A method for forming a semiconductor device (10) includes forming an organic anti-reflective coating (OARC) layer (18) over the semiconductor device (10). A tetra-ethyl-ortho-silicate (teos) layer (20) is formed over the OARC layer (18). The teos layer (20) is exposed to oxygen-based plasma at a temperature of at most about 300 degrees Celsius. In an alternative embodiment, the teos layer (20) is first exposed to a nitrogen-based plasma before being exposed to the oxygen-based plasma. A photoresist layer (22) is formed over the teos layer (20) and patterned. By applying oxygen based plasma and nitrogen based plasma to the teos layer (20) before applying photoresist, pattern defects are reduced.
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1. A method for forming a semiconductor device, comprising:
providing a semiconductor substrate;
forming a first layer over the semiconductor substrate;
forming an anti-reflective coating (ARC) layer over the first layer;
forming a tetra-ethyl-ortho-silicate (teos) layer over the ARC layer;
after forming the teos layer, applying a nitrogen-based plasma to the teos layer;
after applying the nitrogen-based plasma, applying an oxygen-based plasma to the teos layer at a temperature of at most about 300 degrees Celsius;
forming a photoresist layer over the teos layer;
patterning the photoresist layer to form a patterned photoresist layer; and
using the patterned photoresist layer to pattern the first layer.
12. A method for forming a semiconductor device, comprising:
providing a semiconductor substrate;
forming a first layer over the semiconductor substrate;
forming an anti-reflective coating (ARC) layer over the first layer;
forming a tetra-ethyl-ortho-silicate (teos) layer over the ARC layer;
after forming the teos layer, applying a nitrogen-based plasma to the teos layer at a temperature of at most about 300 degrees Celsius;
after forming the teos layer, applying an oxygen-based plasma to the teos layer at a temperature of at most about 300 degrees Celsius;
forming a photoresist layer over the teos layer;
patterning the photoresist layer to form a patterned photoresist layer; and
using the patterned photoresist layer to pattern the first layer.
19. A method for forming a semiconductor device, comprising:
providing a semiconductor substrate;
forming a first layer over the semiconductor substrate;
forming an anti-reflective coating (ARC) layer over the first layer;
forming a tetra-ethyl-ortho-silicate (teos) layer over the ARC layer, wherein the teos layer is formed at a temperature of at most about 250 degrees Celsius;
after forming the teos layer, applying a nitrogen-based plasma to the teos layer;
after applying the nitrogen-based plasma, applying an oxygen-based plasma to the teos layer at a temperature of at most about 300 degrees Celsius;
forming a photoresist layer over the teos layer;
patterning the photoresist layer to form a patterned photoresist layer; and
using the patterned photoresist layer to pattern the first layer.
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forming sidewall spacers on the gate electrode; and
diffusing source/drain regions into the substrate.
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16. The method of
forming sidewall spacers on the gate electrode; and
diffusing source/drain regions into the substrate.
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22. The method of
forming sidewall spacers on the gate electrode; and
diffusing source/drain regions into the substrate.
23. The method of
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This is related to U.S. patent application Ser. No. 10/628,668, filed Jul. 28, 2003 and entitled “A Semiconductor Device Having An Organic Anti-Reflective Coating (ARC) and Method Therefor” and assigned to the current assignee hereof.
This invention relates generally to semiconductor manufacture, and more particularly to a plasma treatment for the surface of a semiconductor device.
In the manufacture of semiconductor devices, features are lithographically defined, in part, by exposing patterned photoresist to light at a certain wavelength and etched. Two known techniques used in a patterned etch are inorganic anti-reflective coating (ARC) hard masking and spin-on organic bottom anti-reflective coating (BARC). Inorganic ARC hard masking patterning schemes pose difficulties for some application because the amount of photoresist required to protect the hard mask during the hard mask etch place a lower limit on photoresist thickness. This limit can prevent the use of the thinner photoresist films that give better resolution. Although the spin-on BARC is relatively easier to apply, it is typically so similar to photoresist in its chemical composition and thus etch properties that it also requires a thick photoresist. To circumvent these issues, the use of amorphous carbon thin films underlying a tetra-ethyl-ortho-silicate (TEOS) layer is proposed.
Also, as the technology becomes more advanced, the feature size is reduced to allow more devices to be placed on an integrated circuit (IC) die. However, reducing the feature size in, for example, a gate layer mask, will cause defects in the photoresist and underlying layers to cause pattern defects in the surface of the integrated circuit that render the integrated circuit non-functional.
Therefore, what is needed is a method for reducing pattern defects in the manufacture of advanced semiconductor devices.
The present invention is illustrated by way of example and not limited by the accompanying figures, in which like references indicate similar elements, and in which:
Skilled artisans appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help improve the understanding of the embodiments of the present invention.
Generally, the present invention provides a method for forming a semiconductor device. An organic anti-reflective coating (OARC) layer is formed over the semiconductor device and a tetra-ethyl-ortho-silicate (TEOS) layer is formed over the OARC layer. The TEOS layer is exposed to an oxygen-based plasma at a temperature of at most about 400 degrees Celsius. In an alternative embodiment, the TEOS layer is first exposed to a nitrogen based plasma before being exposed to the oxygen-based plasma. A photoresist layer is formed over the TEOS layer and patterned. By applying oxygen based plasma and nitrogen based plasma to the TEOS layer before applying the photoresist, pattern defects are reduced.
In one aspect, a patterning stack above a conductive material that is to be etched has a patterned photoresist layer that is used to pattern an underlying tetra-ethyl-ortho-silicate (TEOS) layer. The TEOS layer is deposited at a relatively low temperature. The low temperature TEOS layer is over an organic anti-reflective coating (ARC). Before photoresist is formed on the TEOS layer, the TEOS layer is treated with an N2 plasma followed by treatment with an O2 plasma. In another embodiment, the N2 plasma treatment is optional. The treated TEOS layer provides improved adhesion to both the organic ARC and the photoresist, has low defectivity, operates as a hard mask, and serves as a phase shift layer that helps, in combination with the organic ARC, to reduce undesired reflection. The issue with adhesion has become more difficult with the introduction of photoresists designed for 193 nanometer lithography. The following description provides a more complete explanation of the preferred embodiment of the invention as well as other alternative solutions.
The flow rates are 840 milligrams per minute (mgm) for TEOS, 840 sccm for the oxygen, and 560 sccm for the helium. The power is set at 510 watts for the high frequency and 110 watts for the low frequency. This equipment and these settings are exemplary and could be different. The temperature is intentionally less than the typical deposition temperature of 400 degrees Celsius for TEOS. The temperature is preferably lower than about 350 degrees Celsius. The temperature should also be greater than about 175 degrees Celsius. Preferably, the TEOS layer is formed at a temperature in a range of about 175 to 400 degrees Celsius. In other embodiments, the TEOS layer is formed at a temperature in a range of about 175 to 250 degrees Celsius. Other equipment would almost certainly run at somewhat different conditions and such settings would be determined by experimentation. In this example, substrate 12 is silicon and insulating layer 14 is silicon oxide of about 15 Angstroms. In the illustrated embodiment, the conductive material 16 is polysilicon of about 1000 Angstroms. In other embodiments, the conductive material 16 may be formed from another material, such as an insulating material, a semiconductive material or a conductive material. The organic ARC 18 is an hydrogenated amorphous carbon film deposited by plasma enhanced chemical vapor deposition (PECVD) as is known to one of ordinary skill in the art and is 500 Angstroms thick. Alternatively, a spin-on BARC layer may be used.
Photoresist adheres well to the plasma treated low temperature TEOS as contrasted with conventional 400 degree TEOS from which the photoresist tends to delaminate, especially for photoresists that are designed for 193 nanometer lithography. Also the plasma treated low temperature TEOS adheres well to the underlying organic ARC layer.
An alternative to the above described TEOS solution is to use a organosilane plus an oxidizer to form the layer between ARC 18 and photoresist 22 in the place of TEOS layer 20. The organosilane and oxidizer should be nitrogen-free. TEOS is preferable at least because the chemicals for it are less expensive and tool availability is better. TEOS is also a very stable film. This stability may be difficult to match. A typical organosilane for this purpose is trimethlysilane. A typical oxidizer would be either pure oxygen or carbon dioxide.
Another alternative to the TEOS solution is to use silicon nitride in combination with one of silicon-rich oxynitride (SRON) and silicon-rich oxide (SRO). In one case the combination would be a composite layer that would replace TEOS layer 20. The silicon nitride layer would be on the organic ARC 16 and the SRON or SRO layer would be between the photoresist and the silicon nitride layer. This is effective in providing both the necessary adhesion and the low defectivity. In another case the combination would be separated by the organic ARC. The silicon nitride layer would be between the conductive layer 16 and the ARC layer 18. The SRON or SRO layer would be between the ARC layer 18 and the photoresist. This is also effective in providing adequate adhesion and defectivity. These two alternatives using SRO or SRON in combination with silicon nitride are both more complicated than the TEOS solution and provide a more difficult integration with preferred processes.
In the foregoing specification, the invention has been described with reference to specific embodiments. However, one of ordinary skill in the art appreciates that various modifications and changes can be made without departing from the scope of the present invention as set forth in the claims below. For example, the organic ARC may not have to be amorphous. Accordingly, the specification and figures are to be regarded in an illustrative rather than a restrictive sense, and all such modifications are intended to be included within the scope of present invention.
Benefits, other advantages, and solutions to problems have been described above with regard to specific embodiments. However, the benefits, advantages, solutions to problems, and any element(s) that may cause any benefit, advantage, or solution to occur or become more pronounced are not to be construed as a critical, required, or essential feature or element of any or all the claims. As used herein, the terms “comprises,” “comprising,” or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Shroff, Mehul D., Junker, Kurt H., Hall, Mark D., Shen, Jin Miao, Fisher, Brian J., Sheth, Vikas R.
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