A headphone unit including a back housing provided at the rear of a driver unit and a baffle portion provided at the front thereof. In the headphone apparatus, the baffle portion, which is formed to surround a space except a front opening portion of a driver unit, and/or the back housing portion, which is formed to cover the back surface of the driver unit, are formed using the air-permeable porous material.
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13. A headphone apparatus, comprising:
a baffle portion forming outer edges of the headphone apparatus and surrounding a space except a front opening portion of a driver unit, the baffle portion being formed of an air-permeable porous material such that air from outside the apparatus permeates through the material and external sound is prevented from being trapped interior to the baffle portion, degrading sound quality,
wherein said baffle portion is approximately cone-shaped having a circular cross-section, and
wherein said air-permeable porous material of the baffle portion comprises a cellulose based material.
1. A headphone apparatus, comprising:
a baffle portion forming outer edges of the headphone apparatus and surrounding a space except a front opening portion of a driver unit, the baffle portion being formed of an air-permeable porous material such that air from outside the apparatus permeates through the material and external sound is prevented from being trapped interior to the baffle portion, degrading sound quality,
wherein said baffle portion is approximately cone-shaped having a circular cross-section, and
wherein said air-permeable porous material of the baffle portion comprises an unwoven fabric of chemical fiber.
2. The headphone apparatus according to
a back housing portion formed to cover a back surface of the driver unit,
the back housing portion being formed of an air-permeable porous material such that external sound is prevented from being trapped interior to the back housing portion, degrading sound quality.
3. The headphone apparatus according to
4. The headphone apparatus according to
5. The headphone apparatus according to
6. The headphone apparatus according to
7. The headphone apparatus according to
8. The headphone apparatus according to
9. The headphone apparatus according to
10. The headphone apparatus according to
11. The headphone apparatus according to
12. The headphone apparatus according to
14. The headphone apparatus according to
15. The headphone apparatus according to
16. The headphone apparatus according to
17. The headphone apparatus according to
18. The headphone apparatus according to
a back housing portion formed to cover a back surface of the driver unit,
the back housing portion being formed of an air-permeable porous material such that external sound is prevented from being trapped interior to the back housing portion, degrading sound quality.
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The present invention relates to an improvement on a headphone apparatus, in which sound quality is improved, a feeling of pressure on an ear and a cooped-up feeling are alleviated, and a feeling of comfortableness is obtained when wearing the headphone apparatus.
A variety of headphone apparatuses of relatively high sound quality and of large size have been proposed; and typically, in order to generate an acoustic field space for naturally resonating in a back housing where a driver unit is housed, an headphone apparatus using a solid zelkova wood and the like are sold, however, the housing portion and ear pad portion thereof are large to cause an increase in weight.
In
A driver unit 5 is opposed to or fitted into a through-hole 4 made in the approximate center of this baffle board 1.
The driver unit 5 has a structure of an electrodynamic type in which a voice coil 5C fixed to a domed diaphragm 5A is driven between a magnet 5B and a concave yoke 5D, similarly to a typical loudspeaker.
A plurality of air ventilation holes 6A, 6B, . . . are made with the through-hole 4 made in the center of the baffle board 1; and a highly air-permeable ventilation member 9 made of sponge, unwoven fabric or the like is attached to each of the through-holes 6A and 6B.
A domed back housing 2 covers the back surface of the baffle board 1 and is integrated with the baffle board 1 to form a housing 3 as a baffle portion.
A ventilation hole 7 is made in the back surface (top) of the housing 2, and a ventilation member 9 is attached similarly to the ventilation holes 6 in the baffle board 1 to enhance the baffle effectiveness. Nonferrous metal, synthetic resin, solid zelkova that is a wooden material as described above or the like is selected for the back housing 2, and an acoustic field space is made large to improve sound quality.
On the front surface of the baffle board 1 is provided an ear pad 8 in which an approximately ring-shaped cushion member made of sponge or the like is surrounded by an outer skin 10 made of synthetic resin, leather, cloth, or the like.
In the headphone apparatus formed as described above, in order to secure the strength, in addition to the housing 3 a supporting member and the like which support a headband are formed of metal members and so the weight of the whole headphone apparatus becomes greater than is necessary.
When wearing such a large and heavy headphone apparatus on the head, there is a problem that heaviness and pressure are felt by the head and the ear, which intensifies a cooped-up feeling to cause an unpleasant wearing feeling.
Also, with a conventional structure, there is a problem that a typical cooped-up feeling of a headphone apparatus arises inevitably.
The present invention is made to eliminate the above problems and aims at obtaining a headphone apparatus in which an approximately cone-shaped air-permeable baffle portion having the baffle effectiveness is provided between a driver unit and an ear pad so as to remove a cooped-up feeling and to reduce resonance sharpness with obtaining light weight.
A second problem is dark noise originated from outside sound and the present invention is made to solve the problem and aims at obtaining a headphone apparatus in which a housing that houses a driver unit is formed of an air-permeable lightweight member to prevent outside sound from being dark noise (not to be muffled).
Hereinafter, an embodiment of the present invention will be described in detail with reference to
Regarding
In the left and right headphone units 13L and 13R is included a driver unit, and the driver units are held in left and right frames 14L and 14R, each of which includes a bridge portion 14B made of a lightweight metal member such as titanium alloy or magnesium alloy formed like a bridge in a rim 14A; and the headphone band 12 includes approximately U-shaped left and right band adjustment portions 16L and 16R fixed to approximately semicircular left and right pendent frames 15L and 15R pivotably attached to the left and right frames 14L and 14R. Inside the left and right frames 14L and 14R are provided ear pads 27.
In
Hereinafter, the left and right headphone units 13L and 13R of the present invention will be explained using
In
In frames 14 (14L and 14R), an arched bridge 14B is formed like a bridge to an annular-shaped rim 14A as shown in
Behind the driver unit 20 is formed an approximately cap-like back housing 19 for maintaining a predetermined space between the driver unit and the baffle board 21. The back housing 19 is locked by a through-hole 14D made in the bridge 14B of the frame 14.
Between the bridge 14B of the frame 14 and the rim 14A of the frame 14 is provided a baffle portion 17 which is cone-shaped similarly to a diaphragm of a loudspeaker.
An ear pad 27 in which a cushion material 28 made of expandable synthetic resin, sponge or the like and covered with an outer skin 29 made of soft cloth, leather or the like has been formed into a ring shape and in a front-rear asymmetrical manner (in a horizontally asymmetrical manner in
The baffle portion 17 provided between the bridge 14B and the rim 14A of the frame 14 as shown in
An upper opening portion 17A of the cone-shaped baffle portion 17 shown in
Other methods of forming the above-described baffle portion 17 and back housing 19 are explained referring to
The structure shown in
In the above described composite sheets, cloth-cloth and pulp-cloth are used as combinations between first and second layers, however, pulp-pulp, cloth-pulp combinations and the like can be used as the first and second layers to stabilize the shapes of the baffle portion 17 and the back housing 19.
According to the above-described structures of the back housing 19 and the baffle portion 17, since sound entered from the outside permeates into a space between the baffle board 21 and the back housing 19 where the driver unit 20 is housed without being shut out, sound from the outside can be prevented from being trapped inside the housing, such that clear sound which is not muffled can be emitted.
Further, the baffle portion 17 is made into a predetermined cone shape so that low sound is concentrated in the earhole, and characteristics in the low range can be set as desired by allowing air in the space surrounded by the baffle portion 17 to permeate from the outside to inside and from the inside to outside, which greatly improves low-range frequency characteristics together with the bass lens effectiveness to thereby obtain a headphone apparatus in which weight is reduced not to cause a feeling of heaviness and a feeling of pressure due to lateral pressure on the ear, when being worn on the ear.
The present invention can be applied to a headset in which a microphone 40 is added to the above-described headphone apparatus, as shown in
According to the present invention, a headphone apparatus and a microphone-attached headphone apparatus in which the baffle effectiveness can further be enhanced by means of the bass lens effectiveness are obtained by providing driver units at positions away from the positions of both ears.
Patent | Priority | Assignee | Title |
10306345, | May 13 2015 | VIE STYLE, INC | Headphone |
10771886, | Jan 11 2019 | EVGA CORPORATION | Headphone structure for extending and enhancing resonance |
8734602, | Jun 14 2010 | Tsinghua University; Hon Hai Precision Industry Co., Ltd. | Magnesium based composite material and method for making the same |
8903115, | Jun 14 2010 | Tsinghua University; Hon Hai Precision Industry Co., Ltd. | Enclosure and acoustic device using the same |
Patent | Priority | Assignee | Title |
2468721, | |||
3112005, | |||
3220505, | |||
4041256, | May 06 1975 | Victor Company of Japan, Limited | Open-back type headphone with a detachable attachment |
4058688, | May 27 1975 | Matsushita Electric Industrial Co., Ltd. | Headphone |
4097689, | Aug 19 1975 | Matsushita Electric Industrial Co., Ltd. | Out-of-head localization headphone listening device |
4278852, | Aug 31 1977 | AKG Akustische u. Kino-Gertate Gesellschaft m.b.H. | Earphone construction |
4338489, | Feb 12 1979 | AKG Akustische u. Kino-Gerate Gesellschaft m.b.H. | Headphone construction |
4654898, | Oct 11 1985 | Removable ear muff for headphones | |
4922542, | Dec 28 1987 | Bose Corporation | Headphone comfort |
6466681, | Sep 21 1999 | Comprehensive Technical Solutions, Inc.; COMPREHENSIVE TECHNICAL SOLUTIIONS INC | Weather resistant sound attenuating modular communications headset |
6856690, | Jan 09 2002 | Plantronis, Inc. | Comfortable earphone cushions |
7311957, | Sep 13 2002 | CTA Acoustics, Inc. | Sound absorbing material and process for making |
7466838, | Dec 10 2003 | William T., Moseley | Electroacoustic devices with noise-reducing capability |
20030134553, | |||
JP1032892, | |||
JP11331972, | |||
JP200432645, | |||
JP536991, |
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Dec 14 2005 | TSUNODA, NAOTAKA | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 017820 | /0807 |
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