An electronic component includes a wiring board having a wiring pattern, a surface mount device mounted on an upper surface of the wiring board, and a cap arranged to cover the wiring board. The cap includes a top portion made of a flat ceramic member, and a leg portion made of a columnar member having a height similar to a height of the surface mount devices.
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1. An electronic component comprising:
a wiring board having a wiring pattern;
surface mount devices mounted on a main surface of the wiring board; and
a cover member arranged to cover the surface mount devices; wherein
the cover member includes a top portion made of a flat ceramic member, and a leg portion made of a metal columnar member having a height that is substantially equal to heights of the surface mount devices;
the top portion has a multilayered structure in which a plurality of ceramic layers are laminated;
a shield electrode layer is disposed at at least one of an interlayer and an outer surface of the multilayered structure; and
a via conductor is arranged to extend between and to electrically connect the metal columnar member and the shield electrode layer.
2. The electronic component according to
3. The electronic component according to
4. The electronic component according to
5. The electronic component according to
6. The electronic component according to
7. The electronic component according to
8. The electronic component according to
9. The electronic component according to
10. The electronic component according to
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1. Field of the Invention
The present invention relates to an electronic component in which surface mount devices mounted on a wiring board are covered with a cover member, and a manufacturing method of the electronic component. More particularly, the present invention relates to an electronic component which can be miniaturized and which can have a reduced height due to the improved structure of a cover member, and a manufacturing method of the electronic component.
2. Description of the Related Art
Known technologies are disclosed in Japanese Unexamined Patent Application Publication No. 6-350280 (Patent Document 1), Japanese Unexamined Patent Application Publication No. 8-250615 (Patent Document 2), and Japanese Unexamined Patent Application Publication No. 11-354663 (Patent Document 3).
Patent Document 1 discloses a hybrid IC with a metal shield case mounted on a ceramic board. The hybrid IC includes a ceramic board having a wiring pattern, and electronic components, such as a microcomputer, a transistor, and an IC, mounted on either side or both sides of the ceramic board. The ceramic board has a plurality of connection terminals extending perpendicularly downward from the outer peripheral edge thereof. The metal shield case made by bending both ends of a rectangular plate is mounted on the upper surface of the ceramic board, so as to block external noise. The shield case also functions as a sucking surface for picking up the hybrid IC for placement on a mother board.
Patent Document 2 discloses a ceramic package for a semiconductor chip, the ceramic package including a ceramic cover member having a box-like shape. The ceramic package for the semiconductor chip includes a ceramic package base on which a semiconductor chip is mounted, and the ceramic cover member for covering the package base. A copper plate layer is provided on the inner surface of the cover member, a sealing solder layer is provided on a sealed surface with a copper plate layer interposed therebetween, and the copper plate layer on the sealed surface is electrically connected to the copper plate layer on the inner surface. Also, a ground electrode is provided on the sealed surface of the package base, and the package base is sealed, with the sealing solder layer of the cover member interposed.
Accordingly, the copper plate layer on the sealed surface of the cover member is electrically connected to the ground electrode of the package base to function as a ground electrode layer, and the copper plate layer on the inner surface of the cover member functions as an electromagnetic shield layer.
Patent Document 3 discloses a sealing cover member for a semiconductor device and its manufacturing method. The sealing cover member has a multilayered structure including a plurality of ceramic layers. A shield layer is provided at an inner layer by wide area printing with paste. The back surface of the ceramic cover member and a board body facing the back surface are bonded by a binder paste, and thus, the cavity of the board body is sealed. Chip components may be mounted on both front and back surfaces of the ceramic cover member.
However, with the configuration disclosed in Patent Document 1, when the shield case has a reduced thickness so as to reduce the height of the electronic component such as the hybrid IC, it is difficult to perform accurate processing of the shield case, for example, by bending because the shield case is made of metal. In addition, the shield case may be markedly deformed due to an external force applied to the shield case during picking up. Generally, as shown in a part
With the configuration disclosed in Patent Document 2, since the ceramic cover member has the box-like shape, if the thickness of the ceramic cover member is reduced so as to reduce the height of the electronic component, waviness may be generated at a top portion 2A because of the difference between the behavior of shrinkage in a plane direction of the top portion 2A and that of an outer wall 2B of the box-like cover member 2 during firing, as shown in
With the configuration disclosed in Patent Document 3, the cavity of the electronic component is sealed with the flat cover member. Thus, the configuration may not be applied to an electronic component having no cavity. Accordingly, with this configuration, a cavity is required on the side of the wiring board on which the cover member is disposed. This may increase the number of steps in the manufacturing procedure, thereby increasing the manufacturing cost. Further, when the chip component is mounted on the cover member, soldering and reflowing must be performed two times for mounting the chip component on the cover member, and for mounting the cover member on the wiring board. When the cover member is mounted on the wiring board, however, the chip component previously mounted on the cover member may be detached due to remelting of the solder. Accordingly, breaking may occur, and in some cases, the solder may become an alloy or be brittle due to recrystallization of the solder. Thus, the reliability of the solder connection portion may be seriously deteriorated.
To overcome the problems described above, preferred embodiments of the present invention provide an electronic component and a manufacturing method thereof, the electronic component having a cover member that can be highly accurately fabricated with a reduced thickness, highly accurately mounted on a wiring board, and that enables a reduction in height of the electronic component.
An electronic component according to a preferred embodiment of the present invention includes a wiring board having a wiring pattern, surface mount devices mounted on a main surface of the wiring board, and a cover member arranged to cover the surface mount devices, in which the cover member includes a top portion made of a flat ceramic member, and a leg portion made of a columnar member having a height equal to or greater than the heights of the surface mount devices.
The columnar member may be a columnar metal that is integrally formed with the flat ceramic member by co-firing.
The top portion may have a multilayered structure in which a plurality of ceramic layers are laminated, a shield electrode layer is disposed at an interlayer and/or on an outer surface of the multilayered structure, and the shield electrode layer is connected to the columnar metal with a via conductor provided at the ceramic layers interposed therebetween.
The shield electrode layer and the columnar metal may be integrally formed by co-firing.
An opening may be provided at a portion of the shield electrode layer that faces at least one of the surface mount devices.
In the electronic component according to this preferred embodiment, the top portion may have a multilayered structure in which a plurality of ceramic layers are laminated, a thick-film resistor is disposed at an interlayer and/or on an outer surface of the multilayered structure, and the thick-film resistor is connected to the columnar metal with a via conductor provided at the ceramic layers interposed therebetween.
The top portion may have a shield electrode layer provided at an interlayer and/or on an outer surface of the top portion, and an opening is provided at a portion of the shield electrode layer facing the thick-film resistor.
Alternatively, the top portion may have a chip ceramic electronic component having a ceramic sintered body as an element body thereof and a terminal electrode, and at least a portion of the chip ceramic electronic component is embedded in the top portion.
The wiring board may be provided as a ceramic multilayered board in which a plurality of first low temperature co-fired ceramic layers are laminated, and a wiring pattern primarily including a material selected from silver and copper is provided at an interlayer of the ceramic multilayered board.
The top portion may have a laminated structure in which a plurality of second low temperature co-fired ceramic layers are laminated, and the second low temperature co-fired ceramic layers and the first low temperature co-fired ceramic layers have substantially the same material composition.
A method of manufacturing an electronic component according to another preferred embodiment of the present invention includes a step of fabricating a wiring board having a wiring pattern, a step of fabricating a cover member including a flat top portion, and a leg portion made of a columnar member integrally formed with the top portion and extending substantially perpendicularly from the top portion, and a step of superposing the cover member on a main surface of the wiring board, and connecting the cover member to the wiring board with the leg portion interposed therebetween.
The top portion may have a multilayered structure in which a plurality of ceramic layers are laminated, a shield electrode layer is disposed at an interlayer and/or on an outer surface of the multilayered structure, and the columnar member is a columnar metal integrally formed with the shield electrode layer by co-firing.
The step of fabricating the cover member may include a step of fabricating a top ceramic unfired body primarily including low temperature co-fired ceramic, and having an unfired shield electrode layer at an interlayer and/or on an outer surface of the top ceramic unfired body, a step of fabricating a shrinkage-suppression ceramic unfired body primarily including sintering resistant ceramic that is not substantially sintered at a firing temperature of the low temperature co-fired ceramic, and having an unfired columnar member to be the columnar member, a step of superposing the shrinkage-suppression ceramic unfired body on one of main surfaces of the top ceramic unfired body, a step of co-firing the top ceramic unfired body and the shrinkage-suppression ceramic unfired body at the firing temperature of the low temperature co-fired ceramic so as to sinter the top ceramic unfired body and to integrate the unfired shield electrode layer and the unfired columnar member by the co-firing, and step of removing the shrinkage-suppression ceramic unfired body.
The top ceramic unfired body may have an unfired thick-film resistor at an interlayer and/or on an outer surface of the top ceramic unfired body.
An opening may be provided at a portion of the unfired shield electrode layer facing at least one of the surface mount devices.
The top ceramic unfired body may have a chip ceramic electronic component on the main surface of the top ceramic unfired body, the chip ceramic electronic component having a ceramic sintered body as an element body, and a terminal electrode.
The columnar member may be formed to have a tapered cross section.
The columnar member of the cover member may be connected to the wiring pattern provided on the surface of the wiring board with a binder interposed therebetween.
The method of manufacturing the electronic component may further include a step of connecting the wiring board and the cover member to each other as a mother stack, and dividing the mother stack into individual electronic components.
The columnar member may be divided when the mother stack is divided, so as to provide an electronic component having a divided surface of the columnar member as a side electrode.
With preferred embodiments of the present invention, an electronic component and a manufacturing method thereof can be provided, the electronic component having a cover member that can be highly accurately fabricated with a reduced thickness, highly accurately mounted on a wiring board, and that can enable a reduction in height of the electronic component.
Other features, elements, steps, characteristics and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments of the present invention with reference to the attached drawings.
Preferred embodiments of the present invention are described below with reference to
As shown in
As shown in
For example, as shown in
As shown in
The ceramic layers 11A and the ceramic layers of the top portion 13A of the cover member 13 are made of ceramic materials. Both ceramic layers are preferably made of the same ceramic material. For example, the ceramic material may be a low temperature co-fired ceramic (LTCC) material. The LTCC material can be sintered at a temperature of about 1050° C. or less, and thus, is a ceramic material that can be co-fired with Ag, Cu, or other similar material, having a small resistivity. In particular, the LTCC material may be a glass composite LTCC material in which borosilicate glass is mixed with ceramic powder made of alumina, zirconia, magnesia, or forsterite, a crystallized glass LTCC material including ZnO—MgO—Al2O3—SiO2 crystallized glass, or a non-glass LTCC material using BaO—Al2O3—SiO2 ceramic powder, Al2O3—CaO—SiO2—MgO—B2O3 ceramic powder, or other suitable LTCC material.
The shield electrode layer 13C, the via conductors 13D, and the leg portions 13B of the cover member 13, and the wiring pattern 14 of the wiring board 11, are made of the above-described conductive metal materials. The conductive metal material may be metal primarily including at least one selected from Ag, an Ag—Pt alloy, an Ag—Pd alloy, Cu, Ni, Pt, Pd, W, Mo, and Au. In the examples of the conductive metal materials, Ag, an Ag—Pt alloy, an Ag—Pd alloy and Cu may be preferably used as a wiring material because these materials each have a small resistivity. When the LTCC material is used as the ceramic material for forming the ceramic layers 11A and the ceramic layers of the top portion 13A, a metal material having a low resistance and a low melting point of about 1050° C. or less, such as Ag or Cu, is used as the conductive metal material. Such a metal material can be co-fired with the LTCC material at a low temperature of about 1050° C. or less.
In this preferred embodiment, the ceramic material and the conductive metal material of the wiring pattern used for the wiring board 11 may be substantially the same as those used for the cover member 13. If the materials of the wiring board 11 are different from those of the cover member 13, the cover member 13 may be detached from the wiring board 11 due to the difference between the coefficient of thermal expansion of the materials for the wiring board 11 and that of the cover member 13, in accordance with variation in temperature.
Next, a preferred embodiment of a manufacturing method of the electronic component of the present invention is described with reference to
1. Fabrication of Wiring Board
(1) Fabrication of Board Ceramic Unfired Body (Board Ceramic Green Sheet)
First, mixed powder in which borosilicate glass is mixed with alumina powder, as an example of LTCC powder, is prepared. The mixed powder is dispersed in an organic vehicle, and thus, a slurry is prepared. The slurry is molded in a sheet form by a casting method. In this manner, a predetermined number of board ceramic green sheets 111A each having, for example, a thickness of about 20 μm are fabricated as shown in a
For example, the conductive paste primarily includes Ag. The same conductive paste is printed on the board ceramic green sheet 111A in a predetermined pattern, e.g., by screen printing to provide an unfired in-plane conductor 114A. Similarly, the ceramic green sheets 111A that have the unfired in-plane conductors 114A, the unfired via conductors 114B, and unfired surface electrodes 114C, respectively, formed in predetermined patterns, are fabricated. For example, five ceramic green sheets 111A are prepared.
(2) Fabrication of Shrinkage-Suppression Ceramic Unfired Body (Shrinkage-Suppression Ceramic Green Sheet)
A shrinkage-suppression ceramic green sheet primarily includes sintering resistant ceramic powder that is not sintered at a firing temperature of the LTCC material. For example, alumina powder is prepared as the sintering resistant ceramic powder, the alumina powder is dispersed in an organic vehicle, and thus, a slurry is prepared. The slurry is molded in a sheet form by a casting method. A predetermined number of shrinkage-suppression ceramic green sheets 100 and 100A are fabricated as shown in
(3) Fabrication of Composite Laminated Body
As shown in
(4) Firing of Composite Laminated Body
When the composite laminated body 110 is fired at a predetermined temperature, for example, about 1050° C. or less (e.g., about 870° C.), the shrinkage-suppression ceramic green sheets 100 and 100A are not substantially sintered, and thus, not substantially shrunk in the plane direction. Therefore, even when the five board ceramic green sheets 111A are sintered and integrated, the board ceramic green sheets 111A are not substantially shrunk in the plane direction because of the function of the shrinkage-suppression ceramic green sheets 100 and 100A, but the board ceramic green sheets 111A are shrunk substantially in the lamination direction (the thickness direction), thereby providing the highly accurate wiring board 11 having the wiring pattern 14 as shown in
(5) Plating
After the wiring board 11 is fabricated, the surface electrodes 14C are plated, for example, by gold plating, so as to enhance wettability thereof with respect to a binder member such as solder.
2. Fabrication of Cover Member
(1) Fabrication of Top Ceramic Unfired Body (Top Ceramic Green Sheet)
The cover member 12 is fabricated by using a material similar to the wiring board 11, in a manner similar to the wiring board 11. First, a predetermined number (e.g., two) of top ceramic green sheets 113A are fabricated as shown in
(2) Fabrication of Shrinkage-Suppression Ceramic Green Sheet
Similar to the wiring board 11, a predetermined number (e.g., six) of shrinkage-suppression ceramic green sheets are fabricated. Via holes for leg portions are formed in a predetermined pattern at three shrinkage-suppression ceramic green sheets 200 by using laser beam or a die. Then, the via holes are filled with the conductive paste so as to provide unfired leg portions 113B. The unfired leg portions 113B must have a height equal to or greater than the mounting heights of the surface mount devices 12 after firing. The height of the unfired leg portions 113B is controlled by adjusting the number of shrinkage-suppression ceramic green sheets 200 to be used. The lateral cross section of each unfired leg portion 113B after firing may be a substantially circular shape or a substantially polygonal shape. The diameter (in the case of the substantially polygonal shape, the maximum dimension passing through the center thereof) of the circular shape may range from about 0.1 mm to about 1 mm. In this preferred embodiment, for example, three shrinkage-suppression ceramic green sheets 200 are fabricated as shown in
(3) Fabrication of Composite Laminated Body
As shown in
While the shield electrode layer 13C is provided as an inner layer in the top portion 13A in this preferred embodiment, the shield electrode layer 13C may be provided on the outer surface of the top portion 13A. However, the shield electrode layer 13C should not be provided on the inner surface of the top portion 13A (the inner surface of the cover member 13). If the shield electrode layer 13C is provided on the inner surface of the cover member 13, the top portion 13A may bend inward due to a pressure force of a jig during characteristic screening, etc., resulting in that the top portion 13A comes into contact with the surface mount device 12 mounted on the wiring board 11. Due to this, accurate characteristic screening cannot be performed. If the shield electrode layer 13C is provided at the inner layer of the cover member 13 or on the outer surface thereof, accurate characteristic screening can be performed.
3. Mounting of Surface Mount Device and Cover Member to Wiring Board
As shown in
In the above description, the single electronic component 10 is fabricated. In view of industrial production, a plurality of electronic components 10 are fabricated at one time as a mother stack as shown in
Alternatively, the first and second mother stacks may be formed as shown in
With the preferred embodiment described above, the cover member 13 covering the surface mount devices 12 of the wiring board 11 includes the top portion 13A made of the flat ceramic member, and the leg portions 13B made of the columnar members having the height equal to or greater than the heights of the surface mount devices. The top portion 13A is made of the flat ceramic member. Accordingly, the thickness of the cover member 13 is not varied unlike the related art, and thus, the cover member 13 is shrunk and sintered uniformly in the thickness direction during firing. Thus, the flat top portion 13A having no waviness can be provided, and this enables the reduction in height of the electronic component 10. Since the top portion 13A of the cover member 13 is the ceramic member, short-circuiting is prevented from occurring between the top portion 13A and the surface mount devices 12 even if the top portion 13A bends during the characteristic screening, etc. of the electronic component 10.
Also, since the top portion 13A is the ceramic member which does not substantially bend toward the surface mount device 12, the gap between the top portion 13A and the surface mount devices 12 can be reduced. This further enables the reduction in height of the electronic component 10. For example, as shown in
With this preferred embodiment, the top portion 13A has a multilayered structure in which the plurality of ceramic layers are superposed. The shield electrode layer 13C is disposed in the top portion 13A as an inner layer. The shield electrode layer 13C is connected to the leg portions 13B (the columnar metals) through the via conductors 13D provided in the ceramic layers. Accordingly, the cover member 13 connected to the wiring pattern 14, which is the ground potential of the wiring board 11, shields and protects the surface mount devices 12 provided on the wiring board 11 from the external magnetic field environment by the shield electrode layer 13C.
With this preferred embodiment, the shield electrode layer 13C and the columnar metals of the leg portions 13B are integrated by co-firing. Accordingly, no solder bump or other similar structure for connection needs to be formed on the cover member 13 when the cover member 13 is mounted. The cover member 13 can be mounted on the wiring board 11 using the mounter in the same manner as the surface mount devices 12. This facilitates the manufacturing procedure.
With this preferred embodiment, the wiring board 11 is fabricated by the non-shrinkage method using the shrinkage-suppression ceramic green sheets 100 and 100A. Accordingly, the wiring board 11 having the highly accurate wiring pattern 14 with no waviness is fabricated. In addition, since the non-shrinkage method suppresses the shrinkage in the plane direction, the wiring board 11 is substantially shrunk in the lamination direction (the thickness direction), so that the thickness of the wiring board 11 is further reduced. Thus, the reduction in height of the electronic component 10 is further enabled. Since the cover member 13 is fabricated by the non-shrinkage method using the shrinkage-suppression ceramic green sheets 200 and 200A, the top portion 13A can be reduced in thickness with no waviness generated as mentioned above, and the leg portions 13B and the top portion 13A can be integrated by co-firing. In addition, since the top portion 13A of the cover member 13 is flat, the cover member 13 can be highly accurately mounted on the wiring board 11 by using the mounter.
In an electronic component of this preferred embodiment, the same numerals refer the same portions as those of the first preferred embodiment or portions corresponding to those of the first preferred embodiment. The above preferred embodiment describes the electronic component 10 in which the shield electrode layer 13C of the cover member 13 covers all surface mount devices 12. Meanwhile, the surface mount devices 12 may include a surface mount device 12, such as a type of SAW filter package, of which a characteristic is varied in accordance with the distance with respect to the shield electrode layer 13C, which is the ground potential of the cover member 13. For example, if the top portion 13A of the cover member 13 is bent by a jig or other external force during the characteristic screening of the electronic component 10, the distance between the shield electrode layer 13C of the cover member 13 and the surface mount device 12 varies, and this may affect the characteristic of the surface mount device 12.
An electronic component 10A of this preferred embodiment is similar to the electronic component 10 of the above-described preferred embodiment except that the electronic component 10A includes a predetermined surface mount device 12C circled in
With this preferred embodiment, since the portion of the top portion 13A of the cover member 13 directly above the predetermined surface mount device 12C is made of the ceramic member, the shield electrode layer 13C does not electromagnetically affect the surface mount device 12C even when the top portion 13A of the cover member 13 bends during the characteristic screening, etc., of the electronic component 10A. Accordingly, the original characteristic of the predetermined surface mount device 12C can be measured, and the quality of the electronic component 10A can be highly accurately determined. Thus, an acceptable product is prevented from being discarded, and a defective product is prevented from being shipped. Also, advantages similar to those of the above-described preferred embodiment are obtained.
An electronic component of this preferred embodiment is similar to that of the first preferred embodiment except that a leg portion 13B of a cover member 13 has a different shape as shown in
While the above preferred embodiments have the leg portion 13B of the cover member 13 preferably having a uniform diameter as shown in
Accordingly, with the present preferred embodiment, the contact area between the leg portion 13B including the solder fillet F and the wiring board 11 shown in
An electronic component of this preferred embodiment is similar to that of the first preferred embodiment except that a cover member 13 has no shield electrode layer, and a continuity need no be established between the cover member 13 and the wiring board 11, as shown in
The cover member 13 of this preferred embodiment may be fabricated as shown in
An electronic component of this preferred embodiment is similar to that of the first preferred embodiment except that a surface mount device 12 sealed with resin R is provided on the wiring board 11 through a bonding wire 12D, as shown in
With this preferred embodiment, the surface mount device 12 is mounted on the wiring board 11 while being sealed with the resin. Due to this, when the cover member 13 is mounted on the wiring board 11, solder paste may not be directly applied to the via conductors 14B by using a metal mask.
Therefore, in this preferred embodiment, a binder is applied to the tip end surfaces of the leg portions 13B of the cover member 13 as shown in
With this preferred embodiment, even when the binder may not be applied to the via conductor 14B and the surface electrode 14C of the wiring board 11 by using the metal mask, the cover member 13 can be easily mounted on the wiring board 11 and fixed thereto by transferring the binder P on the lower tips of the leg portions 13B of the cover member 13. Also, advantages similar to those of the first preferred embodiment can be obtained.
An electronic component of this preferred embodiment is similar to that of the first preferred embodiment except that a thick-film resistor 13F and a wiring pattern 13G thereof are provided in the top portion 13A of the cover member 13 instead of the shield electrode layer 13C, as shown in
The cover member 13 shown in
After firing, a laser beam irradiates the thick-film resistor 13F of the cover member 13 so as to obtain a desired resistance.
With the preferred embodiment shown in
While the preferred embodiment shown in
The shield electrode layer 13C, the thick-film resistor 13F, and the wiring pattern 13G thereof are provided in the top portion 13A of the cover member 13 as shown in
In the case of the cover member 13 shown in
In the case of the cover member 13 shown in
With this preferred embodiment shown in
An electronic component of this preferred embodiment is similar to that of the preferred embodiment shown in
The cover member 13 shown in
To fabricate the cover member 13, a predetermined unfired wiring pattern (an unfired in-plane conductor and an unfired via conductor) is formed at a top ceramic green sheet in a manner similar to the sixth preferred embodiment. A predetermined number of top ceramic green sheets are superposed on a shrinkage-suppression ceramic green sheet, so as to provide a laminated body with unfired lands exposed at the upper surface of the laminated body in a predetermined pattern. Then, an organic adhesive is applied on the upper surface of the laminated body by spraying or other suitable method to form an organic adhesive layer, the chip ceramic electronic component 13H is mounted on the unfired lands by using a mounter (not shown), and the chip ceramic electronic component 13H is bonded and fixed to the unfired lands. A shrinkage-suppression ceramic green sheet having unfired leg portions is superposed and pressed thereon to provide a composite laminated body. Due to the pressing, the chip ceramic electronic component 13H is partially embedded into the upper surface of the laminated body with the unfired lands. By firing the composite laminated body, the external terminal electrodes of the chip ceramic electronic component 13H are co-fired with lands 13I, so that the cover member 13 (see
With this preferred embodiment, the chip ceramic electronic component 13H mounted at the cover member 13 is embedded into the lower surface of the top portion 13A. Accordingly, even though heating processing such as reflowing is performed when the cover member 13 is mounted on the wiring board 11 and fixed thereto, the connection portion between the chip ceramic electronic component 13H and the lands is not deteriorated, and the connection reliability is assured for a long duration. In addition, advantages similar to those of the first preferred embodiment are provided.
In the case of the cover member 13 shown in
In the case of the cover member 13 shown in
With this preferred embodiment shown in
In the case where the cover member 13 shown in
Note that the present invention is not limited to the above-described preferred embodiments, and may include modifications within the scope of the present invention.
The present invention can be used preferably as an electronic component for various electronic equipment.
While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims.
Ikeda, Tetsuya, Nishizawa, Yoshihiko
Patent | Priority | Assignee | Title |
10276401, | Mar 12 2013 | Taiwan Semiconductor Manufacturing Company, Ltd. | 3D shielding case and methods for forming the same |
10431648, | May 02 2014 | Invensas Corporation | Making electrical components in handle wafers of integrated circuit packages |
10779395, | Apr 25 2019 | Microsoft Technology Licensing, LLC | Electromagnetic interference shield with integrated decoupling |
10872865, | Mar 12 2013 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electric magnetic shielding structure in packages |
11532567, | Mar 12 2013 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electric magnetic shielding structure in packages |
8080737, | Dec 27 2007 | Samsung Electro-Mechanics Co., Ltd. | Ceramic substrate, method of manufacturing the same, and electrical device using the same |
8102669, | Oct 07 2008 | Advanced Semiconductor Engineering, Inc. | Chip package structure with shielding cover |
8106302, | Oct 13 2008 | Askey Computer Corp. | Circuit board of communication product and manufacturing method thereof |
8363422, | Aug 13 2008 | TAIYO YUDEN MOBILE TECHNOLOGY CO , LTD ; TAIYO YUDEN CO , LTD | Electronic component module and method for manufacturing the same |
8736413, | Dec 14 2011 | Murata Manufacturing Co., Ltd. | Laminated type inductor element and manufacturing method therefor |
8884424, | Jan 13 2010 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with single sided substrate design and manufacturing methods thereof |
8897028, | Jun 11 2010 | Murata Manufacturing Co., Ltd. | Circuit module |
8923748, | Oct 21 2009 | Saturn Licensing LLC | High frequency module and receiver |
8941222, | Nov 11 2010 | Advanced Semiconductor Engineering Inc. | Wafer level semiconductor package and manufacturing methods thereof |
9196597, | Jan 13 2010 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with single sided substrate design and manufacturing methods thereof |
9337073, | Mar 12 2013 | Taiwan Semiconductor Manufacturing Company, Ltd. | 3D shielding case and methods for forming the same |
9343333, | Nov 11 2010 | Advanced Semiconductor Engineering, Inc. | Wafer level semiconductor package and manufacturing methods thereof |
9349611, | Mar 22 2010 | Advanced Semiconductor Engineering, Inc. | Stackable semiconductor package and manufacturing method thereof |
9363892, | Jul 19 2013 | Google Technology Holdings LLC | Circuit assembly and corresponding methods |
9370104, | Jul 16 2013 | Seiko Instruments Inc; KAGA, INC | Lid body portion and electronic device package using the lid body portion and electronic device |
9406658, | Dec 17 2010 | Advanced Semiconductor Engineering, Inc.; Advanced Semiconductor Engineering, Inc | Embedded component device and manufacturing methods thereof |
9461025, | Mar 12 2013 | Taiwan Semiconductor Manfacturing Company, Ltd. | Electric magnetic shielding structure in packages |
9716049, | Aug 01 2014 | SOCIONEXT INC. | Semiconductor device and manufacturing method of semiconductor device |
Patent | Priority | Assignee | Title |
6462271, | Dec 27 2000 | International Business Machines Corporation | Capping structure for electronics package undergoing compressive socket actuation |
20020053449, | |||
JP11354663, | |||
JP186269, | |||
JP2000236045, | |||
JP2004031745, | |||
JP3034445, | |||
JP6350280, | |||
JP7142630, | |||
JP7193160, | |||
JP7202372, | |||
JP8153822, | |||
JP8250615, |
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