In a method of manufacturing a metal keypad panel with a micropore array, a metal laminate is prepared and etched to form micropores on the metal laminate, and a filling is coated on a surface of the metal laminate and permeated into the micropores. After the metal laminate is punched to form a metal keypad panel in a predetermined shape, the metal keypad panel is put into a mold. After a plastic material is injected into the mold, a pattern layer is formed on a side of the metal keypad panel, and then a backlight module is attached onto another side of the metal keypad panel. The backlight module has patterns, and the shape of the patterns is formed by arranging light guide microstructures. Finally, an electric signal module is attached onto a side of the backlight module to complete manufacturing the metal keypad panel.
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1. A method of manufacturing a metal keypad panel having a micropore array, and the metal keypad panel being installed on a surface of an electronic device, and the method comprising:
(a) preparing a metal laminate;
(b) etching the metal laminate with a plurality of micropore arrays;
(c) filling a filling onto the micropore arrays;
(d) punching the metal laminate to form a single metal keypad panel in a predetermined shape;
(e) attaching a backlight module onto a side of the metal keypad panel, wherein the backlight module is comprised of a light guide plate, a plurality of patterns formed on the light guide plate, and a light guide microstructure formed by the patterns; and
(f) attaching a side of the backlight module to an electric signal module, wherein the electric signal module includes a flexible printed circuit board, and the circuit board has a plurality of contact points, and each contact point corresponds to a metal dome, and all of the metal domes are in communication with the keypad such that deformation of different areas of the keypad corresponds to deformation of different metal domes, and then an adhesive layer is adhered onto a side of the circuit board and a side of the metal dome for adhering a layer of a dome membrane, and an adhesive block is coated onto a side of a protruding position of the dome membrane, and a protrusion is adhered onto each adhesive block, and the circuit board has a light source module comprised of a plurality of light emitting diodes, and a position of the light emitting diode for producing a light source corresponds to a side of the light guide plate.
2. The method of manufacturing a metal keypad panel with a micropore array as recited in
3. The method of manufacturing a metal keypad panel with a micropore array as recited in
4. The method of manufacturing a metal keypad panel with a micropore array as recited in
5. The method of manufacturing a metal keypad panel with a micropore array as recited in
6. The method of manufacturing a metal keypad panel with a micropore array as recited in
7. The method of manufacturing a metal keypad panel with a micropore array as recited in
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1. Field of the Invention
The present invention generally relates to a keypad panel, and more particularly to a method of manufacturing a metal keypad panel.
2. Description of Prior Art
As communication technologies advance continuously, many electronic products are manufactured with a light, thin, short and small design to reduce the size and weight of the electronic products and facilitate users to carry the electronic products. To reduce the size and weight of an electronic product, designers and manufacturers reduce the volume of internal integrated circuits as well as the area and thickness of the operating interface on a surface of the electronic product before the electronic product is installed to a communication device.
Referring to
Although the metal keypad panel 10a is manufactured with a light, thin, short and compact design and can be installed and used in a small electronic device, its manufacture requires filling a resin layer 22a to a hollow portion 21a of all metal press key 2a one by one, and then attaching the metal press keys 2a onto a side of the elastic layer 1a one by one, and thus the manufacture of the metal keypad panel 10a takes much time and effort and technically involves a high level of difficulty. After the metal keypad panel 10a is assembled and combined with the base 20a, a gap is formed between the periphery of the metal press key 2a and the base 20a, and thus dusts may be accumulated at the exterior of the keypad panel 10a or water may enter into the interior easily, and finally causing an unsmooth operation of the press keys or a short circuit to the internal circuits. Furthermore, there is no reflective effect of any bright line on surfaces of the metal keypad panel 10a, so that the metal keypad panel 10a is extremely dull in appearance.
It is a primary objective of the present invention to overcome the foregoing shortcomings by providing a novel method of manufacturing a metal keypad panel, such that the metal keypad panel can be manufactured easily, and accumulated dusts and permeated water can be avoided. In addition, micropores and light guide microstructures are used for displaying patterns on the surface of press keys, and a pattern layer provides a bright wavy line effect to the surface of the metal keypad panel to improve the overall appearance and visual effect of the metal keypad panel.
To achieve the foregoing objective, the present invention provides a method of manufacturing a metal keypad panel with a micropore array, and the method comprises the steps of: preparing a metal laminate; etching the metal laminate to form a plurality of micropores on the metal laminate; forming a meshed metal keypad panel by a micropore array method; coating a filling onto a surface of the metal laminate and permeating the filling into the micropore; punching the metal laminate to form the metal keypad panel in a predetermined shape; putting the metal keypad panel into a mold and forming a pattern layer on a side of the metal keypad panel after injecting a plastic material; attaching a backlight module onto another side of the metal keypad panel, and the backlight module has a corresponding pattern, and the shape of the pattern is formed by arranging a plurality of light guide microstructures; attaching an electric signal module on a side of the backlight module, and the electric signal module is comprised of a flexible printed circuit board, and the flexible printed circuit board has a plurality of contact points, and each contact point corresponds to a metal dome; coating an adhesive layer onto a side of the circuit board and the metal dome, and the adhesive layer is adhered to a layer of an dome membrane; coating an adhesive block on a side of a protruding position of the dome membrane; adhering each adhesive block onto a protrusion, and the protrusion corresponds to the pattern on each light guide plate; and installing a light source module at a distal side of the circuit board, and the light source module corresponds to a side of the light guide plate.
The technical characteristics, features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments with reference to the accompanying drawings.
Referring to
Step 100: Prepare a metal laminate 10 as shown in
Step 102 (Etching): Etch the metal laminate 10 to form a plurality of micropores 11 on the metal laminate 10, wherein a meshed metal keypad panel 1 as shown in
Step 104 (Filling micropores): Coat a filling 2 onto a surface of the metal keypad panel 1, and permeate the filling 2 into the micropores 11 as shown in
Step 106 (Punching): Punch the metal laminate 10 to form a metal keypad panel 1 in a predetermined shape as shown in
Step 108 (Producing a surface pattern layer): Put the metal keypad panel 1 into a mold 20, and inject a plastic material such as thermoplastic polyurethane (TPU) or thermoplastic elastomer (TPE) into a mold cavity 201 of the mold 20, so that the plastic material is attached onto a side of the filling 2. In the meantime, lines 202 on the internal surface of the mold cavity 201 form a pattern layer 3 by the plastic material as shown in
Step 110 (Attaching a backlight module 4): Attach a light guide plate 41 onto a side of the metal keypad panel 1, and the light guide plate 41 can be formed on a side of the metal keypad panel 1a by a thermal press method, and a pattern 411 of the corresponding press key is stamped and formed on the light guide plate 41, and the shape of the pattern 411 is formed by arranging a plurality of light guide microstructures 412, and the light guide microstructure 412 is concavely disposed in the light guide plate 41 or convexly disposed on a side of the light guide plate 41a. The shape of the pattern 411 can be a number, a text, a special symbol (#, *, .) and a direction symbol as shown in
Step 112 (Attaching an electric signal module 5): Attach an electric signal module 5 onto a side of the backlight module 4, and the electric signal module 5 includes a flexible printed circuit board (FPCB) 51, and the flexible printed circuit board 51 has a plurality of contact points 511, and each contact point 511 corresponds to a metal dome 52. Coat an adhesive layer 53 onto a side of the circuit board 51 and the metal dome 52, and the adhesive layer 53 is adhered to a layer of an dome membrane 54. Coat an adhesive block 55 on a side at a protruding position of the dome membrane 54, and adhere a protrusion 56 on each adhesive block 55, and the protrusion 56 corresponds to each pattern 411 of the light guide plate 41. Install a light source module 57 onto a distal side of the circuit board 51, wherein the light source module 57 is comprised of a plurality of light emitting diodes 571, and a position of the light emitting diode 571 for producing a light source corresponds to a side of the light guide plate 41 as shown in
Referring to
Referring to
If no external force is applied onto a side of the metal keypad panel 1, the metal panel 1 will rise to its original position automatically by the resilience of the metal keypad panel 1 and the metal dome 52.
Referring to
Referring to
If a light is guided into the backlight module, the light will pass through the micropores 11 of the pattern 14 to display the shape of the pattern 14 such as a number, a text, a special symbol (#, *, .) and a direction symbol, etc.
Referring to
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While the invention is described in by way of examples and in terms of preferred embodiments, it is to be understood that the invention is not limited thereto. On the contrary, the aim is to cover all modifications, alternatives and equivalents falling within the spirit and scope of the invention as defined by the appended claims.
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Oct 04 2007 | WU, CHE-TUNG | ICHIA TECHNOLOGIES, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 020256 | /0783 | |
Oct 04 2007 | HSU, CHIH-HO | ICHIA TECHNOLOGIES, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 020256 | /0783 | |
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