A backlight module, an application and a fabrication method thereof are described. The backlight module comprises: a light guide plate; a housing clipped to the light guide plate, wherein the housing and the light guide plate form a disposed space; and at least one light-emitting diode (LED) light bar disposed in the disposed space and providing the light guide plate with at least one light, wherein the light-emitting diode light bar comprises a flexible circuit board and a plurality of light-emitting diodes, and the flexible circuit board comprises a first portion and at least two second portions, wherein the light-emitting diodes are disposed on the first portion of the flexible circuit board, and the second portions are stacked with respect to each other.
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1. A backlight module, comprising:
a light guide plate;
a housing clipped to the light guide plate, wherein the housing and the light guide plate form a disposed space; and
at least one light-emitting diode light bar disposed in the disposed space and providing the light guide plate with at least one light, wherein the light-emitting diode light bar comprises a flexible circuit board and a plurality of light-emitting diodes, and the flexible circuit board comprises a first portion and at least two second portions, wherein the light-emitting diodes are disposed on the first portion of the flexible circuit board, and the second portions are stacked with respect to each other.
8. A backlight module, comprising:
a light guide plate;
a housing clipped to the light guide plate, wherein the housing and the light guide plate form a disposed space; and
at least one light-emitting diode light bar disposed in the disposed space and providing the light guide plate with at least one light, wherein the light-emitting diode light bar comprises a flexible circuit board and a plurality of light-emitting diodes, the flexible circuit board comprises a first region and a second region, and the light-emitting diodes are disposed on the first region, wherein a thickness of a structure of the flexible circuit board in the second region is greater than a thickness of a structure of the flexible circuit board in the first region.
15. A liquid crystal display, comprising:
a liquid crystal display panel; and
a backlight module disposed on a rear side of the liquid crystal display panel, wherein the backlight module comprises:
a light guide plate;
a housing clipped to the light guide plate, wherein the housing and the light guide plate form a disposed space; and
at least one light-emitting diode light bar disposed in the disposed space and providing the light guide plate with at least one light, wherein the light-emitting diode light bar comprises a flexible circuit board and a plurality of light-emitting diodes, and the flexible circuit board comprises a first portion and at least two second portions, wherein the light-emitting diodes are disposed on the first portion of the flexible circuit board, and the second portions are stacked with respect to each other.
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The present application is based on, and claims priority from, Taiwanese Application Serial Number 97112195, filed Apr. 3, 2008, the disclosure of which is hereby incorporated by reference herein in its entirety.
One or more embodiments of the present invention relate to a backlight module, and more particularly to a backlight module including a light-emitting diode (LED) light bar and an application thereof on a liquid crystal display (LCD).
A backlight module of a large extra-thin or a high brightness extra-thin liquid crystal display needs a large amount of light-emitting diodes resulting in a larger wiring area being required for arranging the wires of the light-emitting diodes. Currently, the wiring area of the flexible circuit board of the light-emitting diode light bar is increased typically by increasing the width of the flexible circuit board or by using a multi-layered flexible circuit board.
In the backlight module 100a, the width w of the flexible circuit board 108 is sufficiently large to enable stacking the light guide plate 110 on a portion of the flexible circuit board 108. The flexible circuit board 108 has a thickness d, so that the thickness of the backlight module 100a is increased, therefore it cannot fulfill the requirement for the liquid crystal display product, which has a strict requirement of thickness.
One or more embodiments of the present invention provides a backlight module, comprising: a light guide plate; a housing clipped to the light guide plate, wherein the housing and the light guide plate form a disposed space; and at least one light-emitting diode light bar disposed in the disposed space and providing the light guide plate with at least one light, wherein the light-emitting diode light bar comprises a flexible circuit board and a plurality of light-emitting diodes, and the flexible circuit board comprises a first portion and at least two second portions, wherein the light-emitting diodes are disposed on the first portion of the flexible circuit board, and the second portions are stacked with respect to each other.
One or more embodiments of the present invention also provides a liquid crystal display, comprising: a liquid crystal display panel; and a backlight module disposed on a rear side of the liquid crystal display panel, wherein the backlight module comprises: a light guide plate; a housing clipped to the light guide plate, wherein the housing and the light guide plate form a disposed space; and at least one light-emitting diode light bar disposed in the disposed space and providing the light guide plate with at least one light, wherein the light-emitting diode light bar comprises a flexible circuit board and a plurality of light-emitting diodes, and the flexible circuit board comprises a first portion and at least two second portions, wherein the light-emitting diodes are disposed on the first portion of the flexible circuit board, and the second portions are stacked with respect to each other.
One or more embodiments of the present invention further provides a fabrication method of a backlight module, comprising: providing a housing; providing at least one light-emitting diode light bar, wherein the light-emitting diode light bar comprises a flexible circuit board and a plurality of light-emitting diodes, and the flexible circuit board comprises a first portion and at least two second portions; folding up the second portions of the flexible circuit board; disposing the folded light-emitting diode light bar in the housing; and disposing a light guide plate to make the housing clip the light guide plate and form a disposed space with the light guide plate, wherein the light-emitting diode light bar is disposed in the disposed space and provides the light guide plate with at least one light.
One or more embodiments of the present invention further provides a fabrication method of a liquid crystal display, comprising: fabricating a backlight module, comprising: providing a housing; providing at least one light-emitting diode light bar, wherein the light-emitting diode light bar comprises a flexible circuit board and a plurality of light-emitting diodes, and the flexible circuit board comprises a first portion and at least two second portions; folding up the second portions of the flexible circuit board; disposing the folded light-emitting diode light bar in the housing; and disposing a light guide plate to make the housing clip the light guide plate and form a disposed space with the light guide plate, wherein the light-emitting diode light bar is disposed in the disposed space and provides the light guide plate with at least one light; and disposing a liquid crystal display panel on the backlight module.
One or more embodiments are illustrated by way of example, and not by limitation, in the figures of the accompanying drawings, wherein elements having the same reference numeral designations represent like elements throughout and wherein:
In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, that the present invention may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.
One or more embodiments of the present invention disclose a backlight module, an application and a fabrication method thereof. In order to make the illustration of the present invention more explicit, the following description is stated with reference to
In the present exemplary embodiment, the backlight module 204a mainly comprises a housing 212, a light guide plate 214 and at least one light-emitting diode light bar 224a. In accordance with at least one embodiment, housing 212 is composed of a plastic material or a metal with high reflectivity, such as a white plastic material. The housing 212 comprises side plates 206, 208 and 210 connected in sequence, wherein a cross-sectional structure of the combination of the side plates 206, 208 and 210 is substantially a U-shaped structure, and the side plate 206 is positioned opposite to the side plate 210. In at least some embodiments, the light guide plate 214 is clipped between the opposite side plates 206 and 210 of the housing 212, and a side surface 228 of the light guide plate 214 is separated from the side plate 208 of the housing 212 by a distance w′, so that a disposed space 234 is defined by the light guide plate 214 and the housing 212. A light-emitting diode light bar 224a is disposed in the disposed space 234 and is located between the side surface 228 of the light guide plate 214 and the side plate 208 of the housing 212, wherein the light-emitting diode light bar 224a can provide at least one light that enters the light guide plate 214 through the side surface 228. In at least some embodiments, the light-emitting diode light bar 224a is wholly or entirely disposed in the disposed space 234. The light-emitting diode light bar 224a is mainly composed of a flexible circuit board 220a and a plurality of light-emitting diodes 222, wherein the light-emitting diodes 222 are disposed on a surface of the flexible circuit board 220a.
In the light-emitting diode light bar 224a of the present exemplary embodiment, the flexible circuit board 220a comprises a first portion 216 and two second portions 218, wherein the light-emitting diodes 222 are disposed on the first portion 216, so that the first portion 216 of the flexible circuit board 220a is also referred to as a light source fixed region. The two second portions 218 of the flexible circuit board 220a are stacked with respect to each other to form a two-layered stack structure, thereby also being referred to as a stack region. Therefore, the flexible circuit board 220a comprises two regions, i.e. the light source fixed region formed by the first portion 216 and a stack region formed by the two second portions 218 stacked atop each other. In one embodiment, the second portions 218 of the flexible circuit board 220a may only be stacked together but not adhered to each other. In other embodiments, the second portions 218 may be adhered to each other by at least one adhesive layer (not shown). In at least some embodiments, first portion 216 and each second portion 218 of the flexible circuit board 220a substantially have the same thickness, and the stack region of the flexible circuit board 220a is formed by the two stacked second portions 218, so that the entire thickness of the stack region of the flexible circuit board 220a is larger than the entire thickness of the light source fixed region of the flexible circuit board 220a. In one embodiment, the flexible circuit board 220a may comprise more than two second portions 218, and the second portions 218 are stacked with respect to each other to form a structure composed of more than two layers.
When the liquid crystal display 200a is fabricated, the backlight module 204a and the liquid crystal display panel 202 may be firstly provided, and the liquid crystal display panel 202 is disposed on the backlight module 204a. Before the backlight module 204a is provided, the backlight module 204a is fabricated, wherein the housing 212 is firstly provided, at least one light-emitting diode light bar 224a is provided, and the flexible circuit board 220a of the light-emitting diode light bar 224a is bent at 180 degrees to stack the second portions 218. Then, the folded light-emitting diode light bar 224a is disposed in a space formed by the side plates 206, 208 and 210 of the housing 212, and the light guide plate 214 is disposed on the side plate 210 of the housing 212 and is clipped between the side plates 210 and 206 of the housing 212 to dispose the light-emitting diode light bar 224a in the disposed space 234 between the side surface 228 of the light guide plate 214 and the side plate 208 of the housing 212.
In the light-emitting diode light bar 224a of the present exemplary embodiment, the first portion 216 of the flexible circuit board 220a is located between the side surface 228 of the light guide plate 214 and the second portions 218 of the flexible circuit board 220a, so that the light source fixed region of the flexible circuit board 220a where the light-emitting diodes 222 are located is between the stack region and the side surface 228 of the light guide plate 214. In addition, the first portion 216 and the second portions 218 of the flexible circuit board 220a are all disposed on the side plate 210 of the housing 212, i.e. the light source fixed region and the stack region of the flexible circuit board 220a are all disposed on the side plate 210 of the housing 212.
In one or more embodiments according to the present invention, the light-emitting diode light bar of the backlight module may include various arrangements.
According to one or more of the aforementioned embodiments of the present invention, one advantage of at least some of the embodiments is that a non-light source fixed region of a flexible circuit board of a light-emitting diode light bar is folded up and the light-emitting diode light bar is packed in a housing to thereby increase the layout space of the flexible circuit board in a limited fabrication space and to lower the fabrication difficulty.
According to one or more of the aforementioned embodiments of the present invention, another advantage of at least some of the embodiments is that a sufficient wiring area is provided without affecting the heat dissipation of a light-emitting diode light bar, causing a light-masking problem or increasing the cost of a circuit board, so that the amount of light-emitting diodes is increased in comparison to prior approaches and to facilitate developing of a large liquid crystal display.
As is understood by a person skilled in the art, the foregoing embodiments of the present invention are illustrated examples of the present invention rather than limiting examples of embodiments of the present invention. Various modifications and similar arrangements are included within the spirit and scope of the appended claims, the scope of which should be accorded the broadest interpretation so as to encompass all such modifications and similar structure.
Lu, Chiyeh, Huang, Shihpin, Yang, Chengfeng
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