O7-x.
In general, pulsed laser deposition systems include a deposition chamber wherein the pulsed laser deposition process is performed. A vacuum pump is provided to evacuate the deposition chamber to various levels to accommodate the deposition process. As will be described in more detail below, a pulsed laser is used to irradiate a target within the deposition chamber in order to deposit the material on the substrate. The laser is typically pulsed at nanosecond rates. The interaction of the nanosecond laser radiation with condensed matter results primarily in the ejection of atomic species from the solid target. If this is done in a good vacuum, the ejected atoms leave the target with hyperthermal energies and continue their rectilinear trajectories until they strike an appropriate substrate.
According to the method of the present invention, the pulsed laser deposition system is placed into operation by establishing an appropriate vacuum within the deposition chamber. A first layer 12 of Y123 is grown upon the substrate 11 by irradiatiating the Y123 target with the emission from the pulsed laser. The process is allowed to continue until the layer 12 of superconducting Y123 is deposited to a thickness of about 7-10 nm.
Next, a layer 14 of non-superconducting Y211 is grown upon the layer of, Y123. Advantageously, the layers 14 of Y211 are characterized by a multiplicity of nanosized, globular inclusions of Y211 rather than a uniform layer. This has been demonstrated experimentally to provide a large improvement of JC(H) by flux pinning, see FIG. 2. Moreover, the Y211 inclusions may exhibit preferred orientation regardless of Y123 thickness. Other choices of non-superconducting material in lieu of Y211 include, but are not considered limited to, silver, gold, platinum, CeO2, GdO2, Y2O3 and MgO.
The deposition process is allowed to continue until the layer 14 of non-superconducting Y211 characterized by a multiplicity of globular inclusions is deposited to a thickness equal to or exceeding the coherence length of the material, here ∼1-2 nm. The Y211 phase is chemically stable with the Y123 phase, assuring a uniform implantation of the flux pinning mechanism. The process described above is then repeated until a multilayered superconductor is fabricated. The number of layers is believed to be in the range of about 10 up to several hundred for providing an effective HTS coated conductor.
The advantages of utilizing the method of the present invention have been borne out by experimentation. Reference is made to
In summary, numerous benefits have been described from utilizing the principles of the present invention. A method of manufacturing a high temperature superconductor is disclosed for providing a multilayer superconductor having alternating layers of non-superconducting Y211 and superconducting Y123. The layers 14 of Y211 are characterized by a multiplicity of nanosized globular inclusions, which advantageously provide effective flux pinning and dramatically enhanced current transport.
The foregoing description of the preferred embodiment has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed. Obvious modifications or variations are possible in light of the above teachings. For example, the method of the present invention could be utilized with other materials besides YBCO. And, the layers could be grown in reverse order wherein the Y211 layer is first deposited upon the substrate and the Y123 layer is next applied thereon. The embodiment was chosen and described to provide the best illustration of the principles of the invention and its practical application to thereby enable one of ordinary skill in the art to utilize the inventions in various embodiments and with various modifications as are suited to the particular scope of the invention as determined by the appended claims when interpreted in accordance with the breadth to which they are fairly, legally and equitably entitled.
Barnes, Paul N., Haugan, Timothy J.
Patent | Priority | Assignee | Title |
7687436, | Dec 02 2005 | University of Dayton | Flux pinning enhancements in superconductive REBa2CU3O7-x (REBCO) films and method of forming thereof |
7871663, | Oct 03 2005 | AIR FORCE, UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE, THE | Minute doping for YBCO flux pinning |
7902119, | Jul 22 2005 | Porous ceramic high temperature superconductors and method of making same | |
8383552, | Oct 03 2006 | AIR FORCE, THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE | Flux pinning of cuprate superconductors with nanoparticles |
8629087, | Jul 19 2010 | Bruker HTS GmbH | HTS coated conductor with particle inclusions, and method of production of an HTS coated conductor |
9029296, | Feb 02 2012 | Polyvalor, Limited Partnership | Increased normal zone propagation velocity in superconducting segments |
Patent | Priority | Assignee | Title |
5231076, | Dec 15 1990 | Korea Standards Research Institute | Process for manufacturing a YBa2 Cu3 Ox superconductor using infiltration-reaction technique |
5244868, | Nov 28 1989 | AT&T Bell Laboratories | Method of making high Tc superconductor material, and article produced by the method |
5248660, | Aug 31 1991 | Samsung Electro-Mechanics Co., Ltd. | Process of preparing yttrium based superconductors |
5284822, | May 08 1990 | INTERNATIONAL SUPERCONDUCTIVITY TECNOLOGY CENTER; Toyota Jidosha Kabushiki Kaisha; Kawasaki Jukogyo Kabushiki Kaisha; NGK Insulators, Ltd | Oxide superconductor and process for producing the same |
5306700, | Sep 01 1992 | Catholic University of America, The | Dense melt-based ceramic superconductors |
5430014, | Nov 02 1991 | Forschungszentrum Julich GmbH | Method of producing an SrTiO3 /YBa2 Cu3 O7 layer system and a layer system as thus produced as a high-temperature superconductor |
5525584, | Dec 27 1993 | International Superconductivity Technology Center; Railway Technical Research Institute; Shikoku Denryoku Kabushikigaisha; Tosoh Corporation | Superconductor and method of producing same |
5696392, | Sep 14 1992 | Silicon Valley Bank | Barrier layers for oxide superconductor devices and circuits |
5998050, | Jul 27 1992 | New Energy and Industrial Technology Development Organization; International Superconductivity Technology Center; Hitachi Cable, LTD; KYUSHU ELECTRIC POWER CO , INC ; KANSAI ELECTRIC POWER CO , INC , THE; Fujikura Ltd | Composite metal oxide material |
6136756, | Nov 30 1993 | Adelwitz Technologiezentrum GmbH | Method for manufacturing of high temperature superconductor material |
6191073, | Aug 27 1996 | Forschungszentrum Julich GmbH | Series of layers and component containing such |
6221812, | Jul 20 1998 | Board of Regents, The University of Texas System | Jc in high magnetic field of bi-layer and multi-layer structures for high temperature superconductive materials |
6256521, | Sep 16 1997 | UT-Battelle, LLC | Preferentially oriented, High temperature superconductors by seeding and a method for their preparation |
6383989, | Jun 21 2000 | Triad National Security, LLC | Architecture for high critical current superconducting tapes |
20010056041, | |||
H1399, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 29 2003 | BARNES, PAUL N | AIR FORCE, THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014021 | /0435 | |
Jan 31 2003 | The United States of America as represented by the Secretary of the Air Force | (assignment on the face of the patent) | / | |||
Apr 17 2003 | HAUGAN, TIMOTHY J | AIR FORCE, THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014021 | /0435 |
Date | Maintenance Fee Events |
Jan 08 2008 | M1551: Payment of Maintenance Fee, 4th Year, Large Entity. |
Jul 30 2012 | REM: Maintenance Fee Reminder Mailed. |
Dec 14 2012 | EXP: Patent Expired for Failure to Pay Maintenance Fees. |
Date | Maintenance Schedule |
Dec 14 2007 | 4 years fee payment window open |
Jun 14 2008 | 6 months grace period start (w surcharge) |
Dec 14 2008 | patent expiry (for year 4) |
Dec 14 2010 | 2 years to revive unintentionally abandoned end. (for year 4) |
Dec 14 2011 | 8 years fee payment window open |
Jun 14 2012 | 6 months grace period start (w surcharge) |
Dec 14 2012 | patent expiry (for year 8) |
Dec 14 2014 | 2 years to revive unintentionally abandoned end. (for year 8) |
Dec 14 2015 | 12 years fee payment window open |
Jun 14 2016 | 6 months grace period start (w surcharge) |
Dec 14 2016 | patent expiry (for year 12) |
Dec 14 2018 | 2 years to revive unintentionally abandoned end. (for year 12) |