A method of manufacturing an electronic device includes forming a photosensitive sog oxide layer on a multi-layer ceramics substrate having a penetrating electrode, forming an opening by subjecting the photosensitive sog oxide layer to an exposure treatment and developing treatment so that an upper face of the penetrating electrode is exposed, and forming a passive element on the photosensitive sog oxide layer, the passive element being connected to the penetrating electrode through the opening.
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1. A method of manufacturing an electronic device comprising:
forming a photosensitive sog oxide layer on a multi-layer ceramics substrate made of metal oxide having a penetrating electrode, wherein a thickness of the photosensitive sog oxide layer is approximately 0.5 μm or larger;
forming an opening by subjecting the photosensitive sog oxide layer to an exposure treatment and a developing treatment so that an upper face of the penetrating electrode is exposed and the diameter of the opening is larger than that of the penetrating electrode; and
forming a passive element on the photosensitive sog oxide layer, wherein the passive element is connected to the penetrating electrode through the opening and includes a spiral-shaped coil.
2. The method as claimed in
3. The method as claimed in
forming another photosensitive sog oxide layer on a lower face of the multi-layer ceramics substrate; and
forming an opening in the another photosensitive sog oxide layer so that a lower face of the penetrating electrode is exposed.
4. The method as claimed in
forming a spiral-shaped first coil on the photosensitive sog oxide layer; and
forming a spiral-shaped second coil above the first coil across a space.
5. The method as claimed in
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This application is based upon and claims the benefit of priority of the prior Japanese Patent Application No. 2007-340037, filed on Dec. 28, 2007, the entire contents of which are incorporated herein by reference.
The present invention generally relates to a method of manufacturing an electronic device, and more particularly, to a method of manufacturing an electronic device where a passive element is provided on a multi-layer ceramics substrate.
An inductor or a capacitor is used for phase matching of a high-frequency circuit. For example, there are demands for downsizing a RF (Radio Frequency) system such as a cellular phone or a wireless LAN (Local Area Network), reducing cost of the RF system, and enhancing performance of the RF system. For the same reason, downsizing, cost reduction and high performance are requested for a device mounted on the RF system. There is used an electronic device such as an integrated passive element in which a passive element is integrated.
There has been developed an integrated passive element in which a passive element is incorporated in a multi-layer ceramics substrate, with a LTCC (Low Temperature Co-filed Ceramics) technology as a method of satisfying the demands. There has been developed an integrated passive element in which a passive element is provided on a multi-layer ceramics substrate. There is, however, a problem that Q value of an inductor is reduced and a passive element having high Q value cannot be manufactured because relative permittivity of the ceramics substrate is higher than a quartz substrate.
Japanese Patent Application Publication No. 2007-123468 and Japanese Patent Application Publication No. 2007-31242 disclose an art where a coating layer is provided on a ceramics substrate and a passive element is provided on the coating layer.
A passive element such as an inductor is formed on an insulating layer having relative permittivity lower than that of a multi-layer ceramics substrate when the passive element is formed on the multi-layer ceramics substrate. This results in restraint of dielectric loss of the passive element. It is not preferable that a resin-based insulating layer such as PBO (Polybenzoxazole) or BCB (Benzocyclobutene) having low thermal resistance is used, because temperature of the multi-layer ceramics substrate is increased to a range of 200 degrees C to 300 degrees C in a manufacturing process of the passive element. It is preferable that an oxide layer having high thermal resistance is used. An opening is formed in the oxide layer in order to electrically couple a penetrating electrode and a passive element. Generally, the opening is formed in the oxide layer with a dry etching method using fluorine-based gas (for example HF, CF4 or the like) or a wet etching method using a solution including hydrogen fluoride. There is, however, a problem that etching speed of the dry etching method is low. And there is a problem that ceramics of the multi-layer ceramics substrate dissolves as well as the oxide layer when an etchant including fluorine or hydrogen fluoride is used in the wet etching method. It is preferable that the oxide layer is thick for the purpose of reducing dielectric loss of the passive element. However, etching time of the dry etching method is increased when the oxide layer is thick. On the other hand, the multi-layer ceramics substrate tends to dissolve because of side etching in the wet etching method.
The present invention has been made in view of the above circumstances and provides a method of manufacturing an electronic device including forming a passive element on a multi-layer ceramics substrate having a penetrating electrode, in which dissolution of the multi-layer ceramics substrate is restrained during the formation of an opening in an insulating layer and the multi-layer ceramics substrate is spaced from the passive element.
According to an aspect of the present invention, there is provided a method of manufacturing an electronic device including forming a photosensitive SOG oxide layer on a multi-layer ceramics substrate having a penetrating electrode, forming an opening by subjecting the photosensitive SOG oxide layer to an exposure treatment and developing treatment so that an upper face of the penetrating electrode is exposed, and forming a passive element on the photosensitive SOG oxide layer, the passive element being connected to the penetrating electrode through the opening. With the method, it is possible to restrain dissolution of the multi-layer ceramics substrate in a forming process of an opening with an etching method, because the opening is formed in the photosensitive SOG oxide layer with exposure and development.
In order to facilitate better understanding of the present invention, a description will now be given of related art.
A description will be given of a method of manufacturing a multi-layer ceramics substrate with reference to
As illustrated in
A description will be given of a method of manufacturing an integrated passive element in accordance with a first embodiment, with reference to
As illustrated in
As illustrated in
As illustrated in
As illustrated in
As illustrated in
As illustrated in
As illustrated in
In accordance with the first embodiment, the photosensitive SOG oxide layer 26 is formed on the multi-layer ceramics substrate 20, as illustrated in
It is not necessary to form an opening with an etchant including fluorine or hydrogen fluoride if the photosensitive SOG oxide layer 26 is used. It is therefore possible to restrain dissolution of the multi-layer ceramics substrate 20 and the SOG oxide layer caused by the etchant including fluorine or hydrogen fluoride. It is preferable that the oxide layer is thick for the purpose of restraining dielectric loss of the passive element. It is preferable that the thickness of oxide layer is 0.5 μm or larger. It is possible to form the opening 25 easily in the thick oxide layer without the dissolution of the multi-layer ceramics substrate 20. A relative permittivity of the SOG oxide layer is approximately 2.5 to 4. A relative permittivity of the multi-layer ceramics substrate 20 is approximately 7 to 12. It is therefore possible to reduce the loss of the passive element.
The upper face of the multi-layer ceramics substrate 20 may dissolve because of the etchant used for the etching of the oxide layer when etching is performed in the forming process of the opening 25, if the multi-layer ceramics substrate 20 is made of metal oxide. It is therefore preferable that the photosensitive SOG oxide layer 26 is used as the oxide layer formed on the multi-layer ceramics substrate 20.
An inductor is affected by dielectric loss more, if the passive element is an inductor. It is effective that an oxide layer is formed on the multi-layer ceramics substrate 20, if the passive element is an inductor.
A photosensitive SOG oxide layer 28 may be formed on the lower face of the multi-layer ceramics substrate 20, and an opening 27 may be formed in the photosensitive SOG oxide layer 28 so that the lower face of the penetrating electrode 12 is exposed, as illustrated in
A second embodiment is an example including an inductor having two coils that are stacked each other and are spaced from each other.
An inner end of the first coil 121 and an inner end of the second coil 122 are electrically coupled to each other via a connection portion 175. An outer end of the first coil 121 is connected to an interconnection 154. An outer end of the second coil 122 is coupled to an interconnection 153 via a connection portion 170. The interconnections 151 through 154 are formed on the photosensitive SOG oxide layer 26 on the multi-layer ceramics substrate 20, and are connected to connection terminals 131 through 134. The connection terminal 132 and the connection terminal 133 are coupled to each other via an interconnection 157. A capacitor 140 composed of a lower electrode 141, a dielectric layer 142 and an upper electrode 143 is connected between the connection terminal 131 and the terminal 134. The upper electrode 143 is coupled to the interconnection 151 via an interconnection 156. An integrated passive element 100 forms a π type L-C-L circuit between the connection terminal 131 and the connection terminal 134, when the connection terminal 131 acts as an input terminal, the connection terminal 134 acts as an output terminal, and the connection terminals 132 and 133 are grounded.
Next, a description will be given of a method of manufacturing the integrated passive element in accordance with the second embodiment with reference to
As illustrated in
As illustrated in
As illustrated in
As illustrated in
As illustrated in
A description will be given of a mounting method of the chip 199 with reference to
The present invention may be implied to an integrated passive element having an inductor that has the spiral-shaped first coils 111 and 121 provided on the photosensitive SOG oxide layer 26 and the spiral-shaped second coils 112 and 122 spaced from and above the first coils 111 and 121.
The present invention is not limited to the specifically disclosed embodiments, but variations and modifications may be made without departing from the scope of the present invention.
Yokoyama, Tsuyoshi, Mi, Xiaoyu, Takahashi, Takeo, Ueda, Satoshi
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