An electromechanical system comprising a substrate including a surface region and a flexible member coupled at a first end to the surface region. The system further comprises a base region and a tip region. The system also comprises a reflective member coupled to the flexible member, including a reflective surface and a backside region, the backside region being coupled to the second end of the flexible member, the reflective surface being substantially parallel to the surface region while the reflective member is in a first state and being substantially non-parallel to the surface region while the reflective member is in a second state. The flexible member moves from a first position characterized by the first state to a second position characterized by the second state and the angle between the first state and the second state is greater than 12°.
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14. An array of moveable structures, the array comprising:
a substrate comprising a surface region;
a plurality of electrically activated electrodes coupled to the surface region of the substrate, the plurality of electrically activated electrodes being coupled to an electrical source to receive an electrical signal;
a plurality of flexible members comprising a first end coupled to the surface region of the first substrate and a second end with a length defined between the first end and the second end;
a base region within a first portion of each of the plurality of flexible members, the base region being defined from the first end to a first predetermined portion of the length of each of the plurality of flexible members, the base region being characterized by a first rectangular cross-section having a base length and a base width less than the base length;
a tip region within a second portion of each of the plurality of flexible members, the tip region being defined from the second end to a second predetermined portion of the length of each of the plurality of flexible members, the tip region being characterized by a second rectangular cross-section having a tip length and tip width less than the tip length; and
a plurality of moveable structures wherein each of the plurality of moveable structures is coupled to one of the plurality of flexible members and configured to overhang the one of the plurality of flexible members.
9. An electro-mechanical system disposed in an array configuration, the electro-mechanical system comprising:
a substrate comprising a surface region;
a set of electrodes disposed on the surface region and separated by a first distance to define a separation region, the set of electrodes configured to receive a first voltage and a second voltage;
a flexible member coupled at a first end to the surface region at a position between the set of electrodes in the separation region, wherein the flexible member comprises a second end and a length defined between the first end and the second end and wherein the flexible member comprises:
a base region disposed within a first portion of the flexible member, the base region being defined from the first end to a first predetermined portion of the length of the flexible member, the base region being characterized by a first rectangular cross-sectional area measured parallel to the surface region of the substrate;
a tip region within a second portion of the flexible member, the tip region being defined from the second end to a second predetermined portion of the length of the flexible member, the tip region being characterized by at least a second rectangular cross-sectional area measured parallel to the surface region of the substrate; and
a moveable member coupled to the flexible member, the moveable member comprising a frontside surface and a backside surface, the backside surface being attached to the second end of the flexible member, the moveable surface being substantially parallel to the surface region in a first state associated with the first voltage and being substantially non-parallel to the surface region in a second state associated with the second voltage.
1. An electro-mechanical system disposed in an array configuration, the electro-mechanical system comprising:
a substrate comprising a surface region including an array of electrodes, each of the array of electrodes being provided in pairs and configured to support a first voltage and a second voltage different from the first voltage; and
an array of moveable structures, each of the array of moveable structures being associated with a pair of electrodes of the array of electrodes, each of the array of moveable structures including:
a flexible member comprising a first end coupled to the surface region of the substrate and a second end opposing the first end, wherein a length is defined between the first end and the second end and wherein the second end is operable for displacement between a first position and a second position, the first position and the second position being located in a plane defined by the length and a width of the flexible member;
a base region within a first portion of the flexible member, the base region being defined from the first end to a first predetermined portion of the length of the flexible member;
a tip region within a second portion of the flexible member, the tip region being defined from the second end to a second predetermined portion of the length of the flexible member; and
a moveable surface coupled to the flexible member and comprising a frontside region and a backside region, the backside region being coupled to the second end of the flexible member, wherein a normal of the frontside region is configured to be oriented at a first angle with respect to the surface region in response to the first voltage and oriented at a second angle with respect to the surface region in response to the second voltage.
2. The electro-mechanical system of
the base region is characterized by at least a first cross-sectional area, the first cross-sectional area being substantially parallel to the surface region of the substrate; and
the tip region is characterized by at least a second cross-sectional area, the second cross-sectional area being substantially parallel to the surface region of the substrate and less than the first cross-sectional area.
3. The electro-mechanical system of
4. The electro-mechanical system of
5. The electro-mechanical system of
6. The electro-mechanical system of
7. The electro-mechanical system of
8. The electro-mechanical system of
10. The electro-mechanical system of
11. The electro-mechanical system of
12. The electro-mechanical system of
13. The electro-mechanical system of
15. The array of moveable structures of
16. The array of moveable structures of
17. The array of moveable structures of
18. The array of moveable structures of
19. The array of moveable structures of
20. The array of moveable structures of
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This application is a continuation of U.S. patent application Ser. No. 11/412,263, which is a continuation of U.S. patent application Ser. No. 10/901,706, filed Jul. 28, 2004, now U.S. Pat. No. 7,068,417, the disclosures of which are hereby incorporated by reference in their entirety for all purposes.
This present invention relates generally to manufacturing objects. More particularly, the invention provides a method and apparatus for fabricating and operating electromechanical systems. Merely by way of example, the invention has been applied to a high fill factor micro-electromechanical mirror array with a hidden, flexible support pedestal. The method and apparatus can be applied to other electromechanical technology as well, including actuators and sensors.
Micro-electromechanical systems (MEMS) are used in a number of application areas. For example, MEMS have been used in micro-mirror arrays, sensors, and actuators. In some of these applications, a suspended member is supported by a flexible hinge attached to a stationary portion of the micro-mirror array. Flexibly attached to the hinge, the suspended member is attracted to an electrode upon application of an electrical force and restored to an original position by a restoring force. In this manner, the array of micro-mirrors can be tilted in relation to a light source. In some applications, it is beneficial to have the hinge located beneath the micro-mirror surface in a hidden position, enabling the fill factor of the array to be increased. As the fill factor of the micro-mirror array is increased, the potential quality of two-dimensional images created by optical systems using the array is improved.
As merely an example, conventional MEMS have utilized various micro-mirror designs to hide the hinge in a location behind the mirror surface. For example, torsion spring hinges attached to the backside of the mirror surface have been used in some designs. Unfortunately, these techniques also have limitations. For example, some torsion spring designs are difficult to manufacture owing to their complex structural features. Moreover, complex mechanical structures may have reliability and lifetime concerns. Therefore, there is a need in the art for methods and apparatus for a high fill factor micro-electromechanical mirror array with a flexible, hidden support member.
This present invention relates generally to manufacturing objects. More particularly, the invention provides a method and apparatus for fabricating and operating electromechanical systems. Merely by way of example, the invention has been applied to a high fill factor micro-electromechanical mirror array with a hidden, flexible support pedestal. The method and apparatus can be applied to other electromechanical technology as well, including actuators and sensors.
In a specific embodiment, the present invention provides an electromechanical system. The system has a substrate (e.g., silicon) comprising a surface region. The system has a flexible member comprising a first end coupled to the surface region of the substrate. Preferably, the flexible member comprises a second end and a length defined between the first end and the second end. A base region is within a first portion of the flexible member. The base region is defined from the first end to a first predetermined portion of the length of the flexible member. The base region is characterized by at least a first cross-sectional area, which is parallel to the surface region of the substrate. The system has a tip region within a second portion of the flexible member. The tip region is defined from the second end to a second predetermined portion of the length of the flexible member. The tip region is characterized by at least a second cross-sectional area, which is parallel to the surface region of the substrate. A reflective member is coupled to the flexible member. The reflective member comprises a reflective surface and a backside region. Preferably, the backside region is coupled to the second end of the flexible member. The reflective surface is substantially parallel to the surface region while the reflective member is in a first state and is substantially non-parallel to the surface region while the reflective member is in a second state. The flexible member moves from a first position characterized by the first state to a second position characterized by the second state. The movement of the flexible member from the first position to the second position is constrained to lie in a first plane defined by an axis parallel to the length of the flexible member and an axis parallel to the surface region.
In an alternative specific embodiment, the present invention provides an alternative electromechanical system. The system has a first substrate comprising a surface region. A plurality of electrically activated electrodes is coupled to the surface region of the first substrate. The plurality of electrically activated electrodes is coupled to an electrical source to receive a first electrical signal. The system has a plurality of flexible members comprising a first end coupled to the surface region of the first substrate. The members comprises a second end and a length defined between the first end and the second end. A base region is within a first portion of the plurality of flexible members. The base region is defined from the first end to a first predetermined portion of the length of the flexible members. The base region is characterized by at least a first cross-sectional area, which is parallel to the surface region of the substrate. A tip region is within a second portion of the plurality of flexible members. The tip region is defined from the second end to a second predetermined portion of the length of the flexible members. The tip region is characterized by at least a second cross-sectional area. A moveable structure is coupled to the plurality of flexible members, comprising a frontside surface and a backside surface. The backside surface is coupled to the second end of the plurality of flexible members. The frontside surface is substantially parallel to the surface region while the moveable structure is in a first state and is substantially non-parallel to the surface region while the moveable structure is in a second state. The tip region of the plurality of flexible members moves from a first position characterized by the first state to a second position characterized by the second state upon application of a predetermined voltage bias associated with the first electrical signal. The movement of the tip region of the plurality of flexible members from the first position to the second position is constrained to lie in a plane including an axis parallel to the length of the plurality of flexible members.
In an alternative specific embodiment, the present invention provides a method of manufacturing an electromechanical system. The method includes depositing a first mask layer on a first surface of a handling substrate and etching the first surface of the handling substrate to form a plurality of flexible pedestals and a plurality of walls. The method includes removing the first mask layer and forming a plurality of electrodes on an electrode substrate. The method includes aligning the handling substrate and the electrode substrate and wafer bonding the handling substrate to the electrode substrate by making contact between the plurality of flexible pedestals and the plurality of walls. The method includes thinning a portion of the handling substrate by removing material from a second surface of the handling substrate and depositing a second mask layer on the second surface of the handling substrate. The method includes etching the second surface of the handling substrate to remove at least a portion of the plurality of walls and form moveable structures.
Many benefits are achieved by way of the present invention over conventional techniques. For example, the present technique provides an easy to use process that relies upon conventional technology. In some embodiments, the method provides higher device yields in dies per wafer. Additionally, the method provides a process that is compatible with conventional process technology without substantial modifications to conventional equipment and processes. Preferably, the invention provides a simple structure with fewer process steps, higher yields, reliability, and other desirable features in certain embodiments. Depending upon the embodiment, one or more of these benefits may be achieved. These and other benefits will be described in more throughout the present specification and more particularly below.
Various additional objects, features and advantages of the present invention can be more fully appreciated with reference to the detailed description and accompanying drawings that follow.
Electrically activated electrodes 130 and 132 are coupled to the first surface. The electrodes can be made of materials that conduct electricity. Merely by way of example, the electrode 130 in the embodiment illustrated in
Moveable structure 110 is suspended at a predetermined position by flexible pedestal 125, which is coupled to the first surface. In the embodiment illustrated in
Moreover, in embodiments according to the present invention, the flexible pedestal is fabricated from a material with suitable pliability and reliability. The material should be elastic enough to enable the moveable member to be tilted as desired. At the same time, the material should have the ability to be cycled numerous times while still maintaining the desired reliability. In a specific embodiment, the flexible pedestal is fabricated from single crystal silicon, but this is not required by the present invention. Additionally, the moveable member is fabricated from single crystal silicon in a particular embodiment. Alternative embodiments according to the present invention use other materials that bend in response to applied forces and subsequently return to their original shape after removal of such applied forces. For example, some embodiments use polysilicon or metal as the material for the flexible pedestal.
Embodiments according to the present invention utilize a flexible pedestal design in which the flexible pedestal bends in a predetermined manner, without rotating about the longitudinal axis of the pedestal. In general, the upper end or tip 240 of the flexible pedestal is free to move in directions that contain components in both the x-y and x-z planes. In specific embodiments of the present invention, the motion of the upper end 240 of the flexible pedestal is constrained to move in a single plane. Thus, as illustrated in
As illustrated in
In embodiments according to the present invention, the height and position of the flexible pedestal are selected so that the upper surface of the moveable structure is tilted at a predetermined angle with respect to the horizontal when the moveable structure is in the activated state. In embodiments according to the present invention in which the upper surface of the moveable structure comprises reflective portions, an incident ray of light will be reflected at predetermined angles depending on the tilt angle of the moveable structure when in the activated position. In the embodiment illustrated in
Moreover, in embodiments according to the present invention, the longitudinal length of the moveable structure is a predetermined length. In the embodiment illustrated in
In step 382, the device layer is etched to form the flexible pedestals 125 and the walls 316 in an upper portion of the device layer 308. In alternative embodiments, the flexible pedestals and the walls are formed in subsequent etching processes, thereby optimizing the shape of the pedestals and the shape of the walls independently. Additional masking steps are utilized as needed for each of the additional etching processes. The etch processes utilized, as discussed below, will form flexible pedestals and walls with predetermined profiles and heights.
In one embodiment, the substrate is etched in a reactive ion etch chamber flowing with SF6, HBr, and oxygen gases at flow rates of 100 sccm, 50 sccm, and 10 sccm respectively. The operating pressure is in the range of 10 to 50 mTorr, the bias power is 60 W, and the source power is 300 W. In another embodiment, the substrate is etched in a reactive ion etch chamber flowing with Cl2, HBr, and oxygen gases at flow rates of 100 sccm, 50 sccm, and 10 sccm, respectively. In these embodiments, the etch processes stop when the cavities are about 3-4 microns deep. This depth is measured using in-situ etch depth monitoring, such as in-situ optical interferometer techniques, or by timing the etch rate.
In another embodiment, the cavities are formed in the substrate by an anisotropic reactive ion etch process. The substrate is placed in a reaction chamber. SF6, HBr, and oxygen gases are introduced into the reaction chamber at a total flow rate of 100 sccm, 50 sccm, and 20 sccm, respectively. A bias power setting of 50 W and a source power of 150 W are used at a pressure of 50 mTorr for approximately 5 minutes. The substrate is then cooled with a backside helium gas flow of 20 sccm at a pressure of 1 mTorr. In one particular embodiment, the etch processes stop when the cavities are about 3-4 microns deep. This depth is measured using in-situ etch depth monitoring, such as in-situ optical interferometer techniques, or by timing the etch rate. The mask layer is removed in step 384.
In embodiments according to the present invention in which the spacing between flexible pedestals and the walls is relatively large on semiconductor scales (for example, a spacing of 15 μm), complex electrical circuitry can be manufactured on the surface of the electrode substrate in the regions between the flexible pedestals. Possible circuitry includes, but is not limited to, storage buffers to store time sequential pixel information, circuitry to compensate for possible non-uniformity of the handling and electrode substrates or their deposited layers, and circuitry to form pulse width modulation conversions.
In step 388, the handling substrate and the electrode substrate are bonded together as illustrated in
In step 390, illustrated in
Subsequent to the removal of the oxide layer, in a particular embodiment according to the present invention, the device layer 308 is polished. In alternative embodiments, the device layer is thinned to a predetermined thickness and subsequently polished, however this is not required by the present invention. In yet another alternative embodiment, the thickness of the device layer 308 is selected during the initial fabrication of handling substrate 304 and is maintained at this pre-selected thickness during subsequent processing. In this alternative embodiment, the surface morphology of layer 308/layer 306 interface is controlled during the initial fabrication of the handling substrate and no thinning or polishing steps are needed. As will be apparent in
In step 394 a reflective surface 320 is formed at the top surface of layer 308. As illustrated in
In step 396, the moveable structures 332 are separated from adjacent structures by an etching process as illustrated in
The dimensions of the flexible pedestal will impact its elasticity and the force required to modulate the position of the moveable structure. For many materials used to fabricate the flexible pedestal, a smaller cross-sectional area will result in increased flexibility. At the same time, a decrease in the cross-sectional area of the pedestal's base will increase the difficulty of reliably bonding the base of the flexible pedestal to the first surface, as described above. Thus, there is, in some embodiments, a tradeoff between pedestal flexibility and ease of manufacturing.
The top region or tip of the flexible pedestal, coupled to the lower surface of moveable structure 110 at location 420 in
The cross-sectional profile illustrated in
Moreover, as illustrated in
In embodiments in which the cross-sectional shape of the pedestal is an ellipse, the bending motion will occur in the plane defined by the longitudinal axis of the pedestal and the minor axis of the ellipse, rotating about the axis parallel to the major axis of the ellipse. Embodiments in which the cross-sectional shape of the pedestal is a combination of such geometrical shapes, and the resulting constraints on the bending motion, will be apparent to those of skill in the art.
The flexible pedestal illustrated in
In embodiments according to the present invention, the length 440 of the flexible pedestal is a predetermined distance. In a specific embodiment, the length of the flexible pedestal is 3 μm and uniform along the length of the pedestal. In other embodiments, the length varies along the length of the pedestal. As discussed above, for many materials, the dimensions of the pedestal, including the length, impact the flexibility of the pedestal. For example, in some embodiments, as the length of the pedestal increases, the flexibility typically decreases. Increases in pedestal length are balanced against decreases in width in some embodiments to maintain the flexibility at a desired value. In designing the pedestal dimensions, including the width and length, the designer can utilize these design parameters to optimize the system performance. In one embodiment, the flexible pedestal runs continuously from one corner of the moveable structure to the opposite corner. As illustrated in
As illustrated in
In embodiments according to the present invention, the dimensions of the flexible pedestal are selected to achieve particular system goals. For example, in one embodiment, the length and width of the flexible pedestal are predetermined. As will be evident to one of skill in the art, the elasticity of the flexible pedestal will typically be a function of the pedestal dimensions. For example, as the length and width of the pedestal increases, the elasticity of the pedestal typically decreases. In a specific embodiment, the length of the pedestal is 3 μm and the width of the pedestal is 0.2 μm. In this specific embodiment, the length and width of the pedestal is uniform as a function of height. In the embodiment illustrated in
In another specific embodiment, the length of the pedestal is increased to improve the reliability of the bond between the base of the pedestal and the first surface. In an alternative specific embodiment, the width of the base of the pedestal is increased to improve the reliability of the bond between the base of the pedestal and the first surface. In yet another alternative embodiment, the length and average width of the pedestal are increased to improve the reliability of the bond between the base of the pedestal and the first surface.
In embodiments according to the present invention, the dimensions of the flexible pedestals are selected to achieve particular system goals. For example, in one embodiment, the lengths and widths of the flexible pedestals are predetermined. As illustrated in
In the embodiment illustrated in
As discussed in relation to
The examples and embodiments described herein are for illustrative purposes only. Various modifications or changes in light thereof will be suggested to persons skilled in the art and are to be included within the spirit and purview of this application and scope of the appended claims. It is not intended that the invention be limited, except as indicated by the appended claims.
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